of bonding interfaces

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H01L2224/1607

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1607of bonding interfaces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of an electronic apparatus
- Patent number 12,191,277
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Ming-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,166,161
- Issue date Dec 10, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,929,316
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,646,260
- Issue date May 9, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated mechanical aids for high accuracy alignable-electrical c...
- Patent number 11,562,984
- Issue date Jan 24, 2023
- HRL Laboratories, LLC
- Peter Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using nanoporous metal locking structures
- Patent number 11,469,199
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for attaching an integrated circuit package to a...
- Patent number 11,322,367
- Issue date May 3, 2022
- Juniper Networks, Inc.
- Peng Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated circuit (3DIC) structure
- Patent number 11,239,201
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,089,685
- Issue date Aug 10, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,063,015
- Issue date Jul 13, 2021
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,833,049
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,548,221
- Issue date Jan 28, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor detector, methods for manufa...
- Patent number 10,468,365
- Issue date Nov 5, 2019
- SHIMADZU CORPORATION
- Hiroyuki Kishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 10,206,285
- Issue date Feb 12, 2019
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrical coupling and electric coupling arrangement
- Patent number 10,170,445
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable via package and method
- Patent number 10,034,372
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-lead flip chip interconnection
- Patent number 9,922,915
- Issue date Mar 20, 2018
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method
- Patent number 9,779,969
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Guo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240297134
- Publication date Sep 5, 2024
- Skyworks Solutions, Inc.
- Suresh Babu Yeruva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
- Publication number 20240170351
- Publication date May 23, 2024
- Intel Corporation
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
- Publication number 20240079358
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Siva Sai Kishore Palli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20240038947
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qiang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20230230962
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE
- Publication number 20220157785
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20220117087
- Publication date Apr 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...
- Publication number 20220115348
- Publication date Apr 14, 2022
- Raytheon Company
- Sean F. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059444
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- JONGYOUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20210098402
- Publication date Apr 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20200337152
- Publication date Oct 22, 2020
- Amkor Technology, Inc.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20190237420
- Publication date Aug 1, 2019
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
- Publication number 20190088617
- Publication date Mar 21, 2019
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DETECTOR, METHODS FOR MANUFA...
- Publication number 20180331060
- Publication date Nov 15, 2018
- Shimadzu Corporation
- Hiroyuki KISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP DEVICE AND METHOD FOR PRODUCING A FLIP-CHIP DEVICE
- Publication number 20180315693
- Publication date Nov 1, 2018
- INFINEON TECHNOLOGIES AG
- Benedikt KINDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Strike Process for Bonding
- Publication number 20170194278
- Publication date Jul 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS
- Publication number 20170133350
- Publication date May 11, 2017
- Intel Corporation
- Shubhada H. Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20170033075
- Publication date Feb 2, 2017
- Advanced Semiconductor, Inc.
- Min-Fong SHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT
- Publication number 20160351529
- Publication date Dec 1, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20160240503
- Publication date Aug 18, 2016
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...
- Publication number 20160056118
- Publication date Feb 25, 2016
- Samsung Electronics Co., Ltd.
- Ju Heon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT, SEMICONDUCTOR-MOUNTED PRODUCT INCLUDING TH...
- Publication number 20160035688
- Publication date Feb 4, 2016
- YASUO FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS

of bonding interfaces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of an electronic apparatus

Display panel

Semiconductor package

Supporting backplane, manufacturing method therefor and backplane

Stackable via package and method

Semiconductor package and method of fabricating the same

Stackable via package and method

Connection arrangement, component carrier and method of forming a c...

Semiconductor package and method of fabricating the same

Integrated mechanical aids for high accuracy alignable-electrical c...

Interconnect using nanoporous metal locking structures

System and method for attaching an integrated circuit package to a...

3D integrated circuit (3DIC) structure

Stackable via package and method

Semiconductor device package and method of manufacturing the same

Method for electrical coupling and electric coupling arrangement

Bonded semiconductor package and related methods

Metallic interconnect, a method of manufacturing a metallic interco...

Stackable via package and method

Semiconductor device and semiconductor detector, methods for manufa...

Combing bump structure and manufacturing method thereof

Bonding electrode structure of flip-chip led chip and fabrication m...

Stackable via package and method

Method for electrical coupling and electric coupling arrangement

Combing bump structure and manufacturing method thereof

Multi-strike process for bonding packages and the packages thereof

Stackable via package and method

Bonding structure for semiconductor package and method of manufactu...

Bump-on-lead flip chip interconnection

Package structure and manufacturing method

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE

REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...

SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

DISPLAY PANEL

STACKABLE VIA PACKAGE AND METHOD

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE

STACKABLE VIA PACKAGE AND METHOD

3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

Connection Arrangement, Component Carrier and Method of Forming a C...

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

STACKABLE VIA PACKAGE AND METHOD

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DETECTOR, METHODS FOR MANUFA...

FLIP-CHIP DEVICE AND METHOD FOR PRODUCING A FLIP-CHIP DEVICE

Multi-Strike Process for Bonding

SYSTEMS AND METHODS FOR PACKAGE ON PACKAGE THROUGH MOLD INTERCONNECTS

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

METHOD FOR ELECTRICAL COUPLING AND ELECTRIC COUPLING ARRANGEMENT

BONDING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTIN...

SEMICONDUCTOR COMPONENT, SEMICONDUCTOR-MOUNTED PRODUCT INCLUDING TH...