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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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Patents Grantslast 30 patents

Information Patent Grant
Field-effect transistor having improved layout
- Patent number 12,211,916
- Issue date Jan 28, 2025
- Ampleon Netherlands B.V.
- Patrick Valk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,199,017
- Issue date Jan 14, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Xiaoyan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter
- Patent number 12,183,774
- Issue date Dec 31, 2024
- Mitsubishi Electric Corporation
- Shiro Hino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,142,605
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Koichi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric FET for RF nonlinearity improvement
- Patent number 12,113,057
- Issue date Oct 8, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated semiconductor device
- Patent number 12,074,093
- Issue date Aug 27, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Manabu Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,384
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device topology for lateral power transistors with low common sourc...
- Patent number 12,040,257
- Issue date Jul 16, 2024
- GaN Systems Inc.
- Ahmad Mizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device topologies for high current lateral power semiconductor devices
- Patent number 12,027,449
- Issue date Jul 2, 2024
- GaN Systems Inc.
- Hossein Mousavian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,864
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Akira Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including sense insulated-gate bipolar transistor
- Patent number 11,942,531
- Issue date Mar 26, 2024
- Rohm Co., Ltd.
- Akihiro Hikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,887,935
- Issue date Jan 30, 2024
- Renesas Electronics Corporation
- Takehiro Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device
- Patent number 11,869,957
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Kenji Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power transistors
- Patent number 11,862,536
- Issue date Jan 2, 2024
- MACOM Technology Solutions Holdings, Inc.
- Aram Mkhitarian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 11,855,039
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having an electro-static discharge protection...
- Patent number 11,848,286
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating field-effect transistors with interleaved source and dr...
- Patent number 11,842,947
- Issue date Dec 12, 2023
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,790
- Issue date Nov 28, 2023
- Kabushiki Kaisha Toshiba
- Hiroko Itokazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field-effect transistor, method of manufacturing the same, and radi...
- Patent number 11,810,861
- Issue date Nov 7, 2023
- Sony Group Corporation
- Naoki Saka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging for power semiconductor devices
- Patent number 11,776,883
- Issue date Oct 3, 2023
- GaN Systems Inc.
- Cameron Mcknight-Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,769,829
- Issue date Sep 26, 2023
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Masahide Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,756,863
- Issue date Sep 12, 2023
- Kabushiki Kaisha Toshiba
- Hiroshi Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 11,749,645
- Issue date Sep 5, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package, display panel, and display device
- Patent number 11,749,146
- Issue date Sep 5, 2023
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Radio frequency transistor amplifiers and other multi-cell transist...
- Patent number 11,742,304
- Issue date Aug 29, 2023
- Wolfspeed, Inc.
- Frank Trang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 11,728,313
- Issue date Aug 15, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated system with compatible chip and manufa...
- Publication number 20250014969
- Publication date Jan 9, 2025
- CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 44 RESEARCH INSTITUTE
- Xiaodong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250006595
- Publication date Jan 2, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Yuya TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Group III Nitride Doherty Amplifier Using Different Epitaxial Struc...
- Publication number 20240429870
- Publication date Dec 26, 2024
- MACOM Technology Solutions Holdings, Inc.
- Matthew Mellor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240324169
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Reiko SUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266258
- Publication date Aug 8, 2024
- ROHM CO., LTD.
- Kentaro CHIKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION
- Publication number 20240250003
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT
- Publication number 20240213242
- Publication date Jun 27, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Tzu-Chieh WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE TRANSISTOR DEVICE
- Publication number 20240170487
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240162165
- Publication date May 16, 2024
- ROHM CO., LTD.
- Keita SHIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY
- Publication number 20240153850
- Publication date May 9, 2024
- Semiconductor Components Industries, LLC
- Jimmy Robert Hannes FRANCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having an Electro-static Discharge Protection...
- Publication number 20240113044
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- YI-FENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING
- Publication number 20240105640
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Aya MURAYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV AS PAD
- Publication number 20240088101
- Publication date Mar 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240088090
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...
- Publication number 20240071844
- Publication date Feb 29, 2024
- Changxin Memory Technologies, Inc.
- Yizhi ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240063095
- Publication date Feb 22, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Xiaoyan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET PADS OVER TSV
- Publication number 20240006383
- Publication date Jan 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS
- Publication number 20230420451
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Rahul R. Potera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE
- Publication number 20230410703
- Publication date Dec 21, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME
- Publication number 20230386978
- Publication date Nov 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki KURODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230369174
- Publication date Nov 16, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Miaomiao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230335470
- Publication date Oct 19, 2023
- Kabushiki Kaisha Toshiba
- Hiroshi KONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20230326832
- Publication date Oct 12, 2023
- Fujitsu Limited
- Tsuyoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Having an Electro-static Discharge Protection...
- Publication number 20230290745
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- YI-FENG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230290878
- Publication date Sep 14, 2023
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Masahide TAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230246079
- Publication date Aug 3, 2023
- Kabushiki Kaisha Toshiba
- Yosuke KAJIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230215764
- Publication date Jul 6, 2023
- NEXPERIA B.V.
- Rainer Mintzlaff
- H01 - BASIC ELECTRIC ELEMENTS

Pads with extended contours

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Field-effect transistor having improved layout

TSV as pad

Semiconductor device and method for manufacturing the same

Power converter

Semiconductor device and method for manufacturing the same

Symmetric FET for RF nonlinearity improvement

Molded packaging for wide band gap semiconductor devices

Integrated semiconductor device

Semiconductor die contact structure and method

Semiconductor device

Device topology for lateral power transistors with low common sourc...

Device topologies for high current lateral power semiconductor devices

Semiconductor device

Semiconductor device including sense insulated-gate bipolar transistor

Semiconductor device

Semiconductor device and manufacturing method thereof

Compound semiconductor device

High power transistors

Chip package structure

Semiconductor devices having an electro-static discharge protection...

Fabricating field-effect transistors with interleaved source and dr...

Semiconductor device

Field-effect transistor, method of manufacturing the same, and radi...

Embedded die packaging for power semiconductor devices

Semiconductor device

Semiconductor device

TSV as pad

Chip-on-film package, display panel, and display device

Radio frequency transistor amplifiers and other multi-cell transist...

Offset pads over TSV

Patents Applicationslast 30 patents

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

Three-dimensional integrated system with compatible chip and manufa...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Group III Nitride Doherty Amplifier Using Different Epitaxial Struc...

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICE

SEMICONDUCTOR DEVICE

FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION

INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT

GROUP III NITRIDE TRANSISTOR DEVICE

NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY

Semiconductor Devices Having an Electro-static Discharge Protection...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

TSV AS PAD

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE LAYOUT STRUCTURE, METHOD FOR FORMING SAME, AND...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

OFFSET PADS OVER TSV

SEMICONDUCTOR DEVICES HAVING ON-CHIP GATE RESISTORS

CHIP-ON-FILM PACKAGE, DISPLAY PANEL, AND DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR COMPONENT INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...

Semiconductor Devices Having an Electro-static Discharge Protection...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE