Stacked components

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CPC
H05K2201/10515

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10515Stacked components

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural and thermal management of an integrated circuit
- Patent number 12,046,534
- Issue date Jul 23, 2024
- Apple Inc.
- Simon J. Trivett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient temperature sensor which may be coupled to a printed circui...
- Patent number 12,025,506
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Massimiliano Pesaturo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure
- Patent number 11,950,366
- Issue date Apr 2, 2024
- TDK Corporation
- Kazuhiro Hagita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board arrangement, inverter, and motor vehicle
- Patent number 11,924,971
- Issue date Mar 5, 2024
- ZF Friedrichshafen AG
- Thomas Maier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to form multile electrical components and a single electrica...
- Patent number 11,915,855
- Issue date Feb 27, 2024
- Cyntec Co., Ltd.
- Chin Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,844,178
- Issue date Dec 12, 2023
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slider-based HBA internal lock
- Patent number 11,839,029
- Issue date Dec 5, 2023
- Hewlett Packard Enterprise Development LP
- Warren A. Kartadinata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 11,744,021
- Issue date Aug 29, 2023
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rectangular waveguide communication between memory and processor
- Patent number 11,728,555
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- Yoshihito Koya
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and electronic component package
- Patent number 11,729,910
- Issue date Aug 15, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronics assemblies having vapor chambers with integrated...
- Patent number 11,721,608
- Issue date Aug 8, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 11,700,692
- Issue date Jul 11, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate inductor having thermal interconnect structures
- Patent number 11,690,165
- Issue date Jun 27, 2023
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic device
- Patent number 11,676,758
- Issue date Jun 13, 2023
- Cyntec Co., Ltd.
- Wenyu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic apparatus, and method for supporting...
- Patent number 11,658,106
- Issue date May 23, 2023
- Fujitsu Limited
- Kenichi Kawai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct current blocking capacitors and method of attaching an IC pa...
- Patent number 11,652,034
- Issue date May 16, 2023
- International Business Machines Corporation
- Darryl Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-chip power devices embedded in PCB and cooling systems inco...
- Patent number 11,647,579
- Issue date May 9, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,646,301
- Issue date May 9, 2023
- Au Optronics Corporation
- Chi-Ho Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for a shielding structure of surface-mount LTC...
- Patent number 11,638,370
- Issue date Apr 25, 2023
- Scientific Components Corporation
- Aaron Vaisman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 11,636,978
- Issue date Apr 25, 2023
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,582,861
- Issue date Feb 14, 2023
- Murata Manufacturing Co., Ltd.
- Takahiro Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer electronic device including a capacitor having a precise...
- Patent number 11,563,414
- Issue date Jan 24, 2023
- KYOCERA AVX Components Corporation
- Kwang Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...
- Publication number 20240260194
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM MULTILE ELECTRICAL COMPONENTS AND A SINGLE ELECTRICA...
- Publication number 20240242880
- Publication date Jul 18, 2024
- CYNTEC CO., LTD.
- Chin Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielding Case, Circuit Board Assembly, and Electronic Device
- Publication number 20240206138
- Publication date Jun 20, 2024
- Honor Device Co., Ltd.
- Jiuliang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT
- Publication number 20240196539
- Publication date Jun 13, 2024
- MEDIATEK INC.
- Chun-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
- Publication number 20240090131
- Publication date Mar 14, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20240049393
- Publication date Feb 8, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
- Publication number 20240006391
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Sangho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLIDER-BASED HBA INTERNAL LOCK
- Publication number 20230389182
- Publication date Nov 30, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Warren A. Kartadinata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
- Publication number 20230345638
- Publication date Oct 26, 2023
- Huawei Technologies Co., Ltd
- Ying LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS
- Publication number 20230317349
- Publication date Oct 5, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki TANGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...
- Publication number 20230309230
- Publication date Sep 28, 2023
- MURATA MANUFACTURING CO., LTD.
- Tsuyoshi TAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230309233
- Publication date Sep 28, 2023
- KIOXIA Corporation
- Satoru FUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL AND THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT
- Publication number 20230282544
- Publication date Sep 7, 2023
- Apple Inc.
- Simon J. TRIVETT
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20230240011
- Publication date Jul 27, 2023
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE AND APPARATUS
- Publication number 20230225054
- Publication date Jul 13, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
- Publication number 20230197622
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
- Publication number 20230197594
- Publication date Jun 22, 2023
- Intel Corporation
- Karumbu Meyyappan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
- Publication number 20220392705
- Publication date Dec 8, 2022
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER DEVICES EMBEDDED IN PCB AND COOLING SYSTEMS INCO...
- Publication number 20220361315
- Publication date Nov 10, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Ceramic Capacitor Including Conductive Vias
- Publication number 20220328248
- Publication date Oct 13, 2022
- KYOCERA AVX Components Corporation
- Marianne Berolini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20220295640
- Publication date Sep 15, 2022
- TDK Corporation
- Kazuhiro HAGITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING VAPOR CHAMBERS WITH INTEGRATED...
- Publication number 20220246492
- Publication date Aug 4, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
- Publication number 20220240370
- Publication date Jul 28, 2022
- Intel Corporation
- Michael J. Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20220192017
- Publication date Jun 16, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Stacked components

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and configuration for stacking multiple printed circuit boards

Circuit board and display device including the same

Multilayer capacitor and circuit board containing the same

Multi-level printed circuit boards and memory modules including the...

Structural and thermal management of an integrated circuit

Stackable via package and method

Ambient temperature sensor which may be coupled to a printed circui...

Printed circuit board with stacked passive components

Electronic component mounting structure

Printed circuit board arrangement, inverter, and motor vehicle

Method to form multile electrical components and a single electrica...

Electronic component

Slider-based HBA internal lock

Semiconductor module and electronic apparatus

Electronic assembly

Package-on-package assembly with wire bond vias

Rectangular waveguide communication between memory and processor

Printed circuit board and electronic component package

Power electronics assemblies having vapor chambers with integrated...

Stackable via package and method

Package substrate inductor having thermal interconnect structures

Magnetic device

Electronic device, electronic apparatus, and method for supporting...

Direct current blocking capacitors and method of attaching an IC pa...

Chip-on-chip power devices embedded in PCB and cooling systems inco...

Display device

Method and apparatus for a shielding structure of surface-mount LTC...

Multilayer capacitor and circuit board containing the same

Electronic device

Multilayer electronic device including a capacitor having a precise...

Patents Applicationslast 30 patents

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

HIGH CAPACITANCE MODULE

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

SEMICONDUCTOR STORAGE DEVICE INCLUDING STAGGERED SEMICONDUCTOR MEMO...

METHOD TO FORM MULTILE ELECTRICAL COMPONENTS AND A SINGLE ELECTRICA...

Shielding Case, Circuit Board Assembly, and Electronic Device

PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...

SLIDER-BASED HBA INTERNAL LOCK

STACKABLE VIA PACKAGE AND METHOD

BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE

EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS

ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...

ELECTRONIC DEVICE

STRUCTURAL AND THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT

ELECTRONIC ASSEMBLY

ELECTRONIC MODULE AND APPARATUS

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...

Multilayer Capacitor and Circuit Board Containing the Same

CHIP-ON-CHIP POWER DEVICES EMBEDDED IN PCB AND COOLING SYSTEMS INCO...

Multilayer Ceramic Capacitor Including Conductive Vias

ELECTRONIC COMPONENT MOUNTING STRUCTURE

POWER ELECTRONICS ASSEMBLIES HAVING VAPOR CHAMBERS WITH INTEGRATED...

PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES

PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE