the additional leads being a bump or a wire

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/4952the additional leads being a bump or a wire

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,354,981
- Issue date Jul 8, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,354,934
- Issue date Jul 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Siang Miang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacture
- Patent number 12,347,751
- Issue date Jul 1, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,347,756
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,334,420
- Issue date Jun 17, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leaded semiconductor device package having leads with different widths
- Patent number 12,334,417
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mask for thermal pad of a printed circuit board to provide r...
- Patent number 12,322,692
- Issue date Jun 3, 2025
- STMicroelectronics Pte Ltd
- Daniel Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 12,315,826
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wire pieces in bonding member
- Patent number 12,315,825
- Issue date May 27, 2025
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip having power tran...
- Patent number 12,308,356
- Issue date May 20, 2025
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual cool power module with stress buffer layer
- Patent number 12,300,689
- Issue date May 13, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jonghwan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with electrical component for bridging leadfra...
- Patent number 12,300,585
- Issue date May 13, 2025
- STMicroelectronics S.r.l.
- Alberto Arrigoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including heat sink with exposed side from enc...
- Patent number 12,300,584
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture for a cascode semiconductor device
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- Issue date May 6, 2025
- Nexperia B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor packaging unit having a plurality of bridging la...
- Patent number 12,288,737
- Issue date Apr 29, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,288,739
- Issue date Apr 29, 2025
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having an embedded inlay
- Patent number 12,283,538
- Issue date Apr 22, 2025
- Infineon Technologies AG
- Marcus Boehm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe spacer for double-sided power module
- Patent number 12,278,158
- Issue date Apr 15, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a drain back contact electrode, met...
- Patent number 12,272,743
- Issue date Apr 8, 2025
- GPOWER SEMICONDUCTOR, INC.
- Junfeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a metal clip and related methods of ma...
- Patent number 12,266,628
- Issue date Apr 1, 2025
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- Engku Izyan Munirah E Afandi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including lead with varying thickness
- Patent number 12,261,094
- Issue date Mar 25, 2025
- Rohm Co., Ltd.
- Ryota Majima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,255,127
- Issue date Mar 18, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidekazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 12,255,115
- Issue date Mar 18, 2025
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,249,560
- Issue date Mar 11, 2025
- Rohm Co., Ltd
- Kazunori Fuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank and related methods
- Patent number 12,243,810
- Issue date Mar 4, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with solder barriers on leads
- Patent number 12,237,249
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top circuit and an IC with a gap over th...
- Patent number 12,237,247
- Issue date Feb 25, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 12,230,555
- Issue date Feb 18, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250226296
- Publication date Jul 10, 2025
- ROHM CO., LTD.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Power Semiconductor Package with Sidewall Contacts
- Publication number 20250226293
- Publication date Jul 10, 2025
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...
- Publication number 20250226298
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Richard P. Sheridan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE TRANSFORMER POWER MODULES
- Publication number 20250218908
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Giacomo CALABRESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
- Publication number 20250218886
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel MANACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH RETAINING FEATURES
- Publication number 20250218907
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE
- Publication number 20250210471
- Publication date Jun 26, 2025
- NXP B.V.
- Chanon SUWANKASAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE DEVICE CLIP
- Publication number 20250210579
- Publication date Jun 26, 2025
- NEXPERIA B.V.
- Dolores Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS
- Publication number 20250201675
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250201676
- Publication date Jun 19, 2025
- INFINEON TECHNOLOGIES AG
- Achim Althaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...
- Publication number 20250201682
- Publication date Jun 19, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250201679
- Publication date Jun 19, 2025
- DENSO CORPORATION
- Mitsuki KAWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING DEVICE
- Publication number 20250192009
- Publication date Jun 12, 2025
- ACTRON TECHNOLOGY CORPORATION
- PEN-HUNG HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...
- Publication number 20250192008
- Publication date Jun 12, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183109
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Chien-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20250183125
- Publication date Jun 5, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame
- Publication number 20250183128
- Publication date Jun 5, 2025
- NEXPERIA B.V.
- Shun Tik Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183099
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Yi-Hung HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Silicon on Passive Package
- Publication number 20250183127
- Publication date Jun 5, 2025
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT
- Publication number 20250174525
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE
- Publication number 20250172434
- Publication date May 29, 2025
- DENSO CORPORATION
- Kazuaki FUJISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167063
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Takeshi TOKOROZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MINIATURE SENSOR CAVITIES
- Publication number 20250164296
- Publication date May 22, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250167079
- Publication date May 22, 2025
- Mitsubishi Electric Corporation
- Ryoji MURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250149409
- Publication date May 8, 2025
- Fuji Electric Co., Ltd.
- Hideo AMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES
- Publication number 20250149473
- Publication date May 8, 2025
- Qorvo US, Inc.
- Soack-Dae Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20250140661
- Publication date May 1, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...
- Publication number 20250140654
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Jing GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140652
- Publication date May 1, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a bump or a wire

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device

Semiconductor device and a method of manufacture

Semiconductor device

Semiconductor devices and methods of manufacturing semiconductor de...

Leaded semiconductor device package having leads with different widths

Solder mask for thermal pad of a printed circuit board to provide r...

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor device having wire pieces in bonding member

Semiconductor device including semiconductor chip having power tran...

Dual cool power module with stress buffer layer

Semiconductor device with electrical component for bridging leadfra...

Semiconductor device including heat sink with exposed side from enc...

Method of manufacture for a cascode semiconductor device

Thin semiconductor packaging unit having a plurality of bridging la...

Semiconductor device and method for manufacturing the same

Molded semiconductor package having an embedded inlay

Leadframe spacer for double-sided power module

Semiconductor device comprising a drain back contact electrode, met...

Double-sided coolable semiconductor package

Semiconductor package having a metal clip and related methods of ma...

Semiconductor device including lead with varying thickness

Semiconductor device and method for manufacturing the same

Electronic devices in semiconductor package cavities

Electronic device and method for manufacturing electronic device

Semiconductor package with wettable flank and related methods

Substrates with solder barriers on leads

Semiconductor package with top circuit and an IC with a gap over th...

Semiconductor packages with vertical passive components

Packaged stackable electronic power device for surface mounting and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Embedded Power Semiconductor Package with Sidewall Contacts

EMBEDDABLE TILES CONTAINING PASSIVE DEVICES FOR PACKAGED SEMICONDUC...

MULTI-DIE TRANSFORMER POWER MODULES

ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES

LEADFRAME WITH RETAINING FEATURES

SEMICONDUCTOR CHIP PACKAGING DEFECT FREE DIMPLE PROCESS AND DEVICE

POWER STAGE DEVICE CLIP

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SURFACE MOUNT PACKAGE HAVING AN INTERNAL REDUNDANT ELECTRICAL CONNE...

SEMICONDUCTOR DEVICE

DRIVING DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Lead Frame

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Molded Silicon on Passive Package

RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT

TEMPERATURE SENSOR MODULE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

MINIATURE SENSOR CAVITIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

RF ABSORBING COVER INTEGRATED IN MMIC PACKAGES

LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...

SEMICONDUCTOR MODULE