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SEMICONDUCTOR PACKAGES
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Publication number 20250233094
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Publication date Jul 17, 2025
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Samsung Electronics Co., Ltd.
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Kyung Don Mun
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PAD SURFACE LEVELING DEVICE
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Publication number 20250105033
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Publication date Mar 27, 2025
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Shine Optics Technology Company Limited
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KUNG-AN LIN
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20240339489
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Publication date Oct 10, 2024
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SAMSUNG DISPLAY CO., LTD.
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Joo Woan CHO
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20240321800
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Publication date Sep 26, 2024
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E Ink Holdings Inc.
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Wenchuan Wang
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H01 - BASIC ELECTRIC ELEMENTS
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POWER CHIP PACKAGING STRUCTURE
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Publication number 20240282727
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Publication date Aug 22, 2024
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TONG HSING ELECTRONIC INDUSTRIES, LTD.
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Chung-Hsiao Lien
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGES
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Publication number 20240162181
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Publication date May 16, 2024
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Samsung Electronics Co., Ltd.
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Sun Jae KIM
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H01 - BASIC ELECTRIC ELEMENTS