the item being metallic

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CLIP

    • Publication number 20250105199
    • Publication date Mar 27, 2025
    • NEXPERIA B.V.
    • Georgio El-Zammar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

    • Publication number 20250006622
    • Publication date Jan 2, 2025
    • Fuji Electric Co., Ltd.
    • Tatsuo NISHIZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20240413060
    • Publication date Dec 12, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PADDLE

    • Publication number 20240404923
    • Publication date Dec 5, 2024
    • NEXPERIA B.V.
    • Ricardo Yandoc
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY

    • Publication number 20240395758
    • Publication date Nov 28, 2024
    • Littelfuse Semiconductor (Wuxi) Co., Ltd
    • MC Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Package with Single Integral Body Carrying Two Transistor Chips wit...

    • Publication number 20240395676
    • Publication date Nov 28, 2024
    • INFINEON TECHNOLOGIES AG
    • Marcus Böhm
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240387326
    • Publication date Nov 21, 2024
    • Fuji Electric Co., Ltd.
    • Shinichiro ADACHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Delay-Free Temperature Measurement Of Power Switches

    • Publication number 20240319012
    • Publication date Sep 26, 2024
    • Vitesco Technologies GMBH
    • Fadi Rifai
    • G01 - MEASURING TESTING
  • Information Patent Application

    CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

    • Publication number 20240312882
    • Publication date Sep 19, 2024
    • Huawei Digital Power Technologies Co., Ltd.
    • Junqing HE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20240250015
    • Publication date Jul 25, 2024
    • Fuji Electric Co., Ltd.
    • Katsunori SUZUKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

    • Publication number 20240250056
    • Publication date Jul 25, 2024
    • Mohd Afiz Hashim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

    • Publication number 20240243095
    • Publication date Jul 18, 2024
    • CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
    • LIMIN WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE

    • Publication number 20240243044
    • Publication date Jul 18, 2024
    • ROHM CO., LTD.
    • Kenji HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240234361
    • Publication date Jul 11, 2024
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Liquid Immersion-Cooled Power Module

    • Publication number 20240222225
    • Publication date Jul 4, 2024
    • Hyundai Motor Company
    • Suk Hyun Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240213126
    • Publication date Jun 27, 2024
    • Power Master Semiconductor Co., Ltd.
    • Jooyaung EOM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATION...

    • Publication number 20240213124
    • Publication date Jun 27, 2024
    • Brice MCPHERSON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240170375
    • Publication date May 23, 2024
    • RENESAS ELECTRONICS CORPORATION
    • Tatsuaki TSUKUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE

    • Publication number 20240162197
    • Publication date May 16, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

    • Publication number 20240145340
    • Publication date May 2, 2024
    • INFINEON TECHNOLOGIES AG
    • Jayaganasan Narayanasamy
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240145349
    • Publication date May 2, 2024
    • DENSO CORPORATION
    • TAKAHIRO HIRANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240136320
    • Publication date Apr 25, 2024
    • ROHM CO., LTD.
    • Kohei TANIKAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240105666
    • Publication date Mar 28, 2024
    • Kabushiki Kaisha Toshiba
    • Daisuke Ando
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240087969
    • Publication date Mar 14, 2024
    • Kabushiki Kaisha Toshiba
    • Shunsuke KAMIYA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240047433
    • Publication date Feb 8, 2024
    • ROHM CO., LTD.
    • Xiaopeng WU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES

    • Publication number 20240047317
    • Publication date Feb 8, 2024
    • Littelfuse Semiconductor (Wuxi) Co., Ltd
    • Lucas Zhang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240047315
    • Publication date Feb 8, 2024
    • ROHM CO., LTD.
    • Masaki KANO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    • Publication number 20240047430
    • Publication date Feb 8, 2024
    • Mitsubishi Electric Corporation
    • Yosuke NAKATA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20240038715
    • Publication date Feb 1, 2024
    • Kabushiki Kaisha Toshiba
    • Kakeru YAMAGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

    • Publication number 20240021569
    • Publication date Jan 18, 2024
    • Fuji Electric Co., Ltd.
    • Yoko NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS