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H05K2201/10515
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H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
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H05K2201/10515
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Patents Grants
last 30 patents
Information
Patent Grant
Electronic component mounting structure
Patent number
11,950,366
Issue date
Apr 2, 2024
TDK Corporation
Kazuhiro Hagita
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board arrangement, inverter, and motor vehicle
Patent number
11,924,971
Issue date
Mar 5, 2024
ZF Friedrichshafen AG
Thomas Maier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method to form multile electrical components and a single electrica...
Patent number
11,915,855
Issue date
Feb 27, 2024
Cyntec Co., Ltd.
Chin Hung Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component
Patent number
11,844,178
Issue date
Dec 12, 2023
Analog Devices International Unlimited Company
John David Brazzle
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Slider-based HBA internal lock
Patent number
11,839,029
Issue date
Dec 5, 2023
Hewlett Packard Enterprise Development LP
Warren A. Kartadinata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor module and electronic apparatus
Patent number
11,818,844
Issue date
Nov 14, 2023
Canon Kabushiki Kaisha
Yuya Karakawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic assembly
Patent number
11,744,021
Issue date
Aug 29, 2023
Analog Devices, Inc.
Hien Minh Pham
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rectangular waveguide communication between memory and processor
Patent number
11,728,555
Issue date
Aug 15, 2023
Micron Technology, Inc.
Yoshihito Koya
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed circuit board and electronic component package
Patent number
11,729,910
Issue date
Aug 15, 2023
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Chan Hoon Ko
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power electronics assemblies having vapor chambers with integrated...
Patent number
11,721,608
Issue date
Aug 8, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh N. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable via package and method
Patent number
11,700,692
Issue date
Jul 11, 2023
Amkor Technology Singapore Holding Pte Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate inductor having thermal interconnect structures
Patent number
11,690,165
Issue date
Jun 27, 2023
Intel Corporation
Michael J. Hill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic device
Patent number
11,676,758
Issue date
Jun 13, 2023
Cyntec Co., Ltd.
Wenyu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device, electronic apparatus, and method for supporting...
Patent number
11,658,106
Issue date
May 23, 2023
Fujitsu Limited
Kenichi Kawai
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Direct current blocking capacitors and method of attaching an IC pa...
Patent number
11,652,034
Issue date
May 16, 2023
International Business Machines Corporation
Darryl Becker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip-on-chip power devices embedded in PCB and cooling systems inco...
Patent number
11,647,579
Issue date
May 9, 2023
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display device
Patent number
11,646,301
Issue date
May 9, 2023
Au Optronics Corporation
Chi-Ho Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and apparatus for a shielding structure of surface-mount LTC...
Patent number
11,638,370
Issue date
Apr 25, 2023
Scientific Components Corporation
Aaron Vaisman
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Grant
Multilayer capacitor and circuit board containing the same
Patent number
11,636,978
Issue date
Apr 25, 2023
KYOCERA AVX Components Corporation
Jeffrey Cain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device
Patent number
11,582,861
Issue date
Feb 14, 2023
Murata Manufacturing Co., Ltd.
Takahiro Baba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer electronic device including a capacitor having a precise...
Patent number
11,563,414
Issue date
Jan 24, 2023
KYOCERA AVX Components Corporation
Kwang Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitor and capacitor module
Patent number
11,551,864
Issue date
Jan 10, 2023
Kabushiki Kaisha Toshiba
Keiichiro Matsuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a capacitive loop substrate assembly
Patent number
11,521,943
Issue date
Dec 6, 2022
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device using interposer in printed circuit board
Patent number
11,516,917
Issue date
Nov 29, 2022
Samsung Electronics Co., Ltd.
Junghoon Park
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Assembly structure and electronic device having the same
Patent number
11,503,731
Issue date
Nov 15, 2022
DELTA ELECTRONICS INC.
Haoyi Ye
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Medical ultrasonic treatment device
Patent number
11,490,991
Issue date
Nov 8, 2022
W&H Dentalwerk Bürmoos GmbH
Theresa Auer
B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information
Patent Grant
Touch LED component and touch device
Patent number
11,464,112
Issue date
Oct 4, 2022
Defond Electech Co., Ltd.
Lei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory card and memory card socket
Patent number
11,464,120
Issue date
Oct 4, 2022
Samsung Electronics Co., Ltd.
Seok-Jae Han
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of forming an electronic device
Patent number
11,432,448
Issue date
Aug 30, 2022
KEMET Electronics Corporation
John E. McConnell
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
Publication number
20240147624
Publication date
May 2, 2024
Canon Kabushiki Kaisha
NORITAKE TSUBOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
Publication number
20240090131
Publication date
Mar 14, 2024
HAMILTON SUNDSTRAND CORPORATION
Alexander Trotman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
Publication number
20240049393
Publication date
Feb 8, 2024
MELLANOX TECHNOLOGIES, LTD.
