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the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/02216
the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen
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last 30 patents
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RF pulsing assisted low-k film deposition with high mechanical stre...
Patent number
12,125,675
Issue date
Oct 22, 2024
Applied Materials, Inc.
Ruitong Xiong
H01 - BASIC ELECTRIC ELEMENTS
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Single precursor low-k film deposition and UV cure for advanced tec...
Patent number
12,119,223
Issue date
Oct 15, 2024
Applied Materials, Inc.
Bo Xie
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Semiconductor device having an extra low-k dielectric layer and met...
Patent number
12,062,613
Issue date
Aug 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Cheng Shih
H01 - BASIC ELECTRIC ELEMENTS
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Functionalized cyclosilazanes as precursors for high growth rate si...
Patent number
12,057,310
Issue date
Aug 6, 2024
VERSUM MATERIALS US, LLC
Manchao Xiao
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Compositions and methods using same for deposition of silicon-conta...
Patent number
12,049,695
Issue date
Jul 30, 2024
VERSUM MATERIALS US, LLC
Raymond Nicholas Vrtis
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Methods of forming material within openings extending into a semico...
Patent number
12,020,979
Issue date
Jun 25, 2024
Micron Technology, Inc.
Gurtej S. Sandhu
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Formation of SiOCN thin films
Patent number
11,996,284
Issue date
May 28, 2024
ASM IP Holding B.V.
Toshiya Suzuki
H01 - BASIC ELECTRIC ELEMENTS
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Porogen bonded gap filling material in semiconductor manufacturing
Patent number
11,984,316
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and its formation method
Patent number
11,978,624
Issue date
May 7, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jiang Chu
H01 - BASIC ELECTRIC ELEMENTS
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Systems and methods for depositing low-k dielectric films
Patent number
11,967,498
Issue date
Apr 23, 2024
Applied Materials, Inc.
Bo Xie
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Conformal deposition of silicon carbide films
Patent number
11,894,227
Issue date
Feb 6, 2024
Novellus Systems, Inc.
Bhadri N. Varadarajan
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Deposition method
Patent number
11,881,396
Issue date
Jan 23, 2024
Tokyo Electron Limited
Koji Sasaki
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PECVD deposition system for deposition on selective side of the sub...
Patent number
11,851,760
Issue date
Dec 26, 2023
Lam Research Corporation
Fayaz Shaikh
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Semiconductor device and method
Patent number
11,837,515
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yin-Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
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Conformal damage-free encapsulation of chalcogenide materials
Patent number
11,832,533
Issue date
Nov 28, 2023
Lam Research Corporation
James Samuel Sims
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Methods of depositing SiCON with C, O, and N compositional control
Patent number
11,823,893
Issue date
Nov 21, 2023
Applied Materials, Inc.
Mark Saly
H01 - BASIC ELECTRIC ELEMENTS
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Methods for pressure ramped plasma purge
Patent number
11,817,313
Issue date
Nov 14, 2023
Applied Materials, Inc.
Madhu Santosh Kumar Mutyala
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Integrated capacitor with sidewall having reduced roughness
Patent number
11,798,979
Issue date
Oct 24, 2023
Texas Instruments Incorporated
Elizabeth Costner Stewart
H01 - BASIC ELECTRIC ELEMENTS
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Plasma enhanced deposition processes for controlled formation of ox...
Patent number
11,776,807
Issue date
Oct 3, 2023
ASM IP Holding, B.V.
Lingyun Jia
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Techniques for improved low dielectric constant film processing
Patent number
11,756,796
Issue date
Sep 12, 2023
Applied Materials, Inc.
Rajesh Prasad
H01 - BASIC ELECTRIC ELEMENTS
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Films of desired composition and film properties
Patent number
11,732,350
Issue date
Aug 22, 2023
Novellus Systems, Inc.
Bhadri N. Varadarajan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method of manufacturing semiconductor device, substrate processing...
Patent number
11,735,412
Issue date
Aug 22, 2023
Kokusai Electric Corporation
Atsushi Sano
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Selective PEALD of oxide on dielectric
Patent number
11,728,164
Issue date
Aug 15, 2023
ASM IP Holding B.V.
Eva Tois
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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PECVD deposition system for deposition on selective side of the sub...
Patent number
11,725,283
Issue date
Aug 15, 2023
Lam Research Corporation
Fayaz Shaikh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Films of desired composition and film properties
Patent number
11,708,634
Issue date
Jul 25, 2023
Novellus Systems, Inc.
Bhadri N. Varadarajan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Films of desired composition and film properties
Patent number
11,680,314
Issue date
Jun 20, 2023
Novellus Systems, Inc.
Bhadri N. Varadarajan
H01 - BASIC ELECTRIC ELEMENTS
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Films of desired composition and film properties
Patent number
11,680,315
Issue date
Jun 20, 2023
Novellus Systems, Inc.
Bhadri N. Varadarajan
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device including polysilicon structures and method of...
