the external layer being at least partially embedded in the surface

Industry

CPC
H01L2224/05567

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05567the external layer being at least partially embedded in the surface

Industries

Patents Grantslast 30 patents

Information Patent Grant
OLED display panel and manufacturing method thereof
- Patent number 12,108,636
- Issue date Oct 1, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jia Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale package
- Patent number 12,057,417
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 12,057,383
- Issue date Aug 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 12,057,479
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for registration of circuit dies and electrical interconnects
- Patent number 12,020,951
- Issue date Jun 25, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 11,901,390
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, method for fabricating same, and display device
- Patent number 11,869,904
- Issue date Jan 9, 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Xiaobo Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a passivation layer and method for produc...
- Patent number 11,854,926
- Issue date Dec 26, 2023
- Infineon Technologies AG
- Jens Peter Konrath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level configurability
- Patent number 11,848,323
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- James E. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,776,853
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure and method
- Patent number 11,756,883
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
- Patent number 11,728,297
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating method of semiconductor device with exposed input/outpu...
- Patent number 11,710,730
- Issue date Jul 25, 2023
- Yangtze Memory Technologies Co., Ltd.
- He Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having side surface connection pads
- Patent number 11,706,956
- Issue date Jul 18, 2023
- Samsung Display Co., Ltd.
- Jinseon Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
- Patent number 11,676,938
- Issue date Jun 13, 2023
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,977
- Issue date Jun 13, 2023
- Sony Group Corporation
- Yoshihiro Nabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 11,657,953
- Issue date May 23, 2023
- Rohm Co., Ltd.
- Kosei Osada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raised via for terminal connections on different planes
- Patent number 11,646,220
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures with integrated passive component
- Patent number 11,626,363
- Issue date Apr 11, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a junction portion contacting a Schottk...
- Patent number 11,610,970
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,476,291
- Issue date Oct 18, 2022
- Sony Corporation
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHIP SCALE PACKAGE
- Publication number 20240379597
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...
- Publication number 20240363562
- Publication date Oct 31, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...
- Publication number 20240355886
- Publication date Oct 24, 2024
- ROHM CO., LTD.
- Yasuhiro Kawakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
- Publication number 20240332227
- Publication date Oct 3, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DISPLAY DRIVER INCLUDING THE SAME
- Publication number 20240290769
- Publication date Aug 29, 2024
- LX Semicon Co., Ltd.
- Cheong Sik YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS
- Publication number 20240282592
- Publication date Aug 22, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240282736
- Publication date Aug 22, 2024
- Japan Display Inc.
- Yoichi KAMIJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240243028
- Publication date Jul 18, 2024
- Innolux Corporation
- Ming-Chih Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES
- Publication number 20240213156
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP
- Publication number 20240186310
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP
- Publication number 20240186309
- Publication date Jun 6, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162343
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Yuji ENARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20240153966
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Se Hun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240136383
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chien Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Conductive IC Spacer with Integrated Electrical Isolation
- Publication number 20240128210
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Amit Ashara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer-By-Layer Formation Of Through-Substrate Via
- Publication number 20240120257
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240090239
- Publication date Mar 14, 2024
- KIOXIA Corporation
- Kiichi TACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION
- Publication number 20240071968
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Package and Method Forming the Same
- Publication number 20240072034
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20240063197
- Publication date Feb 22, 2024
- SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Zhuhui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS

the external layer being at least partially embedded in the surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

OLED display panel and manufacturing method thereof

Semiconductor chip with redundant thru-silicon-vias

Wafer chip scale package

Bonded structures with integrated passive component

Semiconductor device having a junction portion contacting a Schottk...

Methods for registration of circuit dies and electrical interconnects

Semiconductor devices including through-silicon-vias and methods of...

Semiconductor structure

Method of manufacturing substrate structure with filling material f...

Low temperature hybrid bonding

Semiconductor device

Array substrate, method for fabricating same, and display device

Semiconductor device with a passivation layer and method for produc...

Semiconductor devices with package-level configurability

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacture

Through via structure and method

Semiconductor devices, semiconductor packages, and methods of manuf...

Fabricating method of semiconductor device with exposed input/outpu...

Display device having side surface connection pads

Semiconductor device and method of making wafer level chip scale pa...

Semiconductor device

Semiconductor device and semiconductor module

Raised via for terminal connections on different planes

Bonded structures with integrated passive component

Semiconductor device having a junction portion contacting a Schottk...

Stacked chips comprising interconnects

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing thereof

Semiconductor chip with redundant thru-silicon-vias

Patents Applicationslast 30 patents

WAFER CHIP SCALE PACKAGE

Packaging Structure for Large-Size Chips Adapted to Small-Size Pack...

SEMICONDUCTOR DEVICE HAVING A JUNCTION PORTION CONTACTING A SCHOTTK...

SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND DISPLAY DRIVER INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

LIQUID METAL WELLS FOR INTERCONNECT ARCHITECTURES

SIGNAL TRANSMISSION DEVICE AND INSULATION CHIP

SIGNAL TRANSMITTING DEVICE AND INSULATING CHIP

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

SEMICONDUCTOR DEVICE

Thermally Conductive IC Spacer with Integrated Electrical Isolation

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Layer-By-Layer Formation Of Through-Substrate Via

SEMICONDUCTOR PACKAGE

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

GALVANIC ISOLATION DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INTERCONNECTS FORMED THROUGH VOLUMETRIC EXPANSION

3DIC Package and Method Forming the Same

DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME