Pressure sensors

Industry

CPC
B81B2201/0264

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0264Pressure sensors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Micromechanical sensor device and corresponding manufacturing method
- Patent number 11,952,263
- Issue date Apr 9, 2024
- Robert Bosch GmbH
- Mike Schwarz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
- Patent number 11,946,822
- Issue date Apr 2, 2024
- Sciosense B.V.
- Alessandro Faes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a capacitive pressure sensor device
- Patent number 11,940,345
- Issue date Mar 26, 2024
- Robert Bosch GmbH
- Thomas Friedrich
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical pressure sensor device and a corresponding producti...
- Patent number 11,940,346
- Issue date Mar 26, 2024
- Robert Bosch GmbH
- Johannes Meckbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multifunction magnetic and piezoresistive MEMS pressure sensor
- Patent number 11,937,511
- Issue date Mar 19, 2024
- Apple Inc.
- Majid Khan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a pressure sensor device
- Patent number 11,932,532
- Issue date Mar 19, 2024
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor unit and method for manufacturing a micromec...
- Patent number 11,912,565
- Issue date Feb 27, 2024
- Robert Bosch GmbH
- Christoph Hermes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and method for manufacturing a micromecha...
- Patent number 11,912,563
- Issue date Feb 27, 2024
- Robert Bosch GmbH
- Hans Artmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical system acoustic sensor, micro-electro-mech...
- Patent number 11,905,164
- Issue date Feb 20, 2024
- UPBEAT TECHNOLOGY CO., LTD
- Hsien-Lung Ho
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production method for a micromechanical component
- Patent number 11,905,166
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device having an ASIC chip integrated into a...
- Patent number 11,906,383
- Issue date Feb 20, 2024
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capless semiconductor package with a micro-electromechanical system...
- Patent number 11,897,763
- Issue date Feb 13, 2024
- STMicroelectronics, Inc.
- Jefferson Sismundo Talledo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Differential mems device and methods
- Patent number 11,892,465
- Issue date Feb 6, 2024
- Movella Inc.
- Sanjay Bhandari
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing an integrated MEMS transducer device and i...
- Patent number 11,878,906
- Issue date Jan 23, 2024
- Sciosense B.V.
- Kailash Vijayakumar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ultrasonic MEMS acoustic transducer with reduced stress sensitivity...
- Patent number 11,865,581
- Issue date Jan 9, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless pressure sensors
- Patent number 11,867,583
- Issue date Jan 9, 2024
- Honeywell International Inc.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Parasitic insensitive sampling in sensors
- Patent number 11,867,584
- Issue date Jan 9, 2024
- pSemi Corporation
- Vishnu Srinivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical system (MEMS) sensor packages and methods fo...
- Patent number 11,851,322
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for sealing entries in a MEMS element
- Patent number 11,851,324
- Issue date Dec 26, 2023
- Robert Bosch GmbH
- Christoph Hermes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-range semiconductor load sensor device
- Patent number 11,851,319
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Anna Angela Pomarico
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Force feedback compensated absolute pressure sensor
- Patent number 11,827,511
- Issue date Nov 28, 2023
- Knowles Electronics, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-parametric machine olfaction
- Patent number 11,828,742
- Issue date Nov 28, 2023
- Brown University
- Jacob K. Rosenstein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor and method for manufacturing a MEMS sensor including im...
- Patent number 11,828,669
- Issue date Nov 28, 2023
- Robert Bosch GmbH
- Cristian Nagel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical apparatus having hermitic chamber
- Patent number 11,820,650
- Issue date Nov 21, 2023
- Industrial Technology Research Institute
- Bor-Shiun Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dielectric comb for MEMS device
- Patent number 11,825,266
- Issue date Nov 21, 2023
- Knowles Electronics, LLC
- Mohsin Nawaz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite structures
- Patent number 11,814,284
- Issue date Nov 14, 2023
- Cirrus Logic Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated optical transducer and method for detecting dynamic pres...
- Patent number 11,808,654
- Issue date Nov 7, 2023
- ams International AG
- Goran Stojanovic
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...
- Publication number 20240124300
- Publication date Apr 18, 2024
- STMICROELECTRONICS, INC.
- Jefferson Sismundo TALLEDO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE
- Publication number 20240116750
- Publication date Apr 11, 2024
- Rohm Co., Ltd.
- Takashi NAIKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240083741
- Publication date Mar 14, 2024
- Rohm Co., Ltd.
- Daisuke NISHINOHARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) CHIP, AND SENSOR AND...
- Publication number 20240080021
- Publication date Mar 7, 2024
- Nanjing Prime Semiconductor Co., Ltd.
- Sunfeng HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240051818
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsi-Cheng HSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Haptic Device with Multiple Fluidically-Controlled Voids
- Publication number 20240019934
- Publication date Jan 18, 2024
- Meta Platforms Technologies, LLC
- Sean Jason Keller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Load-Lock Gauge
- Publication number 20240019332
- Publication date Jan 18, 2024
- MKS Instruments, Inc.
- Gerardo A. Brucker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...
- Publication number 20230406697
- Publication date Dec 21, 2023
- ROBERT BOSCH GmbH
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT
- Publication number 20230406698
- Publication date Dec 21, 2023
- Murata Manufacturing Co., Ltd.
- Altti TORKKELI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING IMPLANT
- Publication number 20230380764
- Publication date Nov 30, 2023
- ENDOTRONIX, INC.
- Harry ROWLAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS STRUCTURE INCLUDING A BURIED CAVITY WITH ANTISTICTION PROTUBER...
- Publication number 20230348258
- Publication date Nov 2, 2023
- STMicroelectronics S.r.l.
- Mikel AZPEITIA URQUIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20230304881
- Publication date Sep 28, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SLOTTED MEMS FORCE SENSOR
- Publication number 20230296454
- Publication date Sep 21, 2023
- Qorvo US, Inc.
- Mehrnaz Rouhi Youssefi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device
- Publication number 20230294976
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Abhiraj Basavanna
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR AND SENSOR SYSTEM"
- Publication number 20230288270
- Publication date Sep 14, 2023
- Kabushiki Kaisha Toshiba
- Yoshihiko KURUI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and Structure for CMOS-MEMS Thin Film Encapsulation
- Publication number 20230278856
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND SENSOR MODULE
- Publication number 20230257258
- Publication date Aug 17, 2023
- Rohm Co., Ltd.
- Martin Wilfried HELLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
BAROMETRIC PRESSURE SENSOR ARRAYS FOR DETECTING PRESENCE AND MOTION...
- Publication number 20230258948
- Publication date Aug 17, 2023
- Sony Interactive Entertainment Inc.
- Dennis Castleman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE, SYSTEM, METHOD, AND COMPUTER PRODUCT FOR DETECTING AND EVAL...
- Publication number 20230251621
- Publication date Aug 10, 2023
- STMicroelectronics S.r.l.
- Luca FONTANELLA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE
- Publication number 20230249962
- Publication date Aug 10, 2023
- MELEXIS TECHNOLOGIES NV
- Appolonius Jacobus VAN DER WIEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-PARAMETRIC MACHINE OLFACTION
- Publication number 20230251238
- Publication date Aug 10, 2023
- Brown University
- Jacob K. Rosenstein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHA...
- Publication number 20230242393
- Publication date Aug 3, 2023
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
- Publication number 20230235664
- Publication date Jul 27, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Remi Robutel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ABSOLUTE PRESSURE SENSING MEMS MICROPHONE, MICROPHONE UNIT AND ELEC...
- Publication number 20230234833
- Publication date Jul 27, 2023
- GOERTEMICROELECTRONICS CO., LTD.
- Quanbo ZOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR CHIP AND PRESSURE SENSOR
- Publication number 20230228639
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Daiki TSUJI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Making a MEMS Semiconductor Package
- Publication number 20230192478
- Publication date Jun 22, 2023
- UTAC Headquarters Pte. Ltd.
- Phongsak Sawasdee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIFUNCTION MAGNETIC AND PIEZORESISTIVE MEMS PRESSURE SENSOR
- Publication number 20230189654
- Publication date Jun 15, 2023
- Apple Inc.
- Majid KHAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Pressure sensors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micromechanical sensor device and corresponding manufacturing method

Integrated digital force sensors and related methods of manufacture

Semiconductor transducer device with multilayer diaphragm and metho...

Micromechanical component for a capacitive pressure sensor device

Micromechanical pressure sensor device and a corresponding producti...

Multifunction magnetic and piezoresistive MEMS pressure sensor

Micromechanical component for a pressure sensor device

Packaging of microfluidic devices and microfluidic integrated syste...

Micromechanical sensor unit and method for manufacturing a micromec...

Micromechanical component and method for manufacturing a micromecha...

Micro-electro-mechanical system acoustic sensor, micro-electro-mech...

Production method for a micromechanical component

Micromechanical sensor device having an ASIC chip integrated into a...

Capless semiconductor package with a micro-electromechanical system...

Differential mems device and methods

Packaged device with die wrapped by a substrate

Method for manufacturing an integrated MEMS transducer device and i...

Ultrasonic MEMS acoustic transducer with reduced stress sensitivity...

Leadless pressure sensors

Parasitic insensitive sampling in sensors

Microelectromechanical system (MEMS) sensor packages and methods fo...

Method for sealing entries in a MEMS element

High-range semiconductor load sensor device

Force feedback compensated absolute pressure sensor

Multi-parametric machine olfaction

MEMS sensor and method for manufacturing a MEMS sensor including im...

Microelectromechanical apparatus having hermitic chamber

Dielectric comb for MEMS device

Composite structures

Integrated optical transducer and method for detecting dynamic pres...

Patents Applicationslast 30 patents

CAPLESS SEMICONDUCTOR PACKAGE WITH A MICRO-ELECTROMECHANICAL SYSTEM...

MEMS MODULE

MEMS DEVICE

APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) CHIP, AND SENSOR AND...

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

Haptic Device with Multiple Fluidically-Controlled Voids

Load-Lock Gauge

REDUCED LIGHT REFLECTION PACKAGE

MEMS PRESSURE SENSOR

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...

MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT

PRESSURE SENSING IMPLANT

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

MEMS STRUCTURE INCLUDING A BURIED CAVITY WITH ANTISTICTION PROTUBER...

MICROMECHANICAL COMPONENT

SLOTTED MEMS FORCE SENSOR

Semiconductor Device

SENSOR AND SENSOR SYSTEM"

Method and Structure for CMOS-MEMS Thin Film Encapsulation

SEMICONDUCTOR DEVICE AND SENSOR MODULE

BAROMETRIC PRESSURE SENSOR ARRAYS FOR DETECTING PRESENCE AND MOTION...

DEVICE, SYSTEM, METHOD, AND COMPUTER PRODUCT FOR DETECTING AND EVAL...

METHOD OF MANUFACTURING A SENSOR DEVICE AND MOULDING SUPPORT STRUCTURE

MULTI-PARAMETRIC MACHINE OLFACTION

MICROMECHANICAL COMPONENT AND MANUFACTURING METHOD FOR A MICROMECHA...

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

ABSOLUTE PRESSURE SENSING MEMS MICROPHONE, MICROPHONE UNIT AND ELEC...

PRESSURE SENSOR CHIP AND PRESSURE SENSOR

Semiconductor Device and Method of Making a MEMS Semiconductor Package

MULTIFUNCTION MAGNETIC AND PIEZORESISTIVE MEMS PRESSURE SENSOR