the bent parts being the outer leads

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CPC
H01L23/49555

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49555the bent parts being the outer leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,347,752
- Issue date Jul 1, 2025
- Rohm Co., Ltd.
- Yoshikatsu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 12,334,414
- Issue date Jun 17, 2025
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge bend for isolation packages
- Patent number 12,293,953
- Issue date May 6, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,272,625
- Issue date Apr 8, 2025
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent power module containing exposed surfaces of transistor...
- Patent number 12,249,562
- Issue date Mar 11, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 12,218,074
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of power semiconductor module
- Patent number 12,205,872
- Issue date Jan 21, 2025
- STARPOWER SEMICONDUCTOR LTD.
- Danting Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage electronic device with high relative permit...
- Patent number 12,170,164
- Issue date Dec 17, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having at least one resin part that closes one...
- Patent number 12,119,279
- Issue date Oct 15, 2024
- Mitsubishi Electric Corporation
- Mamoru Togami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead adapters for semiconductor package
- Patent number 12,113,000
- Issue date Oct 8, 2024
- Infineon Technologies AG
- Ajay Poonjal Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 12,087,676
- Issue date Sep 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 12,074,098
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with surface contact wire extensions
- Patent number 12,040,260
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder surface features for integrated circuit packages
- Patent number 12,021,011
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 11,973,009
- Issue date Apr 30, 2024
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with semiconductor packages mounted on metal frame
- Patent number 11,973,012
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Packaged module and metal plate
- Patent number 11,955,891
- Issue date Apr 9, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,935,820
- Issue date Mar 19, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Tomohiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising first and second lead frames
- Patent number 11,929,306
- Issue date Mar 12, 2024
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250210477
- Publication date Jun 26, 2025
- QUANZHOU SANAN INTEGRATED CIRCUIT CO., LTD.
- Kai CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250210475
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Ryotaro KAKIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201673
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuki MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20250201677
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...
- Publication number 20250201653
- Publication date Jun 19, 2025
- Vishay General Semiconductor LLC
- Huiying DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE
- Publication number 20250201680
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Lung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20250183131
- Publication date Jun 5, 2025
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
- Publication number 20250174531
- Publication date May 29, 2025
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140729
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140656
- Publication date May 1, 2025
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITIES IN PACKAGE CONDUCTIVE TERMINALS
- Publication number 20250140655
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20250125228
- Publication date Apr 17, 2025
- STMicroelectronics International N.V.
- Guendalina CATALANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118699
- Publication date Apr 10, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...
- Publication number 20250111987
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Enis TUNCER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF
- Publication number 20250112128
- Publication date Apr 3, 2025
- NXP USA, Inc.
- You Ge
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20250105106
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Sheila Dimol RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE
- Publication number 20250096084
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Vijaylaxmi Khanolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250069996
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250069998
- Publication date Feb 27, 2025
- ROHM CO., LTD.
- Takahiro KOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Converter Package with Integrated Inductor
- Publication number 20250046684
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250022777
- Publication date Jan 16, 2025
- ROHM CO., LTD.
- Shingo YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Manufacturing Thereof
- Publication number 20250022780
- Publication date Jan 16, 2025
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
- Publication number 20250006693
- Publication date Jan 2, 2025
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240429135
- Publication date Dec 26, 2024
- NEXPERIA B.V.
- Vegneswary Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240377851
- Publication date Nov 14, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Satoshi ENDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE
- Publication number 20240371712
- Publication date Nov 7, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS

the bent parts being the outer leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Inverted leads for packaged isolation devices

Power semiconductor device with dual heat dissipation structures

Edge bend for isolation packages

Semiconductor device and method of manufacturing semiconductor device

Conductive members atop semiconductor packages

Intelligent power module containing exposed surfaces of transistor...

DC and AC magnetic field protection for MRAM device using magnetic-...

Semiconductor device and method of manufacturing the same

Packaging structure of power semiconductor module

Integrated high voltage electronic device with high relative permit...

Semiconductor device having at least one resin part that closes one...

Press-fit power module and related methods

Lead adapters for semiconductor package

Package with electrically insulated carrier and at least one step o...

Semiconductor devices having a plurality of offsets in leads suppor...

Semiconductor device, printed circuit board (PCB), and method of in...

Three-dimensional functional integration

Multichip packaged semiconductor device

Electronic package with surface contact wire extensions

Solder surface features for integrated circuit packages

Packages with electrical fuses

Lead frame assembly for a semiconductor device

Power module with semiconductor packages mounted on metal frame

Semiconductor device

Packaged module and metal plate

Semiconductor device

Semiconductor device comprising first and second lead frames

Semiconductor device including a bidirectional switch

Power semiconductor device with dual heat dissipation structures

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

ENHANCED COOLING PACKAGE FOR IMPROVED THERMAL MANAGEMENT FOR ELECTR...

INTELLIGENT POWER MODULE

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURIN...

ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME

MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT

SEMICONDUCTOR MODULE

CAVITIES IN PACKAGE CONDUCTIVE TERMINALS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

SEMICONDUCTOR DEVICE

INTEGRATED HIGH VOLTAGE ELECTRONIC DEVICE WITH HIGH RELATIVE PERMIT...

PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MAKING THEREOF

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THEREOF

INTEGRATED STACKED SUBSTRATE FOR ISOLATED POWER MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

Converter Package with Integrated Inductor

SEMICONDUCTOR DEVICE

Semiconductor Devices and Methods for Manufacturing Thereof

METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR DEVICE

METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

PACKAGES WITH ELECTRICAL FUSES