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TSV AS PAD
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Publication number 20240088101
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Publication date Mar 14, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Guilian Gao
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE STRUCTURE
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Publication number 20240088090
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ling-Wei LI
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H01 - BASIC ELECTRIC ELEMENTS
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OFFSET PADS OVER TSV
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Publication number 20240006383
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Publication date Jan 4, 2024
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Bongsub Lee
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE
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Publication number 20230369174
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Publication date Nov 16, 2023
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CHANGXIN MEMORY TECHNOLOGIES, INC
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Miaomiao CHEN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230335470
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Publication date Oct 19, 2023
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Kabushiki Kaisha Toshiba
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Hiroshi KONO
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230290878
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Publication date Sep 14, 2023
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NUVOTON TECHNOLOGY CORPORATION JAPAN
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Masahide TAGUCHI
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230246079
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Publication date Aug 3, 2023
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Kabushiki Kaisha Toshiba
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Yosuke KAJIWARA
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230215764
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Publication date Jul 6, 2023
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NEXPERIA B.V.
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Rainer Mintzlaff
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H01 - BASIC ELECTRIC ELEMENTS
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LEADED SEMICONDUCTOR DEVICE PACKAGE
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Publication number 20230068748
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Publication date Mar 2, 2023
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TEXAS INSTRUMENTS INCORPORATED
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Masamitsu Matsuura
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H01 - BASIC ELECTRIC ELEMENTS
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