Overhang structure

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4855Overhang structure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,136,590
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Yun-Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,694,949
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yun-Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic switching device with a three-dimensionally prefor...
- Patent number 11,581,245
- Issue date Feb 14, 2023
- Semikron Elektronik GmbH & Co. KG
- Michael Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a conductive pad with an anchor flange
- Patent number 11,562,947
- Issue date Jan 24, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense redistribution layers in semiconductor packages and methods o...
- Patent number 11,417,604
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, method for manufacturing semiconductor chip, in...
- Patent number 10,658,321
- Issue date May 19, 2020
- Kabushiki Kaisha Toshiba
- Hidekazu Inoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,410,944
- Issue date Sep 10, 2019
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense redistribution layers in semiconductor packages and methods o...
- Patent number 10,340,206
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact
- Patent number 10,157,827
- Issue date Dec 18, 2018
- International Business Machines Corporation
- Cheng Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,633,945
- Issue date Apr 25, 2017
- Kabushiki Kaisha Toshiba
- Takuya Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnects having a titanium-platinum-titanium assembly b...
- Patent number 9,553,049
- Issue date Jan 24, 2017
- Skyworks Solutions, Inc.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,159,654
- Issue date Oct 13, 2015
- Mitsubishi Electric Corporation
- Youichi Nogami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for establishing and closing a trench of a semiconductor com...
- Patent number 8,587,095
- Issue date Nov 19, 2013
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip with flexible contacts at a face
- Patent number 7,375,434
- Issue date May 20, 2008
- Infineon Technologies AG
- Harald Gross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit pad structures
- Patent number 5,834,849
- Issue date Nov 10, 1998
- Altera Corporation
- Christopher F. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture resistant semiconductor device
- Patent number 5,786,625
- Issue date Jul 28, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a bipolar device
- Patent number 5,643,805
- Issue date Jul 1, 1997
- Hitachi, Ltd.
- Hiroyuki Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bipolar device and production thereof
- Patent number 5,619,069
- Issue date Apr 8, 1997
- Hitachi, Ltd.
- Hiroyuki Ohta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip contacts without oxide discontinuities
- Patent number 4,839,715
- Issue date Jun 13, 1989
- International Business Machines Corporation
- Joseph J. Gajda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an electrode and a method of manufactur...
- Patent number 4,809,055
- Issue date Feb 28, 1989
- Kabushiki Kaisha Toshiba
- Masaru Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrodes on the surface of a semiconductor subs...
- Patent number 4,337,115
- Issue date Jun 29, 1982
- Tokyo Shibaura Electric Co., Ltd.
- Masashi Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid process for SBD metallurgies
- Patent number 4,272,561
- Issue date Jun 9, 1981
- International Business Machines Corporation
- Laura B. Rothman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a pattern of...
- Patent number 4,035,206
- Issue date Jul 12, 1977
- U.S. Philips Corporation
- Jean Pierre Rioult
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3926695
- Patent number 3,926,695
- Issue date Dec 16, 1975
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3839111
- Patent number 3,839,111
- Issue date Oct 1, 1974
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3837907
- Patent number 3,837,907
- Issue date Sep 24, 1974
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3742315
- Patent number 3,742,315
- Issue date Jun 26, 1973
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3681153
- Patent number 3,681,153
- Issue date Aug 1, 1972
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3675313
- Patent number 3,675,313
- Issue date Jul 11, 1972
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230290711
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- Yun-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense Redistribution Layers in Semiconductor Packages and Methods o...
- Publication number 20220352086
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...
- Publication number 20220122904
- Publication date Apr 21, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SWITCHING DEVICE WITH A THREE-DIMENSIONALLY PREFOR...
- Publication number 20220068768
- Publication date Mar 3, 2022
- SEMIKRON ELEKTRONIK GMBH & CO. KG
- MICHAEL SCHATZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220005749
- Publication date Jan 6, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180331008
- Publication date Nov 15, 2018
- Rohm Co., Ltd.
- Isamu Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT
- Publication number 20180005901
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Cheng Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150054137
- Publication date Feb 26, 2015
- Mitsubishi Electric Corporation
- Youichi NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS HAVING A TITANIUM-TITANIUM NITRIDE ASSEMBLY BE...
- Publication number 20130234333
- Publication date Sep 12, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECTS HAVING A TITANIUM-PLATINUM-TITANIUM ASSEMBLY B...
- Publication number 20130228924
- Publication date Sep 5, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...
- Publication number 20130221528
- Publication date Aug 29, 2013
- SKYWORKS SOLUTIONS, INC.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130056875
- Publication date Mar 7, 2013
- Mitsubishi Electric Corporation
- Youichi NOGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ESTABLISHING AND CLOSING A TRENCH OF A SEMICONDUCTOR COM...
- Publication number 20110169143
- Publication date Jul 14, 2011
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor chip with flexible contacts at a face
- Publication number 20060055055
- Publication date Mar 16, 2006
- Infineon Technologies AG
- Harald Gross
- H01 - BASIC ELECTRIC ELEMENTS

Overhang structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method of manufacturing the same

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor package and method of manufacturing the same

Power electronic switching device with a three-dimensionally prefor...

Semiconductor package having a conductive pad with an anchor flange

Dense redistribution layers in semiconductor packages and methods o...

Semiconductor chip, method for manufacturing semiconductor chip, in...

Semiconductor device

Dense redistribution layers in semiconductor packages and methods o...

Semiconductor contact

Semiconductor device and method of manufacturing semiconductor device

Copper interconnects having a titanium-platinum-titanium assembly b...

Semiconductor device

Method for establishing and closing a trench of a semiconductor com...

Semiconductor chip with flexible contacts at a face

High density integrated circuit pad structures

Moisture resistant semiconductor device

Process for producing a bipolar device

Bipolar device and production thereof

Chip contacts without oxide discontinuities

Semiconductor device having an electrode and a method of manufactur...

Method of forming electrodes on the surface of a semiconductor subs...

Hybrid process for SBD metallurgies

Method of manufacturing a semiconductor device having a pattern of...

3926695

3839111

3837907

3742315

3681153

3675313

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Dense Redistribution Layers in Semiconductor Packages and Methods o...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...

POWER ELECTRONIC SWITCHING DEVICE WITH A THREE-DIMENSIONALLY PREFOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CONTACT

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

COPPER INTERCONNECTS HAVING A TITANIUM-TITANIUM NITRIDE ASSEMBLY BE...

COPPER INTERCONNECTS HAVING A TITANIUM-PLATINUM-TITANIUM ASSEMBLY B...

DEVICES AND METHODS RELATED TO A SPUTTERED TITANIUM TUNGSTEN LAYER...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR ESTABLISHING AND CLOSING A TRENCH OF A SEMICONDUCTOR COM...

Semiconductor chip with flexible contacts at a face