the bent parts being the outer leads

Industry

CPC
H01L23/49555

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49555the bent parts being the outer leads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Lead frame assembly for a semiconductor device
- Patent number 11,973,009
- Issue date Apr 30, 2024
- Nexperia B.V.
- Ricardo Lagmay Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with semiconductor packages mounted on metal frame
- Patent number 11,973,012
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module and metal plate
- Patent number 11,955,891
- Issue date Apr 9, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhiqiang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number RE49912
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Akihiro Kimura
Information Patent Grant
Semiconductor device
- Patent number 11,935,820
- Issue date Mar 19, 2024
- Sansha Electric Manufacturing Co., Ltd.
- Tomohiro Yamanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising first and second lead frames
- Patent number 11,929,306
- Issue date Mar 12, 2024
- Kabushiki Kaisha Toshiba
- Kakeru Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package having a negative standoff
- Patent number 11,862,541
- Issue date Jan 2, 2024
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Leads for leadframe and semiconductor package
- Patent number 11,830,791
- Issue date Nov 28, 2023
- Texas Instruments Incorporated
- You Chye How
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded RF power package
- Patent number 11,823,986
- Issue date Nov 21, 2023
- Ampleon Netherlands B.V.
- Leonardus Theodorus Maria Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated semiconductor devices
- Patent number 11,791,248
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead frames having rounded corners and related packages and methods
- Patent number 11,769,713
- Issue date Sep 26, 2023
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,742,264
- Issue date Aug 29, 2023
- Rohm Co., Ltd.
- Yoshikatsu Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flippable leadframe for packaged electronic system having verticall...
- Patent number 11,742,263
- Issue date Aug 29, 2023
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DC and AC magnetic field protection for MRAM device using magnetic-...
- Patent number 11,715,702
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a plurality of offsets in leads suppor...
- Patent number 11,694,946
- Issue date Jul 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Min Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional functional integration
- Patent number 11,682,609
- Issue date Jun 20, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 11,658,243
- Issue date May 23, 2023
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having inner lead exposed from sealing resin,...
- Patent number 11,652,032
- Issue date May 16, 2023
- Mitsubishi Electric Corporation
- Keitaro Ichikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with heatsink
- Patent number 11,616,006
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,605,577
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with expanded heat spreader
- Patent number 11,600,547
- Issue date Mar 7, 2023
- Infineon Technologies Austria AG
- Jo Ean Joanna Chye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated outward and inward bent leads for packaged electroni...
- Patent number 11,569,154
- Issue date Jan 31, 2023
- Texas Instruments Incorporated
- Mohammad Waseem Hussain
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE HAVING MIRRORED LEADS
- Publication number 20240128140
- Publication date Apr 18, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...
- Publication number 20240112993
- Publication date Apr 4, 2024
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105666
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Daisuke Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...
- Publication number 20240096767
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Hank Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR
- Publication number 20240096763
- Publication date Mar 21, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...
- Publication number 20240087992
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240087995
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING
- Publication number 20240090130
- Publication date Mar 14, 2024
- Semiconductor Components Industries, LLC
- Chad CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...
- Publication number 20240079293
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-In-One Lead Frame Package
- Publication number 20240071878
- Publication date Feb 29, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PLATED LEAD TIP FOR WETTABLE FLANK LEADFRAME
- Publication number 20240055327
- Publication date Feb 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION
- Publication number 20240047316
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS MODULE
- Publication number 20240047320
- Publication date Feb 8, 2024
- ZF Friedrichshafen AG
- Ake Ewald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE
- Publication number 20240030108
- Publication date Jan 25, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030298
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030212
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Tomohira KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006274
- Publication date Jan 4, 2024
- ROHM CO., LTD.
- Ryohei UMENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230402354
- Publication date Dec 14, 2023
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230378031
- Publication date Nov 23, 2023
- DENSO CORPORATION
- Hiroshi ISHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20230377124
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE
- Publication number 20230361008
- Publication date Nov 9, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Wei Fen Sueann Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230352374
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Min BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352375
- Publication date Nov 2, 2023
- Rohm Co., Ltd.
- Yoshikatsu MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS
- Publication number 20230335474
- Publication date Oct 19, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE
- Publication number 20230317571
- Publication date Oct 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hsiang Ming Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME OF SEMICONDUCTOR DEVICE, INTEGRATED-TYPE LEAD FRAME OF S...
- Publication number 20230317572
- Publication date Oct 5, 2023
- Mitsubishi Electric Corporation
- Kazufumi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...
- Publication number 20230317629
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS

the bent parts being the outer leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lead frame assembly for a semiconductor device

Power module with semiconductor packages mounted on metal frame

Packaged module and metal plate

Semiconductor device

Semiconductor device

Semiconductor device comprising first and second lead frames

Semiconductor device including a bidirectional switch

Power semiconductor device with dual heat dissipation structures

Manufacturing method of semiconductor device and semiconductor device

Package with electrically insulated carrier and at least one step o...

Molded semiconductor package having a negative standoff

Power module apparatus, cooling structure, and electric vehicle or...

Leads for leadframe and semiconductor package

Molded RF power package

Coated semiconductor devices

Universal semiconductor package molds

Exposed pad integrated circuit package

Lead frames having rounded corners and related packages and methods

Semiconductor device

Flippable leadframe for packaged electronic system having verticall...

DC and AC magnetic field protection for MRAM device using magnetic-...

Semiconductor devices having a plurality of offsets in leads suppor...

Method for manufacturing a semiconductor device having a semiconduc...

Three-dimensional functional integration

Inverted leads for packaged isolation devices

Semiconductor device having inner lead exposed from sealing resin,...

Semiconductor package with heatsink

Semiconductor device including a bidirectional switch

Semiconductor package with expanded heat spreader

Interdigitated outward and inward bent leads for packaged electroni...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

POWER MODULE PACKAGE HAVING MIRRORED LEADS

Semiconductor Device Comprising a Leadframe Adapted for Higher Curr...

SEMICONDUCTOR DEVICE

VERTICAL HIGH CURRENT HALL SENSOR WITH INTEGRATED HEAT SLUG CURRENT...

PACKAGE STRUCTURE FOR ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR

CHIP PACKAGE, CHIP SYSTEM, METHOD OF FORMING A CHIP PACKAGE, AND ME...

POWER SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...

SEMICONDUCTOR DEVICE

Two-In-One Lead Frame Package

PRE-PLATED LEAD TIP FOR WETTABLE FLANK LEADFRAME

JUMP-FUSING AND TAILORED PCB SYSTEM FOR LOOP INDUCTANCE REDUCTION

POWER ELECTRONICS MODULE

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

ELECTRONIC DEVICE WITH HIGH DRAFT ANGLE PACKAGE STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE PACKAGE HAVING LEAD FRAME ANCHORED BARS

LEAD FINGER WITH Z-DIRECTION OBSTRUCTION FEATURE

LEAD FRAME OF SEMICONDUCTOR DEVICE, INTEGRATED-TYPE LEAD FRAME OF S...

DC AND AC MAGNETIC FIELD PROTECTION FOR MRAM DEVICE USING MAGNETIC-...