Semiconductor materials

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H01L23/3738

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3738Semiconductor materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assemblies including monolithic silicon struct...
- Patent number 12,205,865
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular microchannel thermal solutions for integrated circuit devices
- Patent number 12,199,012
- Issue date Jan 14, 2025
- Intel Corporation
- Adel Elsherbini
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hybrid interposer of glass and silicon to reduce thermal crosstalk
- Patent number 12,191,220
- Issue date Jan 7, 2025
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation using nanoscale materials
- Patent number 12,191,228
- Issue date Jan 7, 2025
- Sanctioned Risk Solutions, Inc.
- Zachary R. Greenhill
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Material structure for low thermal resistance silicon-based gallium...
- Patent number 12,142,643
- Issue date Nov 12, 2024
- Xidian University
- Jincheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high heat dissipation property using hexa...
- Patent number 12,131,978
- Issue date Oct 29, 2024
- Electronics and Telecommunications Research Institute
- Il Gyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric cooling packages
- Patent number 12,125,766
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive slugs/active dies to improve cooling of stacke...
- Patent number 12,094,800
- Issue date Sep 17, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method
- Patent number 12,085,769
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic power package and heat sink/cold rail arrangement
- Patent number 12,087,659
- Issue date Sep 10, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Binghua Pan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silicon-on-insulator metal-oxide-semiconductor field-effect transis...
- Patent number 12,057,502
- Issue date Aug 6, 2024
- ANHUI UNIVERSITY
- Xingang Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced silicon back end layers for improved thermal per...
- Patent number 12,021,016
- Issue date Jun 25, 2024
- Intel Corporation
- Chandra Mohan Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with semiconductive thermal pedestal
- Patent number 12,021,003
- Issue date Jun 25, 2024
- Marvell Asia Pte, Ltd.
- Han Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,955,399
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Ae-Nee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity boron arsenide for thermal management, el...
- Patent number 11,948,858
- Issue date Apr 2, 2024
- The Regents of the University of California
- Yongjie Hu
- C30 - CRYSTAL GROWTH
Information Patent Grant
Bipolar transistor with thermal conductor
- Patent number 11,942,534
- Issue date Mar 26, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Hong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated semiconductor package with HV isolator on block
- Patent number 11,929,311
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Vivek K Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die semiconductor package spacer die
- Patent number 11,881,441
- Issue date Jan 23, 2024
- Intel Corporation
- Sireesha Gogineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,876,032
- Issue date Jan 16, 2024
- Murata Manufacturing Co., Ltd.
- Shinnosuke Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 11,842,941
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic solid state heat pump
- Patent number 11,823,974
- Issue date Nov 21, 2023
- Northwestern University
- Matthew Grayson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
- Patent number 11,810,845
- Issue date Nov 7, 2023
- OSRAM OLED GmbH
- Jörg Erich Sorg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermalization arrangement at cryogenic temperatures
- Patent number 11,800,689
- Issue date Oct 24, 2023
- Teknologian tutkimuskeskus VTT Oy
- Mika Prunnila
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device on ceramic substrate
- Patent number 11,791,226
- Issue date Oct 17, 2023
- QUALCOMM Incorporated
- Je-Hsiung Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,769,707
- Issue date Sep 26, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,756,860
- Issue date Sep 12, 2023
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...
- Publication number 20250038063
- Publication date Jan 30, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xin Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038067
- Publication date Jan 30, 2025
- nD-HI Technologies Lab, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022873
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Masayuki AOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022843
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY
- Publication number 20250006699
- Publication date Jan 2, 2025
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT...
- Publication number 20250006643
- Publication date Jan 2, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...
- Publication number 20250006670
- Publication date Jan 2, 2025
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Jinliang ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING HEAT SHIELD
- Publication number 20240421217
- Publication date Dec 19, 2024
- Analog Devices, Inc.
- James G. Fiorenza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20240413051
- Publication date Dec 12, 2024
- Denka Company Limited
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD
- Publication number 20240361546
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355733
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS
- Publication number 20240347497
- Publication date Oct 17, 2024
- International Business Machines Corporation
- SHIDONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY BORON ARSENIDE FOR THERMAL MANAGEMENT, EL...
- Publication number 20240243034
- Publication date Jul 18, 2024
- The Regents of the University of California
- Yongjie HU
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSIS...
- Publication number 20240243201
- Publication date Jul 18, 2024
- ANHUI UNIVERSITY
- Xingang REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
- Publication number 20240234245
- Publication date Jul 11, 2024
- Intel Corporation
- Shrenik KOTHARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
- Publication number 20240222237
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Vivek K. Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...
- Publication number 20240149565
- Publication date May 9, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Takashi MATSUMAE
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20240136250
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Yeonho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240128179
- Publication date Apr 18, 2024
- Unimicron Technology Corp.
- Jyun-Hong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128145
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- HYEONSEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128155
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minjun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...
- Publication number 20240087980
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240079288
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Youngho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
- Publication number 20240063091
- Publication date Feb 22, 2024
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS

Semiconductor materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device assemblies including monolithic silicon struct...

Modular microchannel thermal solutions for integrated circuit devices

Hybrid interposer of glass and silicon to reduce thermal crosstalk

Heat dissipation using nanoscale materials

Material structure for low thermal resistance silicon-based gallium...

Semiconductor package structure and fabrication method thereof

Semiconductor device with high heat dissipation property using hexa...

Thermoelectric cooling packages

Semiconductor device

Thermally conductive slugs/active dies to improve cooling of stacke...

Integrated circuit device and method

Electronic power package and heat sink/cold rail arrangement

Silicon-on-insulator metal-oxide-semiconductor field-effect transis...

Thermally enhanced silicon back end layers for improved thermal per...

Semiconductor device package with semiconductive thermal pedestal

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor package

High thermal conductivity boron arsenide for thermal management, el...

Bipolar transistor with thermal conductor

Isolated semiconductor package with HV isolator on block

Stacked die semiconductor package spacer die

Semiconductor device

Semiconductor package structure and fabrication method thereof

Cryogenic solid state heat pump

Carrier, assembly comprising a substrate and a carrier, and method...

Thermalization arrangement at cryogenic temperatures

Device on ceramic substrate

Semiconductor assemblies including thermal circuits and methods of...

Semiconductor structure and fabrication method thereof

Semiconductor device stack-up with bulk substrate material to mitig...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

CHIP PACKAGING STRUCTURE, SEMICONDUCTOR STRUCTURE, AND FABRICATING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ORTHOGONAL BRIDGE PACKAGING TECHNOLOGY

METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT...

ANTENNA MODULE WITH ANISOTROPIC HEXAGONAL BORON NITRIDE THERMAL INT...

SEMICONDUCTOR DEVICE INCLUDING HEAT SHIELD

HEAT DISSIPATION MEMBER

INTEGRATED CIRCUIT DEVICE MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

THERMAL SOLUTIONS FOR ADVANCED SEMICONDUCTORS

HIGH THERMAL CONDUCTIVITY BORON ARSENIDE FOR THERMAL MANAGEMENT, EL...

SILICON-ON-INSULATOR METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT TRANSIS...

SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...

ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK

COMPOSITE BODY COMPRISING SILICON CARBIDE AND METHOD FOR PRODUCING...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...