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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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H01L2221/68331
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,948,808
Issue date
Apr 2, 2024
Amkor Technology Singapore Holding Pte Ltd.
Dong Jin Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,942,408
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution structures for semiconductor packages and methods of...
Patent number
11,923,207
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,887,952
Issue date
Jan 30, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,823,887
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Care area based swath speed for throughput and sensitivity improvement
Patent number
11,776,859
Issue date
Oct 3, 2023
KLA Corporation
Anuj Pandey
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Integrated devices in semiconductor packages and methods of forming...
Patent number
11,749,626
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package utilizing molded interposer
Patent number
11,710,693
Issue date
Jul 25, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package with antenna element
Patent number
11,705,411
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer test structures and methods
Patent number
11,682,593
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Tzuan-Horng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
11,670,618
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution structures for semiconductor packages and methods of...
Patent number
11,670,519
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,664,323
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having through silicon vias
Patent number
11,605,596
Issue date
Mar 14, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for attaching ceramic phosphor plates on light-emitting devi...
Patent number
11,563,141
Issue date
Jan 24, 2023
Lumileds LLC
April Schricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having wafer-level active die and external di...
Patent number
11,545,441
Issue date
Jan 3, 2023
Intel Corporation
Vipul Vijay Mehta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor package structure
Patent number
11,532,569
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Jui-Pin Hung
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Packages with Si-substrate-free interposer and method forming same
Patent number
11,527,465
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages and methods of forming same
Patent number
11,527,418
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making semiconductor device package including conformal m...
Patent number
11,488,842
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna in embedded wafer-level ball-grid array package
Patent number
11,469,191
Issue date
Oct 11, 2022
STATS ChipPAC Pte. Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in InFO package formation
Patent number
11,437,361
Issue date
Sep 6, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating the same
Patent number
11,424,219
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wen-Wei Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device encapsulated by molding material attached to r...
Patent number
11,417,620
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,404,346
Issue date
Aug 2, 2022
Samsung Electronics Co., Ltd.
Dong Kyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package and manufacturing method thereof
Patent number
11,373,981
Issue date
Jun 28, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming an integrated SiP module...
Patent number
11,367,690
Issue date
Jun 21, 2022
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,342,255
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
Publication number
20240112941
Publication date
Apr 4, 2024
Masaaki TAKEKOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES
Publication number
20230386888
Publication date
Nov 30, 2023
STATS ChipPAC Pte Ltd.
GunHyuck LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE
Publication number
20230387058
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
Publication number
20230369259
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
Publication number
20230268196
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING ELECTRICAL PACKAGE
Publication number
20230106612
Publication date
Apr 6, 2023
Advanced Semiconductor Engineering, Inc.
Wen-Pin HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230065884
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CARRIER FOR ELECTRONIC SUBSTRATE TECHNOLOGIES
Publication number
20230057384
Publication date
Feb 23, 2023
Intel Corporation
Jeremy D. ECTON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20230014450
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jen-Jui Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
Publication number
20220375886
Publication date
Nov 24, 2022
STATS ChipPAC Pte Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BOND METHOD FOR FIXING DIES
Publication number
20220367232
Publication date
Nov 17, 2022
SAULTECH TECHNOLOGY CO., LTD.
YEN HAO LU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220352050
Publication date
Nov 3, 2022
Samsung Electronics Co., Ltd.
Dong Kyu KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20220336416
Publication date
Oct 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wen-Wei Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20220302011
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET
Publication number
20220302010
Publication date
Sep 22, 2022
DIDREW TECHNOLOGY (BVI) LIMITED
Minghao SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTIVE FILM FOR BACK-GRINDING WAFER
Publication number
20220285199
Publication date
Sep 8, 2022
MING KUN TECHNOLOGIES CO., LTD.
Kuo-Hsien Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220278034
Publication date
Sep 1, 2022
Taiwan Semiconductor Manufacturing company Ltd.
SHUO-MAO CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF PACKAGE
Publication number
20220271012
Publication date
Aug 25, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS
Publication number
20220077071
Publication date
Mar 10, 2022
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Package and Method of Manufacture
Publication number
20220052009
Publication date
Feb 17, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Kuan-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Structures for Semiconductor Packages and Methods of...
Publication number
20210327726
Publication date
Oct 21, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hsiang Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH SILICON VIAS AND METHOD OF MANU...
Publication number
20210257304
Publication date
Aug 19, 2021
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package Structure and Method of Forming the Same
Publication number
20210098434
Publication date
Apr 1, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsi-Kuei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER
Publication number
20210090985
Publication date
Mar 25, 2021
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method
Publication number
20210090906
Publication date
Mar 25, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...
Publication number
20210082826
Publication date
Mar 18, 2021
Intel Corporation
Vipul Vijay MEHTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20210066248
Publication date
Mar 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING SAME
Publication number
20210005464
Publication date
Jan 7, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20200411405
Publication date
Dec 31, 2020
Samsung Electronics Co., Ltd.
Dong Kyu KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna in Embedded Wafer-Level Ball-Grid Array Package
Publication number
20200219832
Publication date
Jul 9, 2020
STATS ChipPAC Pte Ltd.
Pandi Chelvam Marimuthu
H01 - BASIC ELECTRIC ELEMENTS