Xiuzhuang Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE DEVICE INCLUDING CAPACITOR DISPOSED ON OPPOSITE SIDE OF DIE...
Publication number
20240006391
Publication date
Jan 4, 2024
Samsung Electronics Co., Ltd.
Sangho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLIDER-BASED HBA INTERNAL LOCK
Publication number
20230389182
Publication date
Nov 30, 2023
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Warren A. Kartadinata
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKABLE VIA PACKAGE AND METHOD
Publication number
20230354523
Publication date
Nov 2, 2023
Amkor Technology Singapore Holding Pte. Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE
Publication number
20230345638
Publication date
Oct 26, 2023
Huawei Technologies Co., Ltd
Ying LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MAGNETIC DEVICE INCLUDING MULTILAYER WINDINGS
Publication number
20230317349
Publication date
Oct 5, 2023
Murata Manufacturing Co., Ltd.
Takayuki TANGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURI...
Publication number
20230309230
Publication date
Sep 28, 2023
MURATA MANUFACTURING CO., LTD.
Tsuyoshi TAKAKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20230309233
Publication date
Sep 28, 2023
KIOXIA Corporation
Satoru FUKUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURAL AND THERMAL MANAGEMENT OF AN INTEGRATED CIRCUIT
Publication number
20230282544
Publication date
Sep 7, 2023
Apple Inc.
Simon J. TRIVETT
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ELECTRONIC ASSEMBLY
Publication number
20230240011
Publication date
Jul 27, 2023
Analog Devices, Inc.
Hien Minh Pham
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC MODULE AND APPARATUS
Publication number
20230225054
Publication date
Jul 13, 2023
Canon Kabushiki Kaisha
Mitsutoshi Hasegawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVE...
Publication number
20230197622
Publication date
Jun 22, 2023
Intel Corporation
Karumbu Meyyappan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SER...
Publication number
20230197594
Publication date
Jun 22, 2023
Intel Corporation
Karumbu Meyyappan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multilayer Capacitor and Circuit Board Containing the Same
Publication number
20220392705
Publication date
Dec 8, 2022
KYOCERA AVX Components Corporation
Jeffrey Cain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-ON-CHIP POWER DEVICES EMBEDDED IN PCB AND COOLING SYSTEMS INCO...
Publication number
20220361315
Publication date
Nov 10, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Feng Zhou
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer Ceramic Capacitor Including Conductive Vias
Publication number
20220328248
Publication date
Oct 13, 2022
KYOCERA AVX Components Corporation
Marianne Berolini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
Publication number
20220295640
Publication date
Sep 15, 2022
TDK Corporation
Kazuhiro HAGITA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING VAPOR CHAMBERS WITH INTEGRATED...
Publication number
20220246492
Publication date
Aug 4, 2022
Toyota Motor Engineering & Manufacturing North America, Inc.
Shailesh N. Joshi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES
Publication number
20220240370
Publication date
Jul 28, 2022
Intel Corporation
Michael J. Hill
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
Publication number
20220192017
Publication date
Jun 16, 2022
Samsung Electro-Mechanics Co., Ltd.
Chan Hoon KO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT, INVERTER, AND MOTOR VEHICLE
Publication number
20220159841
Publication date
May 19, 2022
ZF Friedrichshafen AG
Thomas Maier
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
STACKABLE VIA PACKAGE AND METHOD
Publication number
20220117087
Publication date
Apr 14, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Akito Yoshida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer-Level Passive Array Packaging
Publication number
20220071013
Publication date
Mar 3, 2022
Apple Inc.
Scott D. Morrison
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
Publication number
20220011918
Publication date
Jan 13, 2022
SAMSUNG DISPLAY CO., LTD.
MIN-HONG KIM
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED COMPONENT AND PORWER SWITCHING DEVICE
Publication number
20220005795
Publication date
Jan 6, 2022
Huawei Technologies Co., Ltd
Zhixiang HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods and Apparatus for Package with Interposers
Publication number
20210391230
Publication date
Dec 16, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Lin Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECTANGULAR WAVEGUIDE COMMUNICATION BETWEEN MEMORY AND PROCESSOR
Publication number
20210391634
Publication date
Dec 16, 2021
Micron Technology, Inc.
Yoshihito Koya
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ELECTRONIC COMPONENT
Publication number
20210378098
Publication date
Dec 2, 2021
Analog Devices International Unlimited Company
John Brazzle
H01 - BASIC ELECTRIC ELEMENTS