of the mounting surface

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CPC
H01L2224/75983

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75983of the mounting surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
Carrier for microelectronic assemblies having direct bonding
- Patent number 12,142,510
- Issue date Nov 12, 2024
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device and bonding method
- Patent number 11,594,511
- Issue date Feb 28, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Hung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus
- Patent number 11,164,843
- Issue date Nov 2, 2021
- Kioxia Corporation
- Hironobu Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage-compensated bonded structure including a support chip and a...
- Patent number 11,114,406
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Senaka Kanakamedala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and bonding tool
- Patent number 10,872,873
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for stacking devices in an integrated circuit...
- Patent number 10,515,838
- Issue date Dec 24, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond chuck, methods of bonding, and tool including bond chuck
- Patent number 9,754,813
- Issue date Sep 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding stage and method of manufacturing the same
- Patent number 9,679,866
- Issue date Jun 13, 2017
- Shinkawa Ltd.
- Shoji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for flip chip stacking
- Patent number 9,508,563
- Issue date Nov 29, 2016
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming 3DIC package
- Patent number 9,073,158
- Issue date Jul 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixture for shaping a laminate substrate
- Patent number 9,059,240
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig, manufacturing method thereof, and flip chip bonding method for...
- Patent number 8,975,096
- Issue date Mar 10, 2015
- Samsung Electronics Co., Ltd.
- Young Il Kim
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods for flip chip stacking
- Patent number 8,618,648
- Issue date Dec 31, 2013
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming 3DIC package
- Patent number 8,609,462
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a conformal chip carrier to a flip chip
- Patent number 6,524,888
- Issue date Feb 25, 2003
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixture for attaching a conformal chip carrier to a flip chip
- Patent number 6,337,509
- Issue date Jan 8, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3713575
- Patent number 3,713,575
- Issue date Jan 30, 1973
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS
- Publication number 20240258265
- Publication date Aug 1, 2024
- Mi Equipment Korea Co., Ltd
- Hyun Gu Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING
- Publication number 20230317676
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING
- Publication number 20230317675
- Publication date Oct 5, 2023
- Intel Corporation
- Michael Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD
- Publication number 20230197670
- Publication date Jun 22, 2023
- SHINKAWA LTD.
- ALEXANDER Dzhangirov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET
- Publication number 20220336281
- Publication date Oct 20, 2022
- Showa Denko Materials Co., Ltd.
- Tsuyoshi TAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20220328446
- Publication date Oct 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING
- Publication number 20220199450
- Publication date Jun 23, 2022
- Intel Corporation
- Shawna M. Liff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVALENTLY BONDED SEMICONDUCTOR INTERFACES
- Publication number 20210225803
- Publication date Jul 22, 2021
- G-ray Industries SA
- Hans VON KÄNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20210082863
- Publication date Mar 18, 2021
- Kioxia Corporation
- Hironobu TAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND BONDING TOOL
- Publication number 20190148333
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...
- Publication number 20190088527
- Publication date Mar 21, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
- Publication number 20170053823
- Publication date Feb 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hui Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND METHOD FOR BONDING CHIPS
- Publication number 20160254246
- Publication date Sep 1, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Rui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160118363
- Publication date Apr 28, 2016
- SHINKAWA LTD.
- Shoji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20140091509
- Publication date Apr 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FLIP CHIP STACKING
- Publication number 20140017852
- Publication date Jan 16, 2014
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG, MANUFACTURING METHOD THEREOF, AND FLIP CHIP BONDING METHOD FOR...
- Publication number 20130341303
- Publication date Dec 26, 2013
- Young Il KIM
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming 3DIC Package
- Publication number 20130095608
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP...
- Publication number 20120032145
- Publication date Feb 9, 2012
- Sumitomo Electric Industries, Ltd.
- Youichi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for assembling a conformal chip carrier to a f...
- Publication number 20020096746
- Publication date Jul 25, 2002
- International Business Machines Corporation
- David N. Cokely
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...
- Publication number 20010019174
- Publication date Sep 6, 2001
- DAVID N. COKELY
- H01 - BASIC ELECTRIC ELEMENTS

of the mounting surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Carrier for microelectronic assemblies having direct bonding

Bonding device and bonding method

Substrate bonding apparatus

Warpage-compensated bonded structure including a support chip and a...

Method for bonding wafers and bonding tool

Method and apparatus for stacking devices in an integrated circuit...

Bond chuck, methods of bonding, and tool including bond chuck

Bonding stage and method of manufacturing the same

Methods for flip chip stacking

Methods for forming 3DIC package

Fixture for shaping a laminate substrate

Jig, manufacturing method thereof, and flip chip bonding method for...

Methods for flip chip stacking

Methods for forming 3DIC package

Method of attaching a conformal chip carrier to a flip chip

Fixture for attaching a conformal chip carrier to a flip chip

3713575

Patents Applicationslast 30 patents

BONDING TOOL OF FLIP CHIP LASER BONDING APPARATUS

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

MOUNTING HEAD

BOND HEAD DESIGN FOR THERMAL COMPRESSION BONDING

NON-PLANAR PEDESTAL FOR THERMAL COMPRESSION BONDING

BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEAD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET

BONDING DEVICE AND BONDING METHOD

CARRIER FOR MICROELECTRONIC ASSEMBLIES HAVING DIRECT BONDING

COVALENTLY BONDED SEMICONDUCTOR INTERFACES

SUBSTRATE BONDING APPARATUS

METHOD FOR BONDING WAFERS AND BONDING TOOL

METHOD AND APPARATUS FOR STACKING DEVICES IN AN INTEGRATED CIRCUIT...

Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck

APPARATUS AND METHOD FOR BONDING CHIPS

BONDING STAGE AND METHOD OF MANUFACTURING THE SAME

Methods for Forming 3DIC Package

METHODS FOR FLIP CHIP STACKING

JIG, MANUFACTURING METHOD THEREOF, AND FLIP CHIP BONDING METHOD FOR...

FIXTURE FOR SHAPING A LAMINATE SUBSTRATE

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Methods for Forming 3DIC Package

DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP...

Method and apparatus for assembling a conformal chip carrier to a f...

METHOD AND APPARATUS FOR ASSEMBLING A CONFORMAL CHIP CARRIER TO A F...