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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3005Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display substrate, manufacturing method thereof, and display device
- Patent number 11,404,448
- Issue date Aug 2, 2022
- ORDOS YUANSHENG OPTOELECTRONICS CO., LTD.
- Bo Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device having a cooling body with a groove
- Patent number 11,088,045
- Issue date Aug 10, 2021
- Mitsubishi Electric Corporation
- Noboru Miyamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,729
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Kyong Soon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stack protection seal
- Patent number 9,768,089
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,620,390
- Issue date Apr 11, 2017
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer stack protection seal
- Patent number 9,406,577
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ranjan Rajoo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,362,139
- Issue date Jun 7, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device comprising at least a chip enclosed in a package...
- Patent number 9,159,652
- Issue date Oct 13, 2015
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micromechanical method and corresponding assembly for bonding semic...
- Patent number 8,638,000
- Issue date Jan 28, 2014
- Robert Bosch GmbH
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
I/O pad structures for integrated circuit devices
- Patent number 7,898,088
- Issue date Mar 1, 2011
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 7,126,212
- Issue date Oct 24, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 6,984,571
- Issue date Jan 10, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated device
- Patent number 6,905,557
- Issue date Jun 14, 2005
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3811186
- Patent number 3,811,186
- Issue date May 21, 1974
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame, Packaging Structure and Packaging Method
- Publication number 20240234259
- Publication date Jul 11, 2024
- DIODES INCORPORATED
- MeiDan Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240055385
- Publication date Feb 15, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240047407
- Publication date Feb 8, 2024
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210384155
- Publication date Dec 9, 2021
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH RAISED FEATURE
- Publication number 20160343684
- Publication date Nov 24, 2016
- Innovative Micro Technology
- Christopher S. GUDEMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20150287692
- Publication date Oct 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150262959
- Publication date Sep 17, 2015
- Kabushiki Kaisha Toshiba
- Yuuji HISAZATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER STACK PROTECTION SEAL
- Publication number 20140264762
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES SINGAPORE PTE LTD.
- Ranjan RAJOO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...
- Publication number 20140239502
- Publication date Aug 28, 2014
- STMicroelectronics S.r.l.
- Concetto Privitera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical Method and Corresponding Assembly for Bonding Semic...
- Publication number 20120280409
- Publication date Nov 8, 2012
- Achim Trautmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Functional Capping
- Publication number 20120267773
- Publication date Oct 25, 2012
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20090091016
- Publication date Apr 9, 2009
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20080196245
- Publication date Aug 21, 2008
- Fujitsu Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080093747
- Publication date Apr 24, 2008
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080061418
- Publication date Mar 13, 2008
- Ziptronix
- Paul Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20060292744
- Publication date Dec 28, 2006
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20020173120
- Publication date Nov 21, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device intergration method and intergrated device
- Publication number 20020094661
- Publication date Jul 18, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Display substrate, manufacturing method thereof, and display device

Semiconductor device having a cooling body with a groove

Semiconductor package

Three dimensional device integration method and integrated device

Method for producing structured sintered connection layers, and sem...

Wafer stack protection seal

Methods of manufacturing a semiconductor device

Method of making a semiconductor device having a functional capping

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Wafer stack protection seal

Method of making a semiconductor device having a functional capping

Electronic device comprising at least a chip enclosed in a package...

Micromechanical method and corresponding assembly for bonding semic...

Method for mounting electronic components

I/O pad structures for integrated circuit devices

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional integrated device

3811186

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

Lead Frame, Packaging Structure and Packaging Method

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

DIE ATTACHMENT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

THERMOCOMPRESSION BONDING WITH RAISED FEATURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

WAFER STACK PROTECTION SEAL

ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE...

Method for Producing Structured Sintered Connection Layers, and Sem...

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

Micromechanical Method and Corresponding Assembly for Bonding Semic...

Functional Capping

I/O PAD STRUCTURES FOR INTEGRATED CIRCUIT DEVICES

METHOD FOR MOUNTING ELECTRONIC COMPONENTS

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device intergration method and intergrated device