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H01L23/293

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/293Organic

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,224,184
- Issue date Feb 11, 2025
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method manufacturing the same
- Patent number 12,176,258
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Feng-Cheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,957
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Minoru Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded chip package and manufacturing method thereof
- Patent number 12,148,676
- Issue date Nov 19, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer trench isolation between transistors in an integrated...
- Patent number 12,148,717
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Scott Robert Summerfelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,541
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curable hot-melt silicone composition, cured material thereof, and...
- Patent number 12,134,697
- Issue date Nov 5, 2024
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Microelectronic module
- Patent number 12,136,576
- Issue date Nov 5, 2024
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,125,756
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmentally protected photonic integrated circuit
- Patent number 12,125,805
- Issue date Oct 22, 2024
- EFFECT PHOTONICS B.V.
- Tsjerk Hans Hoekstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer system-level three-dimensional fan-out three-dimensional fan-...
- Patent number 12,119,295
- Issue date Oct 15, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Release film and method of manufacturing release film
- Patent number 12,112,957
- Issue date Oct 8, 2024
- KOBAYASHI & CO., LTD.
- Keisuke Sakai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chip heat dissipation structure, chip structure, circuit board and...
- Patent number 12,100,639
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Dan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having lid with protrusion and manufacturing meth...
- Patent number 12,094,792
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of 3D microelectrodes and use thereof in multi-function...
- Patent number 12,085,557
- Issue date Sep 10, 2024
- University of Central Florida Research Foundation, Inc.
- Swaminathan Rajaraman
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Composition for forming coating film and method for manufacturing s...
- Patent number 12,087,576
- Issue date Sep 10, 2024
- NISSAN CHEMICAL CORPORATION
- Tokio Nishita
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip protected against back-face attacks
- Patent number 12,087,708
- Issue date Sep 10, 2024
- STMicroelectronics (Crolles 2) SAS
- Sebastien Petitdidier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display module and system applications
- Patent number 12,087,749
- Issue date Sep 10, 2024
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,075,660
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Ki Ho Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 12,074,097
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Akihisa Fukumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device with cooling member
- Patent number 12,074,088
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Takahiko Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 12,068,236
- Issue date Aug 20, 2024
- Murata Manufacturing Co., Ltd.
- Shoji Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062185
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20250054926
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND SYSTEM APPLICATIONS
- Publication number 20250038160
- Publication date Jan 30, 2025
- Apple Inc.
- Andreas Bibl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250022710
- Publication date Jan 16, 2025
- Fuji Electric Co., Ltd.
- Soichi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250014958
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...
- Publication number 20250015021
- Publication date Jan 9, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250006621
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006720
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Daeyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED SEMICONDUCTOR CHIP PRODUCTION METHOD, SEMICONDUCTOR CHIP...
- Publication number 20250006574
- Publication date Jan 2, 2025
- Resonac Corporation
- Takahiro KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250006580
- Publication date Jan 2, 2025
- ROHM CO., LTD.
- Yuki NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS
- Publication number 20240421104
- Publication date Dec 19, 2024
- SAUDI ARABIANOIL COMPANY
- Dong Kyu Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240413080
- Publication date Dec 12, 2024
- Fuji Electric Co., Ltd.
- Naoyuki OHSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON DIE FLEXURE CONTROL DEVICE AND METHOD
- Publication number 20240413031
- Publication date Dec 12, 2024
- Intel Corporation
- Chandru Periasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME
- Publication number 20240413065
- Publication date Dec 12, 2024
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS
- Publication number 20240413098
- Publication date Dec 12, 2024
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...
- Publication number 20240400728
- Publication date Dec 5, 2024
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240404908
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS
- Publication number 20240395934
- Publication date Nov 28, 2024
- The Boeing Company
- Leora Peltz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS
- Publication number 20240387312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES
- Publication number 20240382158
- Publication date Nov 21, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371715
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION
- Publication number 20240371824
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- Yichen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...
- Publication number 20240360310
- Publication date Oct 31, 2024
- NAMICS CORPORATION
- Hirotatsu IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure with warpage-control element

Methods for registration of circuit dies and electrical interconnects

Semiconductor module and power conversion apparatus

Electronic package including a protection layer

Semiconductor device with a dielectric between portions

Semiconductor package and method manufacturing the same

Negative photosensitive resin composition, production method for po...

Semiconductor device

Embedded chip package and manufacturing method thereof

Through wafer trench isolation between transistors in an integrated...

Semiconductor package and manufacturing method thereof

Semiconductor package

Curable hot-melt silicone composition, cured material thereof, and...

Microelectronic module

Semiconductor device

Environmentally protected photonic integrated circuit

Electronic device packages with internal moisture barriers

Wafer system-level three-dimensional fan-out three-dimensional fan-...

Release film and method of manufacturing release film

Chip heat dissipation structure, chip structure, circuit board and...

Package structure having lid with protrusion and manufacturing meth...

Fabrication of 3D microelectrodes and use thereof in multi-function...

Composition for forming coating film and method for manufacturing s...

Chip protected against back-face attacks

Display module and system applications

Semiconductor package and methods of manufacturing a semiconductor...

Display device

Power module

Semiconductor device and semiconductor device with cooling member

Electronic module

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE AND SEMICONDUCTOR DEVICE

DISPLAY MODULE AND SYSTEM APPLICATIONS

Semiconductor Device and Methods of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FO...

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

REINFORCED SEMICONDUCTOR CHIP PRODUCTION METHOD, SEMICONDUCTOR CHIP...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

SELECTIVE WET CHANNELS FOR WATER DRAINAGE PPLICATIONS

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ON DIE FLEXURE CONTROL DEVICE AND METHOD

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DIE SHIELDING STRUCTURE

MULTILAYER MOISTURE REPELLING FILMS FOR FRONT END FET APPLICATIONS

POLYHYDRIC PHENOL RESIN, AS WELL AS RESIN COMPOSITION, CURED PRODUC...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICES FOR USE IN HIGH-PRESSURE ENVIRONMENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SILICON FRAGMENT DEFECT REDUCTION IN GRINDING PROCESS

Integrated Circuit Packages and Methods

METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PLASMA DICING FOR SEMICONDUCTOR DEVICE FABRICATION

RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING S...