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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/1705
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Patents Grants
last 30 patents
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,984,405
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,929,316
Issue date
Mar 12, 2024
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packaging
Patent number
11,817,444
Issue date
Nov 14, 2023
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,810,867
Issue date
Nov 7, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic package with solder array thermal interface materia...
Patent number
11,735,552
Issue date
Aug 22, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
11,705,415
Issue date
Jul 18, 2023
Lapis Semiconductor Co., Ltd.
Taiichi Ogumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
Patent number
11,694,898
Issue date
Jul 4, 2023
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,646,260
Issue date
May 9, 2023
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip transfer method, display device, chip and target substrate
Patent number
11,616,043
Issue date
Mar 28, 2023
BOE Technology Group Co., Ltd.
Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
Patent number
11,502,051
Issue date
Nov 15, 2022
SK hynix Inc.
Ho Young Son
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bond wires for interference shielding
Patent number
11,462,483
Issue date
Oct 4, 2022
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,424,189
Issue date
Aug 23, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packaging
Patent number
11,348,911
Issue date
May 31, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
11,342,309
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package structure and method for forming the same
Patent number
11,264,342
Issue date
Mar 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Surface mounting semiconductor components
Patent number
11,101,238
Issue date
Aug 24, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Ming-Kai Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
11,049,826
Issue date
Jun 29, 2021
Lapis Semiconductor Co., Ltd.
Taiichi Ogumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,964,659
Issue date
Mar 30, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with surface-mount die support struct...
Patent number
10,950,568
Issue date
Mar 16, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device assembly with die support structures
Patent number
10,923,447
Issue date
Feb 16, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
Patent number
10,867,957
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D die stacking structure with fine pitches
Patent number
10,854,577
Issue date
Dec 1, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
10,854,576
Issue date
Dec 1, 2020
TOSHIBA MEMORY CORPORATION
Yuji Karakane
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible transmitter circuitry for integrated circuits
Patent number
10,848,155
Issue date
Nov 24, 2020
Intel Corporation
Chee Seng Leong
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Semiconductor device
Patent number
10,833,037
Issue date
Nov 10, 2020
Rohm Co., Ltd.
Kiyotaka Umemoto
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
Patent number
10,818,583
Issue date
Oct 27, 2020
Taiwan Semiconductor Manufacturing Company
I-Ting Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
Patent number
10,734,346
Issue date
Aug 4, 2020
ELPIS TECHNOLOGIES INC.
Richard S. Graf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages and methods of forming same
Patent number
10,714,457
Issue date
Jul 14, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packaging
Patent number
10,700,051
Issue date
Jun 30, 2020
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density package interconnects
Patent number
10,658,279
Issue date
May 19, 2020
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
REDISTRIBUTION LAYERS IN A DIELECTRIC CAVITY TO ENABLE AN EMBEDDED...
Publication number
20240170351
Publication date
May 23, 2024
Intel Corporation
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING
Publication number
20240128256
Publication date
Apr 18, 2024
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH BALL GRID ARRAY CONNECTION HAVING IMPROV...
Publication number
20240071974
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Yu-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
Publication number
20240055385
Publication date
Feb 15, 2024
WISTRON NEWEB CORPORATION
KUO-HUA HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20230343738
Publication date
Oct 26, 2023
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES WITH PATTERNED DIE BACKSIDE LAYER
Publication number
20230317545
Publication date
Oct 5, 2023
Intel Corporation
Pilin Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20230260866
Publication date
Aug 17, 2023
MEDIATEK INC.
Yin-Fa CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230230935
Publication date
Jul 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kai-Ming Ching
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230230946
Publication date
Jul 20, 2023
Samsung Electronics Co., Ltd.
Seongyo KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
Publication number
20230082120
Publication date
Mar 16, 2023
QUALCOMM Incorporated
Yujen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230069490
Publication date
Mar 2, 2023
Samsung Electronics Co., Ltd.
Hyeonseok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20230059375
Publication date
Feb 23, 2023
Invensas LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CHIP CONNECTION STRUCTURE
Publication number
20230030589
Publication date
Feb 2, 2023
Samsung Electronics Co., Ltd.
BOIN NOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230034654
Publication date
Feb 2, 2023
Samsung Electronics Co., Ltd.
Yong Ho KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH WETTABLE SIDE SURFACE AND MANUFACTURING METH...
Publication number
20220392862
Publication date
Dec 8, 2022
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pad Structure Design in Fan-Out Package
Publication number
20220352080
Publication date
Nov 3, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
Publication number
20220293543
Publication date
Sep 15, 2022
DIC CORPORATION
Ryota YAMAGUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming Same
Publication number
20220285323
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
Publication number
20220262751
Publication date
Aug 18, 2022
Huawei Technologies Co., Ltd
Tonglong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING
Publication number
20220231007
Publication date
Jul 21, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP PACKAGING
Publication number
20220157803
Publication date
May 19, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR P...
Publication number
20220084968
Publication date
Mar 17, 2022
SK HYNIX INC.
Ho Young SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220059444
Publication date
Feb 24, 2022
Samsung Electronics Co., Ltd.
JONGYOUN KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE BRIDGE ENABLED CO-PACKAGED PHOTONIC TRANSCEIVER
Publication number
20210288035
Publication date
Sep 16, 2021
Intel Corporation
Thomas Liljeberg
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20210280543
Publication date
Sep 9, 2021
LAPIS SEMICONDUCTOR CO., LTD.
TAIICHI OGUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER BODY AND METHOD OF MANUFACTURING THE SAME
Publication number
20210203302
Publication date
Jul 1, 2021
Murata Manufacturing Co., Ltd.
Takashi IWAMOTO
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES
Publication number
20210167030
Publication date
Jun 3, 2021
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP TRANSFER METHOD, DISPLAY DEVICE, CHIP AND TARGET SUBSTRATE
Publication number
20210134755
Publication date
May 6, 2021
BOE TECHNOLOGY GROUP CO., LTD.
Liang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
Publication number
20200411464
Publication date
Dec 31, 2020
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS