of a plurality of wire connectors

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H01L2224/46

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/46of a plurality of wire connectors

Industries

Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
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Conductor design for integrated magnetic devices
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Semiconductor device comprising PN junction diode and schottky barr...
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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Information Patent Grant
Embedded wire bond wires
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Information Patent Grant
Semiconductor device comprising PN junction diode and schottky barr...
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- Rohm Co., Ltd.
- Keiji Okumura
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Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
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- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and schottky barr...
- Patent number 9,917,074
- Issue date Mar 13, 2018
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- Keiji Okumura
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Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
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Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
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Information Patent Grant
Electronic circuit comprising PN junction and schottky barrier diodes
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Patents Applicationslast 30 patents

Information Patent Application
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- SIEMENS AKTIENGESELLSCHAFT
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- Publication date Aug 1, 2024
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
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- Western Digital Technologies, Inc.
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- CHANGXIN MEMORY TECHNOLOGIES, INC
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ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
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- GENERAL ELECTRIC COMPANY
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- Toru ICHIMURA
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- Rohm Co., Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of wire connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor arrangement comprising a semiconductor element, a sub...

Die stack with cascade and vertical connections

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor device

Semiconductor device

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Conductor design for integrated magnetic devices

Die stack with cascade and vertical connections

Semiconductor device comprising PN junction diode and schottky barr...

Semiconductor device

Semiconductor integrated circuit device

Semiconductor device

Semiconductor chips and semiconductor packages including the same

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Embedded wire bond wires

Semiconductor device comprising PN junction diode and schottky barr...

Coated bond wires for die packages and methods of manufacturing sai...

Semiconductor device comprising PN junction diode and schottky barr...

Ultra-thin embedded semiconductor device package and method of manu...

Semiconductor device comprising PN junction diode and Schottky barr...

Electronic circuit comprising PN junction and schottky barrier diodes

Patents Applicationslast 30 patents

MEMORY SYSTEM INCLUDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR EQUIPMENT

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES

SEMICONDUCTOR DEVICE

WIREBOND INTERCONNECT STRUCTURES FOR STACKED DIE PACKAGES

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

SEMICONDUCTOR DEVICE COMPRISING PN JUNCTION DIODE AND SCHOTTKY BARR...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

ELECTRONIC CIRCUIT

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

ELECTRONIC CIRCUIT