of a plurality of wire connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/46of a plurality of wire connectors

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Ultra-thin embedded semiconductor device package and method of manu...
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Keiji Okumura
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Information Patent Grant
Conductor design for integrated magnetic devices
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Information Patent Grant
Die stack with cascade and vertical connections
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Information Patent Grant
Semiconductor device comprising PN junction diode and schottky barr...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor device
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Information Patent Grant
Semiconductor chips and semiconductor packages including the same
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Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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Information Patent Grant
Embedded wire bond wires
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Information Patent Grant
Semiconductor device comprising PN junction diode and schottky barr...
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- Issue date Sep 11, 2018
- Rohm Co., Ltd.
- Keiji Okumura
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Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
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Information Patent Grant
Semiconductor device comprising PN junction diode and schottky barr...
- Patent number 9,917,074
- Issue date Mar 13, 2018
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- Keiji Okumura
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Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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- Keiji Okumura
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Information Patent Grant
Electronic circuit comprising PN junction and schottky barrier diodes
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- Keiji Okumura
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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
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Information Patent Application
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- Publication number 20240395763
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- NANYA TECHNOLOGY CORPORATION
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Information Patent Application
MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS
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- SK HYNIX INC.
- Dong Sop LEE
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Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321655
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- Fuji Electric Co., Ltd.
- Shuangching CHEN
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- ROHM CO., LTD.
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SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...
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- ROHM CO., LTD.
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- Samsung Electronics Co., Ltd.
- Bongju CHO
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- Publication number 20230411340
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- Western Digital Technologies, Inc.
- Lee Kong Yu
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SEMICONDUCTOR DEVICE
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- RENESAS ELECTRONICS CORPORATION
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SEMICONDUCTOR STRUCTURE
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- CHANGXIN MEMORY TECHNOLOGIES, INC
- Miaomiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20230025045
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- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
- Publication number 20220052015
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- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
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- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
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SEMICONDUCTOR DEVICE
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SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
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- Rohm Co., Ltd.
- Keiji Okumura
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SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
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- Mitsubishi Electric Corporation
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ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
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- GENERAL ELECTRIC COMPANY
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COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
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- Rosenberger Hochfrequenztechnik GmbH & Co. KG
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SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...
- Publication number 20170263590
- Publication date Sep 14, 2017
- Rohm Co., Ltd.
- Keiji Okumura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
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COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
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- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement comprising a semiconductor element, a sub...

Die stack with cascade and vertical connections

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device

Semiconductor device

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Conductor design for integrated magnetic devices

Die stack with cascade and vertical connections

Semiconductor device comprising PN junction diode and schottky barr...

Semiconductor device

Semiconductor integrated circuit device

Semiconductor device

Semiconductor chips and semiconductor packages including the same

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Embedded wire bond wires

Semiconductor device comprising PN junction diode and schottky barr...

Coated bond wires for die packages and methods of manufacturing sai...

Semiconductor device comprising PN junction diode and schottky barr...

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Electronic circuit comprising PN junction and schottky barrier diodes

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...

SEMICONDUCTOR STRUCTURE AND METHOD FOR ARRANGING REDISTRIBUTION LAY...

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

SEMICONDUCTOR DEVICE

WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...