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H01L2224/05022
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05022
the internal layer being at least partially embedded in the surface
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last 30 patents
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Package component with stepped passivation layer
Patent number
11,961,762
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Conductive traces in semiconductor devices and methods of forming same
Patent number
11,894,299
Issue date
Feb 6, 2024
TAIWAN SEMICONDUCTOR LTD
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages
Patent number
11,869,775
Issue date
Jan 9, 2024
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and package assembly including the same
Patent number
11,855,025
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chita Chuang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
Patent number
11,837,562
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chang-Pin Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stacked semiconductor devices and methods of forming same
Patent number
11,823,912
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
Patent number
11,817,461
Issue date
Nov 14, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Devices and methods related to stack structures including passivati...
Patent number
11,804,460
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Jiro Yota
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and semiconductor package
Patent number
11,791,286
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Youn-ji Min
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
Patent number
11,769,704
Issue date
Sep 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package
Patent number
11,769,746
Issue date
Sep 26, 2023
Samsung Electronics Co., Ltd.
Ae-nee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
Patent number
11,728,297
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Redistribution lines with protection layers and method forming same
Patent number
11,721,579
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and semiconductor device manufacturing method
Patent number
11,705,415
Issue date
Jul 18, 2023
Lapis Semiconductor Co., Ltd.
Taiichi Ogumi
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of making wafer level chip scale pa...
Patent number
11,676,938
Issue date
Jun 13, 2023
JCET Semiconductor (Shaoxing) Co., Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Forming recesses in molding compound of wafer to reduce stress
Patent number
11,658,153
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,616,036
Issue date
Mar 28, 2023
Samsung Electronics Co., Ltd.
Joohee Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor packages
Patent number
11,610,785
Issue date
Mar 21, 2023
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,605,597
Issue date
Mar 14, 2023
Advanced Semiconductor Engineering, Inc.
Hsu-Nan Fang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package having exposed redistribution layer features...
Patent number
11,600,523
Issue date
Mar 7, 2023
Microchip Technology Incorporated
ManKit Lam
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,532,736
Issue date
Dec 20, 2022
Murata Manufacturing Co., Ltd.
Yasunari Umemoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive external connector structure and method of forming
Patent number
11,527,504
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Meng-Fu Shih
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure having counductive bump with tapered portio...
Patent number
11,495,556
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Pei-Haw Tsao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
11,476,291
Issue date
Oct 18, 2022
Sony Corporation
Satoru Wakiyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
11,469,212
Issue date
Oct 11, 2022
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method for fabricating base for semicondu...
Patent number
11,469,201
Issue date
Oct 11, 2022
Mediatek Inc.
Tzu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package component with stepped passivation layer
Patent number
11,450,567
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor devices and methods of forming same
Patent number
11,430,670
Issue date
Aug 30, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Post-passivation interconnect structure
Patent number
11,417,610
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor device having a dual material redis...
Patent number
11,410,882
Issue date
Aug 9, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Anhao Cheng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240162343
Publication date
May 16, 2024
RENESAS ELECTRONICS CORPORATION
Yuji ENARI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
Publication number
20240153966
Publication date
May 9, 2024
SAMSUNG DISPLAY CO., LTD.
Se Hun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240128218
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE FILM-LIKE ADHESIVE, SEMICONDUCTOR PACKAGE, AND...
Publication number
20240128154
Publication date
Apr 18, 2024
FURUKAWA ELECTRIC CO., LTD.
Minoru MORITA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
Publication number
20240113056
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsing-Kuo Hsia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240113089
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tian Hu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CARRIER STRUCTURE
Publication number
20240088054
Publication date
Mar 14, 2024
Siliconware Precision Industries Co., Ltd.
Shu-Ting LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK REDISTRIBUTION LAYER FEATURES
Publication number
20240088074
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
Publication number
20240055383
Publication date
Feb 15, 2024
QUALCOMM Incorporated
Dongming HE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR SUBSTRATE AND MANUFACTURING MET...
Publication number
20240047343
Publication date
Feb 8, 2024
nD-HI Technologies Lab,Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH UNDER-BUMP METALLIZATION AND METHOD THEREFOR
Publication number
20240014152
Publication date
Jan 11, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
Publication number
20240006361
Publication date
Jan 4, 2024
QUALCOMM Incorporated
Wei WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
Publication number
20230386864
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN ANTI-ARCING PATTERN DISPOSED ON A...
Publication number
20230360986
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-An Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
Publication number
20230352342
Publication date
Nov 2, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Ming-Da Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ELECTRONIC COMPONENT
Publication number
20230343702
Publication date
Oct 26, 2023
ROHM CO., LTD.
Bungo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
Publication number
20230275076
Publication date
Aug 31, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Feng ZHAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230253412
Publication date
Aug 10, 2023
SAMSUNG DISPLAY CO., LTD.
Jeong Su PARK
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Forming Recesses in Molding Compound of Wafer to Reduce Stress
Publication number
20230253370
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND TILE-SHAPED DISPLAY DEVICE INCLUDING THE SAME
Publication number
20230238398
Publication date
Jul 27, 2023
SAMSUNG DISPLAY CO., LTD.
Byeong Kyun CHOI
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230238343
Publication date
Jul 27, 2023
Samsung Electronics Co., Ltd.
Joohee Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230223352
Publication date
Jul 13, 2023
Advanced Semiconductor Engineering, Inc.
Hsu-Nan FANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
Publication number
20230207573
Publication date
Jun 29, 2023
SAMSUNG DISPLAY CO., LTD.
JI WOONG CHOI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230197469
Publication date
Jun 22, 2023
Samsung Electronics Co., Ltd.
Seokhyun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230063726
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Ching Chao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PAD STRUCTURES FOR SEMICONDUCTOR DEVICES
Publication number
20230062321
Publication date
Mar 2, 2023
Yangtze Memory Technologies Co., Ltd.
Yihuan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
Publication number
20230005979
Publication date
Jan 5, 2023
SONY GROUP CORPORATION
Satoru WAKIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20230005961
Publication date
Jan 5, 2023
SAMSUNG DISPLAY CO., LTD.
Dae Hwan JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
Publication number
20220375767
Publication date
Nov 24, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS