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H01L2221/68331

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

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H01L2221/68331of passive members

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and elec...
- Patent number RE50134
- Issue date Sep 17, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Shogo Ono
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,080,681
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,074,101
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,009,277
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Dong Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,996,345
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 11,990,443
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,948,808
- Issue date Apr 2, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,435
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,923,207
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,823,887
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Care area based swath speed for throughput and sensitivity improvement
- Patent number 11,776,859
- Issue date Oct 3, 2023
- KLA Corporation
- Anuj Pandey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 11,749,626
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package utilizing molded interposer
- Patent number 11,710,693
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,705,411
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer test structures and methods
- Patent number 11,682,593
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzuan-Horng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution structures for semiconductor packages and methods of...
- Patent number 11,670,519
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,664,323
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through silicon vias
- Patent number 11,605,596
- Issue date Mar 14, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching ceramic phosphor plates on light-emitting devi...
- Patent number 11,563,141
- Issue date Jan 24, 2023
- Lumileds LLC
- April Schricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wafer-level active die and external di...
- Patent number 11,545,441
- Issue date Jan 3, 2023
- Intel Corporation
- Vipul Vijay Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 11,532,569
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jui-Pin Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packages with Si-substrate-free interposer and method forming same
- Patent number 11,527,465
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363517
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363587
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332032
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266246
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203856
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUO-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240194611
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20240112941
- Publication date Apr 4, 2024
- Masaaki TAKEKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES
- Publication number 20230386888
- Publication date Nov 30, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20230387058
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20230369259
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20230268196
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRICAL PACKAGE
- Publication number 20230106612
- Publication date Apr 6, 2023
- Advanced Semiconductor Engineering, Inc.
- Wen-Pin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230065884
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES
- Publication number 20230057384
- Publication date Feb 23, 2023
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230014450
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
- Publication number 20220375886
- Publication date Nov 24, 2022
- STATS ChipPAC Pte Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND METHOD FOR FIXING DIES
- Publication number 20220367232
- Publication date Nov 17, 2022
- SAULTECH TECHNOLOGY CO., LTD.
- YEN HAO LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220352050
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Dong Kyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336416
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220302011
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET
- Publication number 20220302010
- Publication date Sep 22, 2022
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM FOR BACK-GRINDING WAFER
- Publication number 20220285199
- Publication date Sep 8, 2022
- MING KUN TECHNOLOGIES CO., LTD.
- Kuo-Hsien Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220278034
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUO-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE
- Publication number 20220271012
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS
- Publication number 20220077071
- Publication date Mar 10, 2022
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Package and Method of Manufacture
- Publication number 20220052009
- Publication date Feb 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
- Publication number 20210327726
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS

of passive members

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of package

Semiconductor device and method of manufacturing the same, and elec...

Antenna in embedded wafer-level ball-grid array package

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Package structure and method of forming the same

Semiconductor package

Package structure and manufacturing method thereof

Semiconductor die package and method of manufacture

Package structure and method of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

LTHC as charging barrier in info package formation

Redistribution structures for semiconductor packages and methods of...

Semiconductor device encapsulated by molding material attached to r...

Package structure and method of fabricating the same

Care area based swath speed for throughput and sensitivity improvement

Integrated devices in semiconductor packages and methods of forming...

Wafer level package utilizing molded interposer

Chip package with antenna element

Interposer test structures and methods

System-in-package with double-sided molding

Redistribution structures for semiconductor packages and methods of...

Semiconductor package and method

Semiconductor device having through silicon vias

Method for attaching ceramic phosphor plates on light-emitting devi...

Semiconductor package having wafer-level active die and external di...

Method for manufacturing semiconductor package structure

Packages with Si-substrate-free interposer and method forming same

Patents Applicationslast 30 patents

METHOD OF FABRICATING PACKAGE STRUCTURE

METHOD OF FABRICATING PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

METHODS FOR MAKING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE

Integrated Devices in Semiconductor Packages and Methods of Forming...

Redistribution Structures for Semiconductor Packages and Methods of...

METHOD OF MANUFACTURING ELECTRICAL PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Antenna in Embedded Wafer-Level Ball-Grid Array Package

HYBRID BOND METHOD FOR FIXING DIES

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET

PROTECTIVE FILM FOR BACK-GRINDING WAFER

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE

SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS

Semiconductor Die Package and Method of Manufacture

Redistribution Structures for Semiconductor Packages and Methods of...