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H01L23/3738
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor package
Patent number
11,955,399
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Ae-Nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High thermal conductivity boron arsenide for thermal management, el...
Patent number
11,948,858
Issue date
Apr 2, 2024
The Regents of the University of California
Yongjie Hu
C30 - CRYSTAL GROWTH
Information
Patent Grant
Bipolar transistor with thermal conductor
Patent number
11,942,534
Issue date
Mar 26, 2024
GLOBALFOUNDRIES U.S. Inc.
Hong Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolated semiconductor package with HV isolator on block
Patent number
11,929,311
Issue date
Mar 12, 2024
Texas Instruments Incorporated
Vivek K Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked die semiconductor package spacer die
Patent number
11,881,441
Issue date
Jan 23, 2024
Intel Corporation
Sireesha Gogineni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,876,032
Issue date
Jan 16, 2024
Murata Manufacturing Co., Ltd.
Shinnosuke Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
11,842,941
Issue date
Dec 12, 2023
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cryogenic solid state heat pump
Patent number
11,823,974
Issue date
Nov 21, 2023
Northwestern University
Matthew Grayson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier, assembly comprising a substrate and a carrier, and method...
Patent number
11,810,845
Issue date
Nov 7, 2023
OSRAM OLED GmbH
Jörg Erich Sorg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermalization arrangement at cryogenic temperatures
Patent number
11,800,689
Issue date
Oct 24, 2023
Teknologian tutkimuskeskus VTT Oy
Mika Prunnila
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Grant
Device on ceramic substrate
Patent number
11,791,226
Issue date
Oct 17, 2023
QUALCOMM Incorporated
Je-Hsiung Lan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
Patent number
11,791,315
Issue date
Oct 17, 2023
Micron Technology, Inc.
Chan H. Yoo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and fabrication method thereof
Patent number
11,769,707
Issue date
Sep 26, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Fei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
Patent number
11,756,860
Issue date
Sep 12, 2023
Intel Corporation
Shrenik Kothari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,749,640
Issue date
Sep 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon heat-dissipation package for compact electronic devices
Patent number
11,742,255
Issue date
Aug 29, 2023
Gerald Ho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit die stacked with backer die including capacitors...
Patent number
11,699,629
Issue date
Jul 11, 2023
Qorvo US, Inc.
Anthony Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,664,292
Issue date
May 30, 2023
Samsung Electronics Co., Ltd.
Ae-Nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Direct substrate to solder bump connection for thermal management i...
Patent number
11,515,845
Issue date
Nov 29, 2022
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor device package
Patent number
11,508,710
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Yao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced integrated passive device (IPD) with thin-film heat spread...
Patent number
11,404,345
Issue date
Aug 2, 2022
QUALCOMM Incorporated
Je-Hsiung Lan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-layer cooling structure including through-silicon vias throug...
Patent number
11,387,165
Issue date
Jul 12, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device
Patent number
11,367,714
Issue date
Jun 21, 2022
Samsung Electronics Co., Ltd.
Jangwoo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
11,315,851
Issue date
Apr 26, 2022
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for producing semiconductor device
Patent number
11,270,907
Issue date
Mar 8, 2022
Sumitomo Electric Industries, Ltd.
Takehiko Kikuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and fabrication method thereof
Patent number
11,257,736
Issue date
Feb 22, 2022
Semiconductor Manufacturing International (Shanghai) Corporation
Fei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Air cavity package using high temperature silicone adhesive
Patent number
11,227,806
Issue date
Jan 18, 2022
Materion Corporation
Richard J. Koba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,211,308
Issue date
Dec 28, 2021
GlobalWafers Co., Ltd.
Hsien-Chin Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,205,636
Issue date
Dec 21, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic power module
Patent number
11,195,778
Issue date
Dec 7, 2021
Audi AG
Andreas Apelsmeier
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
Publication number
20240136250
Publication date
Apr 25, 2024
Samsung Electronics Co., Ltd.
Yeonho Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240128147
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Sey-Ping SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240128179
Publication date
Apr 18, 2024
Unimicron Technology Corp.
Jyun-Hong CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Publication number
20240128145
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
HYEONSEOK LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240128155
Publication date
Apr 18, 2024
Samsung Electronics Co., Ltd.
Minjun Bae
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
Publication number
20240105545
Publication date
Mar 28, 2024
Apple Inc.
Jiongxin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
Publication number
20240096771
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
Osvaldo Lopez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ETCHING-DAMAGE-FREE INTERMETAL DIELECTRIC LAYER WITH THERMAL DISSIP...
Publication number
20240087980
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Fang CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
Publication number
20240079288
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
Youngho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240063074
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED STRUCTURAL MEMBER AND/OR BOND LAYER FOR MULTICHI...
Publication number
20240063091
Publication date
Feb 22, 2024
Intel Corporation
Adel Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240055315
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALIZATION ARRANGEMENT AT CRYOGENIC TEMPERATURES
Publication number
20240015936
Publication date
Jan 11, 2024
Teknologian Tutkimuskeskus VTT Oy
Mika PRUNNILA
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240006262
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
Kyungdon MUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230402340
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT REMOVAL IN INTEGRATED CIRCUITS WITH TRANSISTORS AND DOUBLE-SID...
Publication number
20230395456
Publication date
Dec 7, 2023
Intel Corporation
Jean-Pierre Njante
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230361078
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER AND PACKAGING DEVICE ARCHITETCURE AND METHOD OF MAKING F...
Publication number
20230298964
Publication date
Sep 21, 2023
Islam Salama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE WITH IMPROVED HEAT DISSIPATION
Publication number
20230290705
Publication date
Sep 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chin LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BIPOLAR TRANSISTOR WITH THERMAL CONDUCTOR
Publication number
20230290868
Publication date
Sep 14, 2023
GLOBALFOUNDRIES U.S. Inc.
Hong Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230282538
Publication date
Sep 7, 2023
Samsung Electronics Co., Ltd.
Ae-Nee JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR INTEGRATING AN ELECTRONIC INTEGRATED CIRCUIT AND A PH...
Publication number
20230268249
Publication date
Aug 24, 2023
Nokia Solutions and Networks Oy
Alexandre Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT HAVING AN IMPROVED THERMAL INTEGRATED CIRCUIT HA...
Publication number
20230207420
Publication date
Jun 29, 2023
TEXAS INSTRUMENTS INCORPORATED
Kwang-Soo Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
Publication number
20230155555
Publication date
May 18, 2023
Skyworks Solutions, Inc.
Michael Joseph McPartlin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
Publication number
20230139175
Publication date
May 4, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STACK-UP WITH BULK SUBSTRATE MATERIAL TO MITIG...
Publication number
20230140685
Publication date
May 4, 2023
Intel Corporation
Shrenik KOTHARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
Publication number
20230139914
Publication date
May 4, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MONOLITHIC SILICON STRUCT...
Publication number
20230136202
Publication date
May 4, 2023
Micron Technology, Inc.
Kunal R. Parekh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ISOLATED SEMICONDUCTOR PACKAGE WITH HV ISOLATOR ON BLOCK
Publication number
20230119127
Publication date
Apr 20, 2023
TEXAS INSTRUMENTS INCORPORATED
Vivek K. Arora
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH SEMICONDUCTIVE THERMAL PEDESTAL
Publication number
20230051507
Publication date
Feb 16, 2023
Marvell Asia Pte, Ltd.
Han Gao
H01 - BASIC ELECTRIC ELEMENTS