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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 12,100,679
- Issue date Sep 24, 2024
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate and method for detecting broken fanout wire of di...
- Patent number 11,972,989
- Issue date Apr 30, 2024
- BOE Technology Group Co., Ltd.
- Li Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 11,594,484
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 11,495,567
- Issue date Nov 8, 2022
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a redistribution line
- Patent number 11,373,970
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having singular wire bond on bonding pads
- Patent number 11,056,465
- Issue date Jul 6, 2021
- Intel Corporation
- Yi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,861,842
- Issue date Dec 8, 2020
- STMicroelectronics S.r.l.
- Alberto Pagani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-pin-wafer-level-chip-scale-packaging solution for high power...
- Patent number 10,797,012
- Issue date Oct 6, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming bonding structures by using template layer as templates
- Patent number 10,700,001
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,685,934
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and fabrication method therefor
- Patent number 10,541,218
- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of pattern placement correction
- Patent number 10,497,658
- Issue date Dec 3, 2019
- Applied Materials, Inc.
- Tamer Coskun
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,453,833
- Issue date Oct 22, 2019
- STMicroelectonics S.R.L.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 10,319,708
- Issue date Jun 11, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Pad defined contact for wafer level package
- Patent number 10,204,876
- Issue date Feb 12, 2019
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 10,177,106
- Issue date Jan 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging semiconductor devices
- Patent number 10,153,240
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure
- Patent number 10,141,275
- Issue date Nov 27, 2018
- Nanya Technology Corporation
- Po Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of pattern placement correction
- Patent number 10,115,687
- Issue date Oct 30, 2018
- Applied Materials, Inc.
- Tamer Coskun
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Stress relief solutions on WLCSP large/bulk copper plane design
- Patent number 10,083,926
- Issue date Sep 25, 2018
- Dialog Semiconductor (UK) Limited
- Ian Kent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing redistribution layer
- Patent number 9,997,479
- Issue date Jun 12, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Hsien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic system having increased coupling by using horizontal and...
- Patent number 9,881,911
- Issue date Jan 30, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pad structure for hybrid bonding and methods of forming...
- Patent number 9,842,816
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20230077469
- Publication date Mar 16, 2023
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20220302060
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220254755
- Publication date Aug 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20200395325
- Publication date Dec 17, 2020
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20200152589
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20200144208
- Publication date May 7, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20190304939
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20190244948
- Publication date Aug 8, 2019
- STMicroelectronics S.r.l
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...
- Publication number 20190067229
- Publication date Feb 28, 2019
- Dialog Semiconductor (UK) Limited
- Habeeb Mohiuddin Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERN PLACEMENT CORRECTION
- Publication number 20190019769
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Tamer COSKUN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013289
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERN PLACEMENT CORRECTION
- Publication number 20180226369
- Publication date Aug 9, 2018
- Applied Materials, Inc.
- Tamer COSKUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR
- Publication number 20180151525
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING REDISTRIBUTION LAYER
- Publication number 20180151519
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Hsien LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180130784
- Publication date May 10, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20180102353
- Publication date Apr 12, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Pad Structure for Hybrid Bonding and Methods of Forming...
- Publication number 20180068965
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion between Post-Passivation Interconnect Structure and Polymer
- Publication number 20140264853
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus of Packaging Semiconductor Devices
- Publication number 20140264824
- Publication date Sep 18, 2014
- TAIWAN SEMICONDUTOR MANUFACTURING COMPANY, LTD.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE
- Publication number 20140252592
- Publication date Sep 11, 2014
- Maxim Integrated Products, Inc.
- Tiao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130323884
- Publication date Dec 5, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...
- Publication number 20130316497
- Publication date Nov 28, 2013
- The Charles Stark Draper Laboratory
- Maurice Samuel Karpman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...
- Publication number 20130241025
- Publication date Sep 19, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT
- Publication number 20130237055
- Publication date Sep 12, 2013
- IMEC
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE LAYERED CHIP PACKAGE
- Publication number 20130020723
- Publication date Jan 24, 2013
- SAE MAGNETICS (H. K) LTD.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313260
- Publication date Dec 13, 2012
- HEADWAY TECHNOLOGIES, INC.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20120313259
- Publication date Dec 13, 2012
- SAE Magnetics (H.K.) Ltd.
- Yoshitaka SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
- Publication number 20120156453
- Publication date Jun 21, 2012
- NEC Corporation
- Mario GONZALEZ
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip-chip stacking structures and methods for forming the same

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Redistribution layer metallic structure and method

Display substrate and method for detecting broken fanout wire of di...

Forming bonding structures by using template layer as templates

Redistribution layer metallic structure and method

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Semiconductor device having a redistribution line

Semiconductor package having singular wire bond on bonding pads

Redistribution layer metallic structure and method

Electronic system having increased coupling by using horizontal and...

Multi-pin-wafer-level-chip-scale-packaging solution for high power...

Forming bonding structures by using template layer as templates

Semiconductor package device and method of manufacturing the same

Semiconductor chip package with resilient conductive paste post and...

Redistribution layer metallic structure and method

Redistribution layer structure and fabrication method therefor

Method of pattern placement correction

Electronic system having increased coupling by using horizontal and...

Electronic system having increased coupling by using horizontal and...

Pad defined contact for wafer level package

Conductive pad structure for hybrid bonding and methods of forming...

Method of packaging semiconductor devices

Method for manufacturing a semiconductor structure

Method of pattern placement correction

Stress relief solutions on WLCSP large/bulk copper plane design

Method for manufacturing redistribution layer

Electronic system having increased coupling by using horizontal and...

Conductive pad structure for hybrid bonding and methods of forming...

Integrated circuit chip using top post-passivation technology and b...

Patents Applicationslast 30 patents

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

Redistribution Layer Metallic Structure and Method

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

Redistribution Layer Metallic Structure and Method

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

Redistribution Layer Metallic Structure and Method

Redistribution Layer Metallic Structure and Method

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Multi-Pin-Wafer-Level-Chip-Scale-Packaging Solution for High Power...

METHOD OF PATTERN PLACEMENT CORRECTION

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF PATTERN PLACEMENT CORRECTION

REDISTRIBUTION LAYER STRUCTURE AND FABRICATION METHOD THEREFOR

METHOD FOR MANUFACTURING REDISTRIBUTION LAYER

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

Conductive Pad Structure for Hybrid Bonding and Methods of Forming...

Adhesion between Post-Passivation Interconnect Structure and Polymer

Methods and Apparatus of Packaging Semiconductor Devices

PAD DEFINED CONTACT FOR WAFER LEVEL PACKAGE

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...

THREE DIMENSIONAL MICROELECTRONIC COMPONENTS AND FABRICATION METHOD...

ELECTRONIC SYSTEM HAVING INCREASED COUPLING BY USING HORIZONTAL AND...

METHOD OF REDISTRIBUTING FUNCTIONAL ELEMENT

COMPOSITE LAYERED CHIP PACKAGE

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME

CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE