the additional leads being a bump or a wire

Industry

CPC
H01L23/4952

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4952the additional leads being a bump or a wire

Industries

Patents Grantslast 30 patents

Information Patent Grant
Modularized power amplifier devices and architectures
- Patent number 11,967,937
- Issue date Apr 23, 2024
- Viasat, Inc.
- Shih Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,961,879
- Issue date Apr 16, 2024
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,948,869
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Naoki Okawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for thin film capacitor integration
- Patent number 11,948,871
- Issue date Apr 2, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices in semiconductor package cavities
- Patent number 11,942,386
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Christopher Daniel Manack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic components, corresponding electronic...
- Patent number 11,935,818
- Issue date Mar 19, 2024
- STMicroelectronics S.r.l.
- Fabio Marchisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,820
- Issue date Mar 19, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Tomohiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames for cooling a power device
- Patent number 11,929,307
- Issue date Mar 12, 2024
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,923,278
- Issue date Mar 5, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,923,447
- Issue date Mar 5, 2024
- Fujitsu Limited
- Junya Yaita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 11,915,998
- Issue date Feb 27, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyung Jun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a carrier, semiconductor chip packages...
- Patent number 11,915,999
- Issue date Feb 27, 2024
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,908,778
- Issue date Feb 20, 2024
- Denso Corporation
- Hiroshi Ishino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plurality of leads and sealing resin
- Patent number 11,908,777
- Issue date Feb 20, 2024
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current packages with reduced solder layer count
- Patent number 11,901,271
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package assemblies with direct leadframe attac...
- Patent number 11,901,309
- Issue date Feb 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including lead with varying thickness
- Patent number 11,894,281
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Ryota Majima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 11,894,290
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a transmitting insulating element
- Patent number 11,894,321
- Issue date Feb 6, 2024
- Rohm Co., Ltd.
- Yoshizo Osumi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,887,916
- Issue date Jan 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Hyeong Il Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having outer terminal portions with conductive...
- Patent number 11,887,915
- Issue date Jan 30, 2024
- Amkor Technology Japan, Inc.
- Masafumi Suzuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing transformers with laminate windings and bui...
- Patent number 11,869,855
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Zhemin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 11,862,579
- Issue date Jan 2, 2024
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136320
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE
- Publication number 20240136257
- Publication date Apr 25, 2024
- Mitsubishi Electric Corporation
- Takuya SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...
- Publication number 20240136260
- Publication date Apr 25, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR
- Publication number 20240136256
- Publication date Apr 25, 2024
- NXP B.V.
- Frank.zy Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240136434
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Taojun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128169
- Publication date Apr 18, 2024
- ROHM CO., LTD.
- Hajime OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240128166
- Publication date Apr 18, 2024
- Mitsubishi Electric Corporation
- Hiroyuki MASUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PACKAGE AND FABRICATING METHOD OF THE SAME
- Publication number 20240128168
- Publication date Apr 18, 2024
- UNITED MICROELECTRONICS CORP.
- Chiu-Feng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240120260
- Publication date Apr 11, 2024
- NEXPERIA B.V.
- Tim Böttcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240120262
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Hyeong Il JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240112988
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Kaori UEBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112992
- Publication date Apr 4, 2024
- ROHM CO., LTD.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105562
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105563
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Toru SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
- Publication number 20240105557
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE
- Publication number 20240096734
- Publication date Mar 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Tzu-Hsuan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...
- Publication number 20240096761
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- BARRY JON MALE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDI...
- Publication number 20240096737
- Publication date Mar 21, 2024
- Hyundai Motor Company
- Myung Ill YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE HAVING DIE PAD WITH PROTECTIVE LAYER
- Publication number 20240096758
- Publication date Mar 21, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE
- Publication number 20240096765
- Publication date Mar 21, 2024
- NEXPERIA B.V.
- Homer Gler Malveda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087973
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Ryota Majima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...
- Publication number 20240087992
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240087991
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jae Hyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087996
- Publication date Mar 14, 2024
- ROHM CO., LTD.
- Kazuki OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088086
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masatoshi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079368
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Satoshi HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240079296
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE, AN...
- Publication number 20240079491
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Teruyuki OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...
- Publication number 20240071876
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Akira ISO
- H01 - BASIC ELECTRIC ELEMENTS

the additional leads being a bump or a wire

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modularized power amplifier devices and architectures

IC including capacitor having segmented bottom plate

Electronic component apparatus having a first lead frame and a seco...

Package-embedded board

Semiconductor device and method for manufacturing the same

Process for thin film capacitor integration

Electronic devices in semiconductor package cavities

Semiconductor package having an interdigitated mold arrangement

Method of producing electronic components, corresponding electronic...

Circuit module having a plurality of lead frames connected to a sub...

Semiconductor device

Plurality of lead frames for cooling a power device

Semiconductor module

Semiconductor device including a bidirectional switch

Semiconductor device, method of manufacturing semiconductor device,...

Semiconductor device and a method of manufacturing a semiconductor...

Semiconductor device having a carrier, semiconductor chip packages...

Semiconductor module

Semiconductor package with plurality of leads and sealing resin

High current packages with reduced solder layer count

Semiconductor device package assemblies with direct leadframe attac...

Semiconductor device including lead with varying thickness

Packaged stackable electronic power device for surface mounting and...

Semiconductor device with a transmitting insulating element

Manufacturing method of semiconductor device and semiconductor device

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device having outer terminal portions with conductive...

Semiconductor device having a metallization structure

Method of manufacturing transformers with laminate windings and bui...

Semiconductor device having cavities at an interface of an encapsul...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE

PACKAGED HIGH VOLTAGE MOSFET DEVICE WITH CONNECTION CLIP AND MANUFA...

SEMICONDUCTOR DEVICE WITH THERMAL DISSIPATION AND METHOD THEREFOR

NITRIDE SEMICONDUCTOR ELEMENT AND NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

QFN PACKAGE AND FABRICATING METHOD OF THE SAME

Semiconductor Package Assembly

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...

LEADFRAME SPACER FOR DOUBLE-SIDED POWER MODULE

SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER TH...

MULTI-LAYERED SPACER AND DOUBLE-SIDED COOLING POWER MODULE INCLUDI...

CHIP PACKAGE HAVING DIE PAD WITH PROTECTIVE LAYER

REDUCED STRESS CLIP FOR SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE

CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, INVERTER CIRCUIT, DRIVING DEVICE, VEHICLE, AN...

SEMICONDUCTOR MODULE, POWER CONVERTER, AND POWER CONVERTER MANUFACT...