Only outside the bonding interface of the bump connector

Industry

CPC
H01L2224/13565

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13565Only outside the bonding interface of the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
- Patent number 11,984,418
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device including a joint a...
- Patent number 11,894,330
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising interconnect structures having an inne...
- Patent number 11,676,922
- Issue date Jun 13, 2023
- QUALCOMM Incorporated
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,626,388
- Issue date Apr 11, 2023
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brass-coated metals in flip-chip redistribution layers
- Patent number 11,410,947
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Vivek Swaminathan Sridharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 11,233,036
- Issue date Jan 25, 2022
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure including a metal post encapsulated by a...
- Patent number 10,971,463
- Issue date Apr 6, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,943,888
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,720,410
- Issue date Jul 21, 2020
- TOSHIBA MEMORY CORPORATION
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on same substrate
- Patent number 10,629,567
- Issue date Apr 21, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with barrier layer
- Patent number 10,593,621
- Issue date Mar 17, 2020
- Shinko Electric Industries Co., Ltd.
- Keigo Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 10,522,491
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple bond via arrays of different wire heights on a same substrate
- Patent number 10,290,613
- Issue date May 14, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including conductive layer and conductive pill...
- Patent number 10,249,589
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with redundant electrical connectors and ass...
- Patent number 10,192,852
- Issue date Jan 29, 2019
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,153,243
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230145304
- Publication date May 11, 2023
- InnoLux Corporation
- Yi-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20220384375
- Publication date Dec 1, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...
- Publication number 20220115348
- Publication date Apr 14, 2022
- Raytheon Company
- Sean F. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210450
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS
- Publication number 20210193600
- Publication date Jun 24, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Swaminathan SRIDHARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...
- Publication number 20210125951
- Publication date Apr 29, 2021
- QUALCOMM Incorporated
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Bump Formation Process
- Publication number 20200126937
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE
- Publication number 20190148344
- Publication date May 16, 2019
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190006324
- Publication date Jan 3, 2019
- Toshiba Memory Corporation
- Tatsuo MIGITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS
- Publication number 20180340100
- Publication date Nov 29, 2018
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Application
Multiple bond via arrays of different wire heights on a same substrate
- Publication number 20180301436
- Publication date Oct 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device And Bump Formation Process
- Publication number 20180247907
- Publication date Aug 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE FOR JOINING WAFERS...
- Publication number 20180218991
- Publication date Aug 2, 2018
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061798
- Publication date Mar 1, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-LIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20180047696
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...
- Publication number 20180026015
- Publication date Jan 25, 2018
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
- Publication number 20170309584
- Publication date Oct 26, 2017
- Agency for Science, Technology and Research
- Ling Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20170084563
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Amount Process in the Manufacturing of Integrated Circuit
- Publication number 20160141261
- Publication date May 19, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure and Method of Forming Same
- Publication number 20150357301
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20150325542
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...
- Publication number 20140363970
- Publication date Dec 11, 2014
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS

Only outside the bonding interface of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multiple plated via arrays of different wire heights on a same subs...

Method of forming brass-coated metals in flip-chip redistribution l...

Solderless interconnection structure and method of forming same

Methods of manufacturing a semiconductor device including a joint a...

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Integrated device comprising interconnect structures having an inne...

Interconnect structure with redundant electrical connectors and ass...

Brass-coated metals in flip-chip redistribution layers

Semiconductor device and bump formation process

Method of making a pillar structure having a non-metal sidewall pro...

Semiconductor package structure and method for manufacturing the same

Interconnect structure with redundant electrical connectors and ass...

Enhanced adhesive materials and processes for 3D applications

Solderless interconnection structure and method of forming same

Interconnection structure including a metal post encapsulated by a...

Interconnect structure with redundant electrical connectors and ass...

Flip-chip method

Enhanced adhesive materials and processes for 3D applications

Semiconductor device and manufacturing method thereof

Multiple plated via arrays of different wire heights on same substrate

Semiconductor device with barrier layer

Semiconductor device and bump formation process

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Solderless interconnection structure and method of forming same

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor device including conductive layer and conductive pill...

Interconnect structure with redundant electrical connectors and ass...

Cu pillar bump with L-shaped non-metal sidewall protection structure

Semiconductor devices, methods of manufacture thereof, and packaged...

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

ELECTRONIC DEVICE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

3D MODIFIED SURFACE TO ENABLE IMPROVED BOND STRENGTH AND YIELD OF E...

Solderless Interconnection Structure and Method of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BRASS-COATED METALS IN FLIP-CHIP REDISTRIBUTION LAYERS

INTEGRATED DEVICE COMPRISING INTERCONNECT STRUCTURES HAVING AN INNE...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Bump Formation Process

FLIP-CHIP METHOD

Solderless Interconnection Structure and Method of Forming Same

MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ENHANCED ADHESIVE MATERIALS AND PROCESSES FOR 3D APPLICATIONS

Multiple bond via arrays of different wire heights on a same substrate

Semiconductor Device And Bump Formation Process

METHODS OF FORMING INTEGRATED CIRCUIT STRUCTURE FOR JOINING WAFERS...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASS...

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE

CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE

Ball Amount Process in the Manufacturing of Integrated Circuit

Bump Structure and Method of Forming Same

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PRO...