Reinforcing structures

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CPC
H01L2224/10125

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/10125Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,176,313
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,746
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,742,310
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding ultra-dense bump arrays using alignment bumps
- Patent number 11,626,551
- Issue date Apr 11, 2023
- Tectus Corporation
- Nachiket Raghunath Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 11,244,940
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,139,282
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules including stacked semiconductor dice
- Patent number 11,101,245
- Issue date Aug 24, 2021
- Micron Technology, Inc.
- Eric Tan Swee Seng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including solder bracing material with a rough...
- Patent number 11,018,106
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integration for high bandwidth memory
- Patent number 10,971,474
- Issue date Apr 6, 2021
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,943,881
- Issue date Mar 9, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing compliant bump
- Patent number 10,825,788
- Issue date Nov 3, 2020
- LBSEMICON CO., LTD.
- Jae Jin Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protrusion structure
- Patent number 10,692,828
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction apparatus and method
- Patent number 10,692,848
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for an improved interconnect structure
- Patent number 10,312,204
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-silicon-via and methods of form...
- Patent number 10,262,922
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 10,262,965
- Issue date Apr 16, 2019
- Samsung Display Co., Ltd.
- Seung-Soo Ryu
- G02 - OPTICS
Information Patent Grant
Semiconductor package
- Patent number 10,211,176
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protrusion structure
- Patent number 10,163,827
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,068,865
- Issue date Sep 4, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230079686
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Young Hun CHEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING
- Publication number 20230058638
- Publication date Feb 23, 2023
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230011778
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Hyoungjoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210257326
- Publication date Aug 19, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210183801
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200321326
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING COMPLIANT BUMP
- Publication number 20200266164
- Publication date Aug 20, 2020
- LBSEMICON CO., LTD.
- Jae Jin KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200035655
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20200006311
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190164922
- Publication date May 30, 2019
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTRUSION STRUCTURE
- Publication number 20190148317
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CHIP, DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANU...
- Publication number 20190148327
- Publication date May 16, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Interconnect Structure
- Publication number 20180374807
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180337154
- Publication date Nov 22, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180301431
- Publication date Oct 18, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- JING-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...
- Publication number 20180190571
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180019220
- Publication date Jan 18, 2018
- SAMSUNG DISPLAY CO., LTD.
- Seung-Soo RYU
- G02 - OPTICS
Information Patent Application
METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...
- Publication number 20170365551
- Publication date Dec 21, 2017
- ams AG
- Cathal CASSIDY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR AN IMPROVED INTERCONNECT STRUCTURE
- Publication number 20170186713
- Publication date Jun 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20170179062
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Ae-nee JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Chip Scale Package Interconnects and Methods of Manufac...
- Publication number 20170154811
- Publication date Jun 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Tar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Thin Wafer Without a C...
- Publication number 20160336230
- Publication date Nov 17, 2016
- STATS ChipPAC Pte Ltd.
- Pandi C. Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Reduction Apparatus and Method
- Publication number 20160155733
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
- Publication number 20150294949
- Publication date Oct 15, 2015
- NANTONG FUJITSU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262953
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD
- Publication number 20150262846
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Li-Guo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS INCLUDING COPPER PILLAR STRUCTURES AND METHODS...
- Publication number 20150187714
- Publication date Jul 2, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Mahesh Anant Bhatkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...
- Publication number 20140339698
- Publication date Nov 20, 2014
- ams AG
- Cathal Cassidy
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Stress reduction apparatus and method

Solderless interconnection structure and method of forming same

Semiconductor device and method

Semiconductor package

Method of manufacturing semiconductor device

Semiconductor packages

Microelectronic devices and apparatuses having a patterned surface...

Bonding ultra-dense bump arrays using alignment bumps

Stress reduction apparatus and method

Semiconductor package structure and method for manufacturing the same

Multi-chip modules including stacked semiconductor dice

Solderless interconnection structure and method of forming same

Semiconductor device including solder bracing material with a rough...

Package integration for high bandwidth memory

Driving chip, display substrate, display device and method for manu...

Methods of forming microelectronic devices having a patterned surfa...

Semiconductor package

Semiconductor device and method

Method for manufacturing compliant bump

Package structure with protrusion structure

Stress reduction apparatus and method

Combing bump structure and manufacturing method thereof

Solderless interconnection structure and method of forming same

System and method for an improved interconnect structure

Semiconductor device having through-silicon-via and methods of form...

Display device and manufacturing method thereof

Semiconductor package

Package structure with protrusion structure

Combing bump structure and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SOLDER CREEP LIMITING RIGID SPACER FOR STACKED DIE C4 PACKAGING

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

SEMICONDUCTOR PACKAGE

Stress Reduction Apparatus and Method

METHOD FOR MANUFACTURING COMPLIANT BUMP

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Stress Reduction Apparatus and Method

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH PROTRUSION STRUCTURE

DRIVING CHIP, DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANU...

System and Method for an Improved Interconnect Structure

COMBING BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF PRODUCING A SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE V...

SYSTEM AND METHOD FOR AN IMPROVED INTERCONNECT STRUCTURE

SEMICONDUCTOR PACKAGE

Wafer Level Chip Scale Package Interconnects and Methods of Manufac...

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

Semiconductor Device and Method of Forming a Thin Wafer Without a C...

Stress Reduction Apparatus and Method

CHIP PACKAGING STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING METHOD

PACKAGE STRUCTURE AND MANUFACTURING METHOD

INTEGRATED CIRCUITS INCLUDING COPPER PILLAR STRUCTURES AND METHODS...

SEMICONDUCTOR DEVICE WITH THROUGH-SUBSTRATE VIA COVERED BY A SOLDER...