the additional leads being a bump or a wire

Industry

CPC
H01L23/4952

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4952the additional leads being a bump or a wire

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor package and method
- Patent number 12,218,038
- Issue date Feb 4, 2025
- Infineon Technologies Austria AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,211,829
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having first and second lead frames
- Patent number 12,211,824
- Issue date Jan 28, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive member cavities
- Patent number 12,205,871
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Miniature sensor cavities
- Patent number 12,203,776
- Issue date Jan 21, 2025
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier device and semiconductor die
- Patent number 12,206,371
- Issue date Jan 21, 2025
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van Der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 12,191,262
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,176,271
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,176,302
- Issue date Dec 24, 2024
- Rohm Co., Ltd.
- Hidetoshi Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wettable flank
- Patent number 12,176,272
- Issue date Dec 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min Ler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection member, electrical connection structure, and...
- Patent number 12,176,315
- Issue date Dec 24, 2024
- Hitachi Metals, Ltd.
- Junya Nishina
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming substrate with 3-sided w...
- Patent number 12,176,273
- Issue date Dec 24, 2024
- Semtech Corporation
- Henry D. Bathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded silicon on passive package
- Patent number 12,165,956
- Issue date Dec 10, 2024
- Apple Inc.
- Kumar Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, encapsulated package with punched lead and sawn side fla...
- Patent number 12,165,959
- Issue date Dec 10, 2024
- Infineon Technologies AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory structure
- Patent number 12,161,056
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chieh-Fei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with lead between a plurality of encapsulated...
- Patent number 12,159,816
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Kentaro Nasu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond damage detector including a detection bond pad over a fir...
- Patent number 12,159,808
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Hung-Yun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection arrangements for integrated lateral diffusion field effe...
- Patent number 12,159,815
- Issue date Dec 3, 2024
- Silanna Pte Ltd
- Shanghui Larry Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a semiconductor chip
- Patent number 12,154,865
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi Kawashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having tubular walled sensing cavity
- Patent number 12,135,303
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Christlyn Faith Arias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packages with internal moisture barriers
- Patent number 12,125,806
- Issue date Oct 22, 2024
- Wolfspeed, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...
- Publication number 20250054843
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Frank Singer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY STRUCTURE
- Publication number 20250048943
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Fei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH LEAD LOCK
- Publication number 20250038077
- Publication date Jan 30, 2025
- TEXAS INSTRUMENTS INCORPORATED
- CHU-YUN LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20250038075
- Publication date Jan 30, 2025
- Huawei Technologies Co., Ltd
- Weichuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE
- Publication number 20250038098
- Publication date Jan 30, 2025
- Fuji Electric Co., Ltd.
- Tomomi NONAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250038737
- Publication date Jan 30, 2025
- Mitsubishi Electric Corporation
- Teruaki NAGAHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE
- Publication number 20250029901
- Publication date Jan 23, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Silnore Tejero SABANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE DEVICE
- Publication number 20250022846
- Publication date Jan 16, 2025
- FORCE MOS TECHNOLOGY CO., LTD.
- YUAN-SHUN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR HAVING TUBULAR WALLED SENSING CAVITY
- Publication number 20250020610
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Christlyn Faith ARIAS
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022777
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Shingo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
- Publication number 20250022782
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240429135
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...
- Publication number 20240421045
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...
- Publication number 20240404982
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Marian Sebastian Broll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SENSE COIL
- Publication number 20240395736
- Publication date Nov 28, 2024
- ALLEGRO MICROSYSTEMS, LLC
- John Horan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387314
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...
- Publication number 20240379518
- Publication date Nov 14, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nicholas L. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT
- Publication number 20240369598
- Publication date Nov 7, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Robert Allan NEIDORFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS
- Publication number 20240371732
- Publication date Nov 7, 2024
- NXP USA, Inc.
- Pat Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371817
- Publication date Nov 7, 2024
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES
- Publication number 20240363503
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS
- Publication number 20240363563
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Shu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...
- Publication number 20240363504
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CONTROL SYSTEM
- Publication number 20240363500
- Publication date Oct 31, 2024
- RENESAS ELECTRONICS CORPORATION
- Yoshimasa UCHINUMA
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a bump or a wire

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having cavities at an interface of an encapsul...

Leadframe, semiconductor package and method

Semiconductor package

Power semiconductor package having first and second lead frames

Conductive member cavities

Miniature sensor cavities

Power amplifier device and semiconductor die

Package structure and method for fabricating the same

Semiconductor device

Integrated magnetic assembly with conductive field plates

Floating die package

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package with wettable flank

Electrical connection member, electrical connection structure, and...

Semiconductor device and method of forming substrate with 3-sided w...

Semiconductor device

Molded silicon on passive package

Leadframe, encapsulated package with punched lead and sawn side fla...

Memory structure

Semiconductor device with lead between a plurality of encapsulated...

Wire bond damage detector including a detection bond pad over a fir...

Connection arrangements for integrated lateral diffusion field effe...

Power semiconductor device including a semiconductor chip

Semiconductor package with nickel-silver pre-plated leadframe

Package including multiple semiconductor devices

Sensor having tubular walled sensing cavity

Heat slug attached to a die pad for semiconductor package

Electronic device packages with internal moisture barriers

Method of forming a semiconductor package with connection lug

Patents Applicationslast 30 patents

PACKAGE AND SEMICONDUCTOR DEVICE

Leadframe, Encapsulated Package with Punched Lead and Sawn Side Fla...

MEMORY STRUCTURE

ELECTRONIC DEVICE WITH LEAD LOCK

CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE

TERMINAL, METHOD FOR MANUFACTURING TERMINAL, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

COMPACT DIRECT-BONDED METAL SUBSTRATE PACKAGE

MULTI-CHIP PACKAGE DEVICE

SENSOR HAVING TUBULAR WALLED SENSING CAVITY

SEMICONDUCTOR DEVICE

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

DIE ATTACH SURFACE COPPER LAYER WITH PROTECTIVE LAYER FOR MICROELEC...

POWER SEMICONDUCTOR MODULE HAVING A METALLIC CLIP WITH ULTRASONICAL...

TRANSFORMER-BASED ISOLATOR WITH SENSE COIL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

INTERPOSER FOR IMPLEMENTING FLIP-CHIP DIES IN WIREBONDED CIRCUIT AS...

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

INTEGRATED CIRCUIT PACKAGE WITH CURRENT SENSE ELEMENT

LEADLESS SEMICONDUCTOR PACKAGE WITH SHIELDED DIE-TO-PAD CONTACTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICES WITH DOUBLE-SIDED FANOUT CHIP PACKAGES

PASSIVATION STRUCTURE WITH INCREASED THICKNESS FOR METAL PADS

ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...

SEMICONDUCTOR DEVICE AND CONTROL SYSTEM