Molybdenum [Mo] as principal constituent

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CPC
H01L2224/1368

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1368Molybdenum [Mo] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,244,917
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,171,102
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,121,106
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 11,094,657
- Issue date Aug 17, 2021
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,790,252
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Company
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density package interconnects
- Patent number 10,658,279
- Issue date May 19, 2020
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alloy diffusion barrier layer
- Patent number 10,424,552
- Issue date Sep 24, 2019
- Texas Instruments Incorporated
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,403,590
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer pillar for reduced stress interconnect and method of mak...
- Patent number 10,396,051
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Virendra R. Jadhav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...
- Publication number 20240213198
- Publication date Jun 27, 2024
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
- Publication number 20240120305
- Publication date Apr 11, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...
- Publication number 20240006360
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...
- Publication number 20230044737
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Ren Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...
- Publication number 20220115348
- Publication date Apr 14, 2022
- Raytheon Company
- Sean F. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210134749
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200035633
- Publication date Jan 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20200020656
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326242
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190326243
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20190236964
- Publication date Aug 1, 2019
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...
- Publication number 20190157230
- Publication date May 23, 2019
- International Business Machines Corporation
- Virendra R. JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALLOY DIFFUSION BARRIER LAYER
- Publication number 20190088608
- Publication date Mar 21, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20180337155
- Publication date Nov 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Yang Lei
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum [Mo] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and manufacturing method thereof

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Solderless interconnection structure and method of forming same

Multilayer substrate

Industrial chip scale package for microelectronic device

Structures and methods for low temperature bonding using nanoparticles

Bump bond structure for enhanced electromigration performance

Mechanisms for forming post-passivation interconnect structure

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Integrated circuit package and method

Multilayer pillar for reduced stress interconnect and method of mak...

Solderless interconnection structure and method of forming same

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Tall and fine pitch interconnects

Semiconductor devices, methods of manufacture thereof, and packaged...

Flip-chip method

Bump bond structure for enhanced electromigration performance

High density package interconnects

Expanded head pillar for bump bonds

Semiconductor device with barrier layer

Structures and methods for low temperature bonding using nanoparticles

Alloy diffusion barrier layer

Multilayer pillar for reduced stress interconnect and method of mak...

Multilayer pillar for reduced stress interconnect and method of mak...

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Mechanisms for forming post-passivation interconnect structure

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

UNDER BUMP METALLIZATIONS, SOLDER COMPOSITIONS, AND STRUCTURES FOR...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS

SEMICONDUCTOR STRUCTURE HAVING COPPER PILLAR WITHIN SOLDER BUMP AND...

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...

Solderless Interconnection Structure and Method of Forming Same

Structures And Methods For Low Temperature Bonding Using Nanoparticles

Integrated Circuit Package and Method

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

EXPANDED HEAD PILLAR FOR BUMP BONDS

Structures And Methods For Low Temperature Bonding Using Nanoparticles

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

ALLOY DIFFUSION BARRIER LAYER

FLIP-CHIP METHOD

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

Solderless Interconnection Structure and Method of Forming Same

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

MULTILAYER PILLAR FOR REDUCED STRESS INTERCONNECT AND METHOD OF MAK...

ALLOY DIFFUSION BARRIER LAYER

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

TALL AND FINE PITCH INTERCONNECTS

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...