Means for controlling the bonding environment

Industry

CPC
H01L2224/761

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/761Means for controlling the bonding environment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical interconnection of circuit elements on a substrate witho...
- Patent number 11,881,466
- Issue date Jan 23, 2024
- Orbotech Ltd.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrically conductive connection on a sub...
- Patent number 11,855,037
- Issue date Dec 26, 2023
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,626,295
- Issue date Apr 11, 2023
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 11,122,683
- Issue date Sep 14, 2021
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of applying conductive adhesive and manufacturing device usi...
- Patent number 11,018,028
- Issue date May 25, 2021
- Epistar Corporation
- Min-Hsun Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed three-dimensional (3D) functional part and method of making
- Patent number 10,462,907
- Issue date Oct 29, 2019
- President and Fellows of Harvard College
- Jennifer A. Lewis
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Interconnection structures and methods for transfer-printed integra...
- Patent number 10,418,331
- Issue date Sep 17, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser assisted transfer welding process
- Patent number 10,181,483
- Issue date Jan 15, 2019
- Etienne Menard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bare die integration with printed components on flexible substrate...
- Patent number 10,165,677
- Issue date Dec 25, 2018
- Palo Alto Research Center Incorporated
- Ping Mei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Laminate electronic device
- Patent number 10,020,245
- Issue date Jul 10, 2018
- Infineon Technologies AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for measuring analytes using large scale FET...
- Patent number 9,951,382
- Issue date Apr 24, 2018
- Life Technologies Corporation
- Jonathan M. Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Interconnection structures and methods for transfer-printed integra...
- Patent number 9,899,329
- Issue date Feb 20, 2018
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,847,324
- Issue date Dec 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,768,155
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector between die pad and z-interconnect for stacked...
- Patent number 9,508,689
- Issue date Nov 29, 2016
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective die electrical insulation by additive process
- Patent number 9,490,230
- Issue date Nov 8, 2016
- Invensas Corporation
- Jeffrey S. Leal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing semiconductor dev...
- Patent number 9,455,161
- Issue date Sep 27, 2016
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFID tags and processes for producing RFID tags
- Patent number 9,418,328
- Issue date Aug 16, 2016
- Ruizhang Technology Limited Company
- Glenn W. Gengel
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Optoelectronic component and method for producing an opto-electroni...
- Patent number 9,419,193
- Issue date Aug 16, 2016
- Osram Opto Semiconductors GmbH
- Bernd Barchmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,391,003
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor package with conductive clip and related method
- Patent number 9,391,004
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for assembling electric components on a flexib...
- Patent number 9,338,894
- Issue date May 10, 2016
- Nederlandse Organisatie voor Toegepast-Natuurwetenschappelijk Onderzoek TNO
- Jeroen Van Den Brand
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a fan-out WLP with package
- Patent number 9,337,165
- Issue date May 10, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System support for electronic components and method for production...
- Patent number 9,331,010
- Issue date May 3, 2016
- EPCOS AG
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support mounted electrically interconnected die assembly
- Patent number 9,305,862
- Issue date Apr 5, 2016
- Invensas Corporation
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 9,281,235
- Issue date Mar 8, 2016
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220102604
- Publication date Mar 31, 2022
- SAMSUNG DISPLAY CO., LTD.
- Young Rag DO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...
- Publication number 20210358880
- Publication date Nov 18, 2021
- Karlsruher Institut für Technologie
- Uwe Bog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Interconnection Of Circuit Elements On A Substrate Witho...
- Publication number 20210028141
- Publication date Jan 28, 2021
- ORBOTECH LTD.
- Michael Zenou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...
- Publication number 20190124757
- Publication date Apr 25, 2019
- Palo Alto Research Center Incorporated
- Tse Nga Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20180334708
- Publication date Nov 22, 2018
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...
- Publication number 20180130751
- Publication date May 10, 2018
- X-Celeprint Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...
- Publication number 20140327356
- Publication date Nov 6, 2014
- NITTO DENKO CORPORATION
- Takahiro Nakai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE INK FOR FILLING VIAS
- Publication number 20140138846
- Publication date May 22, 2014
- NTHDEGREE TECHNOLOGIES WORLDWIDE INC.
- Richard A. Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly with Three Dimensional Inkjet Printed Traces
- Publication number 20140127856
- Publication date May 8, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE
- Publication number 20140123486
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jin-Soo Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...
- Publication number 20140069697
- Publication date Mar 13, 2014
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETEN
- Jeroen Van Den Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Assembly With Three Dimensional Inkjet Printed Traces
- Publication number 20140054795
- Publication date Feb 27, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew David Romig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device with a Carrier Havin...
- Publication number 20140021634
- Publication date Jan 23, 2014
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130338046
- Publication date Dec 19, 2013
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...
- Publication number 20130328213
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS
- Publication number 20130265134
- Publication date Oct 10, 2013
- Glenn W. Gengel
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130252382
- Publication date Sep 26, 2013
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130244379
- Publication date Sep 19, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Woojin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL
- Publication number 20130244908
- Publication date Sep 19, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
HIGH DENSITY SENSOR ARRAY WITHOUT WELLS
- Publication number 20130217587
- Publication date Aug 22, 2013
- Life Technologies Corporation
- Jonathan M. ROTHBERG
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...
- Publication number 20130210641
- Publication date Aug 15, 2013
- Life Technologies Corporation
- Jonathan Rothberg
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20130200528
- Publication date Aug 8, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS
- Publication number 20130153277
- Publication date Jun 20, 2013
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...
- Publication number 20130134573
- Publication date May 30, 2013
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support mounted electrically interconnected die assembly
- Publication number 20130099392
- Publication date Apr 25, 2013
- Vertical Circuits, Inc.
- Simon J. S. McElrea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20130020720
- Publication date Jan 24, 2013
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Means for controlling the bonding environment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical interconnection of circuit elements on a substrate witho...

Method for producing an electrically conductive connection on a sub...

Method of applying conductive adhesive and manufacturing device usi...

Bare die integration with printed components on flexible substrate...

Method for manufacturing perovskite solar cell module and perovskit...

Method of applying conductive adhesive and manufacturing device usi...

Semiconductor device and method of forming a vertical interconnect...

Printed three-dimensional (3D) functional part and method of making

Interconnection structures and methods for transfer-printed integra...

Method of manufacturing a semiconductor device

Laser assisted transfer welding process

Bare die integration with printed components on flexible substrate...

Laminate electronic device

Methods and apparatus for measuring analytes using large scale FET...

Interconnection structures and methods for transfer-printed integra...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor package with conductive clip

Semiconductor device and method of forming a vertical interconnect...

Electrical connector between die pad and z-interconnect for stacked...

Selective die electrical insulation by additive process

Semiconductor device and methods of manufacturing semiconductor dev...

RFID tags and processes for producing RFID tags

Optoelectronic component and method for producing an opto-electroni...

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

Method and apparatus for assembling electric components on a flexib...

Method for manufacturing a fan-out WLP with package

System support for electronic components and method for production...

Support mounted electrically interconnected die assembly

Semiconductor packages and methods of forming the same

Patents Applicationslast 30 patents

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

METHOD FOR PRODUCING AN ELECTRICALLY CONDUCTIVE CONNECTION ON A SUB...

Electrical Interconnection Of Circuit Elements On A Substrate Witho...

BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE...

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

INTERCONNECTION STRUCTURES AND METHODS FOR TRANSFER-PRINTED INTEGRA...

Semiconductor Device and Method of Forming a Vertical Interconnect...

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

WIRELESS ELECTRIC POWER SUPPLY TYPE LIGHT-EMITTING ELEMENT AND LIGH...

CONDUCTIVE INK FOR FILLING VIAS

Electronic Assembly with Three Dimensional Inkjet Printed Traces

METHOD OF PROCESSING CAVITY OF CORE SUBSTRATE

LAMINATE ELECTRONIC DEVICE

METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIB...

Electronic Assembly With Three Dimensional Inkjet Printed Traces

Method of Manufacturing a Semiconductor Device with a Carrier Havin...

MOUNT BOARD AND ELECTRONIC DEVICE

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

ELECTRONIC DEVICE INCLUDING A CARRIER AND A SEMICONDUCTOR CHIP ATTA...

RFID TAGS AND PROCESSES FOR PRODUCING RFID TAGS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CHEMICAL SENSOR ARRAY HAVING MULTIPLE SENSORS PER WELL

HIGH DENSITY SENSOR ARRAY WITHOUT WELLS

METHODS AND APPARATUS FOR MEASURING ANALYTES USING LARGE SCALE FET...

Semiconductor Device and Method of Forming a Vertical Interconnect...

ELECTRICALLY BONDED ARRAYS OF TRANSFER PRINTED ACTIVE COMPONENTS

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEV...

Support mounted electrically interconnected die assembly

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME