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H01L2224/05541

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05541Structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,368,119
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Basin-shaped underbump plates and methods of forming the same
- Patent number 12,362,299
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yen-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,336,359
- Issue date Jun 17, 2025
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die surface treatment apparatus and die bonding system including th...
- Patent number 12,327,810
- Issue date Jun 10, 2025
- Semes Co., Ltd.
- Min Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via structure for semiconductor dies
- Patent number 12,308,331
- Issue date May 20, 2025
- Cirrus Logic Inc.
- Yaoyu Pang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective semiconductor elements for bonded structures
- Patent number 12,300,634
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element, apparatus, and chip
- Patent number 12,278,200
- Issue date Apr 15, 2025
- Canon Kabushiki Kaisha
- Junji Iwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure having elastic memb...
- Patent number 12,198,977
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch copper pillar package and method
- Patent number 12,191,241
- Issue date Jan 7, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,191,268
- Issue date Jan 7, 2025
- Apogee Semiconductor, Inc.
- David A. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 12,107,042
- Issue date Oct 1, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,015,048
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Joo Woan Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integral redistribution layer for WCSP
- Patent number 12,009,272
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the display device
- Patent number 12,002,815
- Issue date Jun 4, 2024
- Samsung Display Co., Ltd.
- Jihyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit for a hybrid molecular bonding
- Patent number 11,990,436
- Issue date May 21, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Emilie Bourjot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized high density substrate routing
- Patent number 11,984,396
- Issue date May 14, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional capacitor-inductor based on high functional densi...
- Patent number 11,869,827
- Issue date Jan 9, 2024
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package including under bump metal layer
- Patent number 11,862,589
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Hyung Sun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and package assembly including the same
- Patent number 11,855,025
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chita Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including adhesive film with conductive ball
- Patent number 11,824,034
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,817,404
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250233094
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kyung Don Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20250233086
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250210559
- Publication date Jun 26, 2025
- Innolux Corporation
- Kuo-Shun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS
- Publication number 20250192082
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Sangmin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250174584
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Dielectric Capping for Hybrid Bonding
- Publication number 20250149474
- Publication date May 8, 2025
- Applied Materials, Inc.
- Prayudi LIANTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PAD SURFACE LEVELING DEVICE
- Publication number 20250105033
- Publication date Mar 27, 2025
- Shine Optics Technology Company Limited
- KUNG-AN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY
- Publication number 20250079365
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...
- Publication number 20250079392
- Publication date Mar 6, 2025
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250015025
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED HIGH DENSITY SUBSTRATE ROUTING
- Publication number 20240421073
- Publication date Dec 19, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING
- Publication number 20240379564
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yi-Chu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240339489
- Publication date Oct 10, 2024
- SAMSUNG DISPLAY CO., LTD.
- Joo Woan CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240321800
- Publication date Sep 26, 2024
- E Ink Holdings Inc.
- Wenchuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
- Publication number 20240321904
- Publication date Sep 26, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jihyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...
- Publication number 20240304648
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- NAOKI YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGING STRUCTURE
- Publication number 20240282727
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chung-Hsiao Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING
- Publication number 20240276735
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM STRUCTURE, DISPLAY DEVICE AND SPLICED DISPLAY DEVICE
- Publication number 20240243067
- Publication date Jul 18, 2024
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Yong FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

Semiconductor package

Bonding layer and process of making

Basin-shaped underbump plates and methods of forming the same

Semiconductor package

Display device

Die surface treatment apparatus and die bonding system including th...

Via structure for semiconductor dies

Protective semiconductor elements for bonded structures

Semiconductor element, apparatus, and chip

Semiconductor device and method for manufacturing the same

Bond pads for semiconductor die assemblies and associated methods a...

Semiconductor device, semiconductor package and method of manufactu...

Manufacturing method of semiconductor structure having elastic memb...

Fine pitch copper pillar package and method

Integrated circuit packages having stress-relieving features

Semiconductor package including stacked semiconductor chips

Localized high density substrate routing

Semiconductor structure and method for forming semiconductor struct...

Display device

Integral redistribution layer for WCSP

Display device and method of manufacturing the display device

Electronic circuit for a hybrid molecular bonding

Localized high density substrate routing

Semiconductor package including a dummy pad

Three-dimensional capacitor-inductor based on high functional densi...

Wafer-level package including under bump metal layer

Semiconductor device and package assembly including the same

Display device including adhesive film with conductive ball

Post passivation interconnect

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

PACKAGING DEVICE AND MANUFACTURING METHOD THEREOF

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Selective Dielectric Capping for Hybrid Bonding

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

CHIP PAD SURFACE LEVELING DEVICE

SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY

HYBRID BONDING INTERCONNECT (HBI) ARCHITECTURES AND METHODS FOR SCA...

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MAKING

DISPLAY DEVICE

SILICON CARBIDE SEMICONDUCTOR DEVICE

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE

SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR SOLID-STATE...

POWER CHIP PACKAGING STRUCTURE

METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING

CHIP-ON-FILM STRUCTURE, DISPLAY DEVICE AND SPLICED DISPLAY DEVICE

SEMICONDUCTOR PACKAGES