Patent number
11,676,856
Issue date
Jun 13, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
J. J. Lee
H01 - BASIC ELECTRIC ELEMENTS
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Method of selective deposition for forming fully self-aligned vias
Patent number
11,658,068
Issue date
May 23, 2023
Tokyo Electron Limited
Kandabara Tapily
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Porogen bonded gap filling material in semiconductor manufacturing
Patent number
11,658,120
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240404802
Publication date
Dec 5, 2024
Kokusai Electric Corporation
Atsushi Moriya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FUNCTIONALIZED CYCLOSILAZANES AS PRECURSORS FOR HIGH GROWTH RATE SI...
Publication number
20240395541
Publication date
Nov 28, 2024
VERSUM MATERIALS US, LLC
Manchao Xiao
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH INCREASED ETCH...
Publication number
20240387167
Publication date
Nov 21, 2024
Applied Materials, Inc.
Shanshan Yao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE HAVING AN EXTRA LOW-K DIELECTRIC LAYER AND MET...
Publication number
20240371769
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Cheng SHIH
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DOPED SILICON-CONTAINING MATERIALS WITH INCREASED ELECTRICAL, MECHA...
Publication number
20240332000
Publication date
Oct 3, 2024
Applied Materials, Inc.
Akhil Singhal
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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PECVD DEPOSITION SYSTEM FOR DEPOSITION ON SELECTIVE SIDE OF THE SUB...
Publication number
20240309507
Publication date
Sep 19, 2024
LAM RESEARCH CORPORATION
Fayaz Shaikh
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA
Publication number
20240304441
Publication date
Sep 12, 2024
ASM IP HOLDING B.V.
Yoshio Susa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
Publication number
20240297068
Publication date
Sep 5, 2024
Micron Technology, Inc.
Gurtej S. Sandhu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240290837
Publication date
Aug 29, 2024
Mitsubishi Electric Corporation
Takahiro NAKATANI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
Publication number
20240290611
Publication date
Aug 29, 2024
Applied Materials, Inc.
Bo Xie
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240258100
Publication date
Aug 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR...
Publication number
20240222112
Publication date
Jul 4, 2024
Kokusai Electric Corporation
Naonori AKAE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE
Publication number
20240213017
Publication date
Jun 27, 2024
Samsung Electronics Co., Ltd.
Younghun SUNG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240203728
Publication date
Jun 20, 2024
KIOXIA Corporation
Junya FUJITA
H01 - BASIC ELECTRIC ELEMENTS
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SELECTIVE DEPOSITION OF SILICON DIELECTRIC FILM
Publication number
20240170283
Publication date
May 23, 2024
VERSUM MATERIALS US, LLC
HARIPIN CHANDRA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD AND SYSTEM FOR TUNING PHOTORESIST ADHESION LAYER PROPERTIES
Publication number
20240170282
Publication date
May 23, 2024
ASM IP HOLDING B.V.
Jerome Samuel Nicolas
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS
Publication number
20240145234
Publication date
May 2, 2024
Novellus Systems, Inc.
Bhadri N. Varadarajan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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MANUFACTURING METHOD OF INSULATION FILM
Publication number
20240112906
Publication date
Apr 4, 2024
ABIT TECHNOLOGIES CO., LTD
Kiyokazu NAKAGAWA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240105443
Publication date
Mar 28, 2024
Kokusai Electric Corporation
Kimihiko NAKATANI
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Deposition of Thick Layers of Silicon Dioxide
Publication number
20240096616
Publication date
Mar 21, 2024
SPTS TECHNOLOGIES LIMITED
Matt Edmonds
H01 - BASIC ELECTRIC ELEMENTS
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SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
Publication number
20240087881
Publication date
Mar 14, 2024
Applied Materials, Inc.
Michael Haverty
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Application
Methods of Depositing SiCON with C, O, and N Compositional Control
Publication number
20240047193
Publication date
Feb 8, 2024
Applied Materials, Inc.
Mark Saly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SILICON COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEV...
Publication number
20230406822
Publication date
Dec 21, 2023
DNF CO., LTD.
Sunhye HWANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD
Publication number
20230386947
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Yin-Jie Pan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ALKOXYDISILOXANES AND DENSE ORGANOSILICA FILMS MADE THEREFROM
Publication number
20230386825
Publication date
Nov 30, 2023
VERSUM MATERIALS US, LLC
MANCHAO XIAO
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20230343580
Publication date
Oct 26, 2023
Kokusai Electric Corporation
Atsushi SANO
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SILICON PRECURSOR HAVING A HETEROCYCLIC GROUP, COMPOSITION FOR DEPO...
Publication number
20230307227
Publication date
Sep 28, 2023
Samsung Electronics Co., Ltd.
Sunhye HWANG
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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SEMICONDUCTOR DEVICE INCLUDING POLYSILICON STRUCTURES AND METHOD OF...
Publication number
20230298935
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
J. J. LEE
H01 - BASIC ELECTRIC ELEMENTS
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Porogen Bonded Gap Filling Material In Semiconductor Manufacturing
Publication number
20230299003
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Bo-Jiun Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONFORMAL DEPOSITION OF SILICON CARBIDE FILMS USING HETEROGENEOUS P...
Publication number
20230203646
Publication date
Jun 29, 2023
LAM RESEARCH CORPORATION
Matthew Scott WEIMER
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...