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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32221the body and the item being stacked

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including base member with protruding portion...
- Patent number 12,170,255
- Issue date Dec 17, 2024
- Mitsubishi Electric Corporation
- Toshiaki Kitano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seamless interconnect thresholds using dielectric fluid channels
- Patent number 12,154,837
- Issue date Nov 26, 2024
- Sciperio, Inc.
- Jason Benoit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer stencil for controlling die attach material thickness on die
- Patent number 12,142,549
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Mario Alfonso Eduardo Magana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure
- Patent number 12,107,069
- Issue date Oct 1, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Nohora-Lizeth Caicedo Panqueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, heat dissipation structure and manufacturing me...
- Patent number 12,080,618
- Issue date Sep 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body, method for manufacturing connection body, and conn...
- Patent number 12,034,260
- Issue date Jul 9, 2024
- Dexerials Corporation
- Ryota Aizaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
- Patent number 12,027,442
- Issue date Jul 2, 2024
- ARIECA INC.
- Jeffrey Gelorme
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control element utilized in device die packages
- Patent number 11,955,406
- Issue date Apr 9, 2024
- Google LLC
- Yingying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill for chip packaging and chip packaging structure
- Patent number 11,804,463
- Issue date Oct 31, 2023
- Wuhan Choice Technology Co, Ltd
- De Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,791,314
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,705,423
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,417,577
- Issue date Aug 16, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 11,387,209
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame wiring structure and semiconductor module
- Patent number 11,302,612
- Issue date Apr 12, 2022
- Fuji Electric Co., Ltd.
- Ryo Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,233,011
- Issue date Jan 25, 2022
- Hitachi Astemo, Ltd.
- Takashi Hirao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a heat dissipating element and method of man...
- Patent number 11,164,855
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and cooling structures having metalized exte...
- Patent number 11,121,060
- Issue date Sep 14, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yuji Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure
- Patent number 11,107,808
- Issue date Aug 31, 2021
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for a package substrate
- Patent number 10,903,127
- Issue date Jan 26, 2021
- Samsung Electronics Co., Ltd.
- So Young Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Multi-chip module hybrid integrated circuit with multiple power zon...
- Patent number 10,854,586
- Issue date Dec 1, 2020
- BAE Systems Information and Electronics Systems Integration Inc.
- Lori D. Dennis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing 3DIC structure
- Patent number 10,797,015
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,699,983
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- Kil-soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for package substrate, semiconductor package, display device,...
- Patent number 10,699,974
- Issue date Jun 30, 2020
- Samsung Electronics Co., Ltd.
- So Young Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device that includes a copper layer disposed on...
- Patent number 10,643,967
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Hiroaki Okabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...
- Publication number 20240421139
- Publication date Dec 19, 2024
- Transphorm Technology, Inc.
- Davide Bisi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404909
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240387184
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yan-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER STRUCTURE
- Publication number 20240367414
- Publication date Nov 7, 2024
- NITTO DENKO CORPORATION
- Junichi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347492
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY
- Publication number 20240321668
- Publication date Sep 26, 2024
- ADVANCED MICRO DEVICES, INC.
- Thomas D. Burd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP
- Publication number 20240304517
- Publication date Sep 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...
- Publication number 20240290687
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...
- Publication number 20240274660
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Edward Robert Van Brunt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation Structures and Methods for Forming Same
- Publication number 20240266334
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
- Publication number 20240258262
- Publication date Aug 1, 2024
- The Indium Corporation of America
- Milos Lazic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC COOLING ADDITION
- Publication number 20240249995
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...
- Publication number 20240250054
- Publication date Jul 25, 2024
- NVIDIA Corporation
- Malcolm GUTENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240234287
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...
- Publication number 20240222335
- Publication date Jul 4, 2024
- ROBERT BOSCH GmbH
- Bo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL
- Publication number 20240218228
- Publication date Jul 4, 2024
- Honeywell International Inc.
- Yaqun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203900
- Publication date Jun 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING BONDING STRUCTURES
- Publication number 20240203923
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE
- Publication number 20240194546
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kwang-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE WITH SECURITY DIE
- Publication number 20240186269
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE
- Publication number 20240149340
- Publication date May 9, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi YAMAUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Dongjoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240136273
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE
- Publication number 20240105677
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS

the body and the item being stacked

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including base member with protruding portion...

Seamless interconnect thresholds using dielectric fluid channels

Wafer stencil for controlling die attach material thickness on die

Bonding apparatus and bonding method

Method for manufacturing a structure

Electronic package, heat dissipation structure and manufacturing me...

Display panel, preparation method thereof, and display device

Connection body, method for manufacturing connection body, and conn...

Thermal interface material, an integrated circuit formed therewith,...

Package

Temperature control element utilized in device die packages

Electronic device

Micro device arrangement in donor substrate

Underfill for chip packaging and chip packaging structure

Semiconductor packages

Package structure

Semiconductor package and method of manufacturing the same

Package structure

Lead frame wiring structure and semiconductor module

Power semiconductor device

Micro device arrangement in donor substrate

Package structure with a heat dissipating element and method of man...

Electronics assemblies and cooling structures having metalized exte...

3D semiconductor device and structure

Film for a package substrate

Multi-chip module hybrid integrated circuit with multiple power zon...

Method of manufacturing 3DIC structure

Semiconductor package

Film for package substrate, semiconductor package, display device,...

Power semiconductor device that includes a copper layer disposed on...

Patents Applicationslast 30 patents

MODULE ASSEMBLY OF MULTIPLE SEMICONDUCTOR DEVICES WITH INSULATING S...

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

MULTILAYER STRUCTURE

SEMICONDUCTOR DEVICE

TEMPERATURE SENSORS IN DIE PAIR TOPOLOGY

THERMALLY ENHANCED PACKAGE WITH HIGH K MOLD COMPOUND ON DIE TOP

POWER DEVICE EMBEDDED PRINTED CIRCUIT BOARD ASSEMBLIES WITH THIN FI...

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

POWER SEMICONDUCTOR DEVICES HAVING NON-RECTANGULAR SEMICONDUCTOR DI...

Thermal Dissipation Structures and Methods for Forming Same

MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER

THERMOELECTRIC COOLING ADDITION

BARRIER FOR LIQUID METAL THERMAL INTERFACE MATERIAL IN AN ELECTRONI...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC...

LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING BONDING STRUCTURES

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

HALF BRIDGE CERAMIC HERMETIC PACKAGE STRUCTURE

BONDED STRUCTURE WITH SECURITY DIE

JOINT STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE