3811186

Information

• Patent Grant
• 3811186

• References
• Source

• Patent Number

  3,811,186

• Date Filed

  Not available

• Date Issued

  Tuesday, May 21, 1974
  50 years ago

• CPC

  • H01L24/81 - using a bump connector
  • H05K3/303 - Surface mounted components
  • H01L2224/10165 - Alignment aids
  • H01L2224/10175 - Flow barriers
  • H01L2224/16225 - the item being non-metallic
  • H01L2224/16227 - the bump connector connecting to a bond pad of the item
  • H01L2224/29012 - in top view
  • H01L2224/29035 - covering only the peripheral area of the surface to be connected
  • H01L2224/29036 - covering only the central area of the surface to be connected
  • H01L2224/30051 - Layer connectors having different shapes
  • H01L2224/3015 - Mirror array
  • H01L2224/73103 - Bump and layer connectors
  • H01L2224/73203 - Bump and layer connectors
  • H01L2224/81002 - being a removable or sacrificial coating
  • H01L2224/81136 - involving guiding structures
  • H01L2224/81191 - wherein the bump connectors are disposed only on the semiconductor or solid-state body
  • H01L2224/81801 - Soldering or alloying
  • H01L2924/01005 - Boron [B]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/014 - Solder alloys
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • H01L2924/12042 - LASER
  • H01L2924/14 - Integrated circuits
  • H05K2201/09036 - Recesses or grooves in insulating substrate
  • H05K2201/09909 - Special local insulating pattern
  • H05K2201/10727 - Leadless chip carrier [LCC]
  • H05K2201/10734 - Ball grid array [BGA] Bump grid array
  • H05K2201/2036 - Permanent spacer or stand-off in a printed circuit or printed circuit assembly
  • H05K2203/167 - Using mechanical means for positioning, alignment or registration
  • Y02P70/613 - involving the assembly of several electronic elements
  • Y10T29/49144 - by metal fusion

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 361 - Electricity: electrical systems and devices
  • 438 - Semiconductor device manufacturing: process
  • 439 - Electrical connectors