the leads having a passage through the base

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/055the leads having a passage through the base

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ball grid array underfilling systems
- Patent number 11,984,390
- Issue date May 14, 2024
- Hamilton Sundstrand Corporation
- Eileen A. Bartley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device, semiconductor package-...
- Patent number 11,984,380
- Issue date May 14, 2024
- Murata Manufacturing Co., Ltd.
- Masao Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, packaging structure, electronic device, and ma...
- Patent number 11,854,953
- Issue date Dec 26, 2023
- Huawei Technologies Co., Ltd.
- Zan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of package-then-etch three-dimensional package structure el...
- Patent number 11,823,911
- Issue date Nov 21, 2023
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional element housing package, and semiconductor device and LN...
- Patent number 11,815,749
- Issue date Nov 14, 2023
- Kyocera Corporation
- Hiroyuki Nakamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and equipment
- Patent number 11,798,855
- Issue date Oct 24, 2023
- Canon Kabushiki Kaisha
- Yu Katase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and semiconductor device
- Patent number 11,784,201
- Issue date Oct 10, 2023
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method for producing same
- Patent number 11,655,143
- Issue date May 23, 2023
- Infineon Technologies AG
- Mathias Vaupel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,610,826
- Issue date Mar 21, 2023
- Fuji Electric Co., Ltd.
- Naoyuki Kanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-performance integrated circuit packaging platform compatible w...
- Patent number 11,605,583
- Issue date Mar 14, 2023
- Keysight Technologies, Inc.
- Philipp Pahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with elastic coupler and related methods
- Patent number 11,569,140
- Issue date Jan 31, 2023
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,562,970
- Issue date Jan 24, 2023
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated electronic circuit
- Patent number 11,529,524
- Issue date Dec 20, 2022
- Torsten Lehmann
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 11,490,811
- Issue date Nov 8, 2022
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enclosure for an electronic component
- Patent number 11,488,880
- Issue date Nov 1, 2022
- Intel Corporation
- Vijay K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,417,631
- Issue date Aug 16, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Tae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas sensor module and method of manufacturing gas sensor module
- Patent number 11,415,536
- Issue date Aug 16, 2022
- Nissha Co., Ltd.
- Teppei Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stem for semiconductor package
- Patent number 11,373,961
- Issue date Jun 28, 2022
- Shinko Electric Industries Co., Ltd.
- Wataru Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Case with a plurality of pair case components for a semiconductor d...
- Patent number 11,348,851
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level packaging for semiconductor devices
- Patent number 11,336,257
- Issue date May 17, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Liang Liang Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for semiconductor device, and semiconductor device
- Patent number 11,309,439
- Issue date Apr 19, 2022
- He Bei Sinopack Electronic Tech Co., Ltd.
- Yao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit
- Patent number 11,257,726
- Issue date Feb 22, 2022
- Global Circuit Innovations Incorporated
- Timothy Mark Barry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,251,101
- Issue date Feb 15, 2022
- Fuji Electric Co., Ltd.
- Taichi Itoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-before-etch three-dimensional package structure electricall...
- Patent number 11,217,459
- Issue date Jan 4, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source device
- Patent number 11,217,572
- Issue date Jan 4, 2022
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Hsin-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 11,205,600
- Issue date Dec 21, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 11,177,204
- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor panels, semiconductor packages, and methods for manuf...
- Patent number 11,171,066
- Issue date Nov 9, 2021
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240194544
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240021485
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERC...
- Publication number 20230420430
- Publication date Dec 28, 2023
- Wolfspeed, Inc.
- Qianli Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
- Publication number 20230378007
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MODULE ARRANGEMENT
- Publication number 20230230905
- Publication date Jul 20, 2023
- Peter Luniewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR...
- Publication number 20230207511
- Publication date Jun 29, 2023
- INFINEON TECHNOLOGIES AG
- Marco Rasel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230187292
- Publication date Jun 15, 2023
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package and Electronic Device Comprising the Same
- Publication number 20230178464
- Publication date Jun 8, 2023
- Ampleon Netherlands B.V.
- Jurgen Raben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230178443
- Publication date Jun 8, 2023
- Fuji Electric Co., Ltd.
- Hayato NAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078862
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...
- Publication number 20230063689
- Publication date Mar 2, 2023
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREMELY HIGH FREQUENCY ELECTROMAGNETIC WAVE TRANSMIT/RECEIVE DEVICE
- Publication number 20230029946
- Publication date Feb 2, 2023
- STMicroelectronics S.A.
- Victor FIORESE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Assembly Including Lid With Additional Stress Mitigating Fe...
- Publication number 20230018343
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20220278149
- Publication date Sep 1, 2022
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20220238481
- Publication date Jul 28, 2022
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND MA...
- Publication number 20220093497
- Publication date Mar 24, 2022
- Huawei Technologies Co., Ltd
- Zan LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...
- Publication number 20220084841
- Publication date Mar 17, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220068733
- Publication date Mar 3, 2022
- Fuji Electric Co., Ltd.
- Naoyuki KANAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE-...
- Publication number 20220059427
- Publication date Feb 24, 2022
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Integrated Circuit
- Publication number 20220005741
- Publication date Jan 6, 2022
- Global Circuit Innovations Inc.
- Timothy Mark Barry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210358869
- Publication date Nov 18, 2021
- Fuji Electric Co., Ltd.
- Tadahiko SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Antenna Module
- Publication number 20210234256
- Publication date Jul 29, 2021
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Christof LANDESBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STORING FUNCTIONAL ELEMENT, SEMICONDUCTOR DEVICE AND LN...
- Publication number 20210208428
- Publication date Jul 8, 2021
- KYOCERA CORPORATION
- Hiroyuki NAKAMICHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure for Semiconductor Device, and Semiconductor Device
- Publication number 20210111285
- Publication date Apr 15, 2021
- HE BEI SINOPACK ELECTRONIC TECH CO., LTD.
- Yao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...
- Publication number 20210106226
- Publication date Apr 15, 2021
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20210087054
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Mathias VAUPEL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC MODULE AND EQUIPMENT
- Publication number 20200402872
- Publication date Dec 24, 2020
- Canon Kabushiki Kaisha
- Yu Katase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200365558
- Publication date Nov 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yun Tae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Testable Integrated Circuit Packaging
- Publication number 20200365470
- Publication date Nov 19, 2020
- pSemi Corporation
- Mark Moffat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...
- Publication number 20200321309
- Publication date Oct 8, 2020
- INFINEON TECHNOLOGIES AG
- Petteri PALM
- H01 - BASIC ELECTRIC ELEMENTS

the leads having a passage through the base

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ball grid array underfilling systems

Semiconductor package, semiconductor device, semiconductor package-...

Semiconductor devices and methods of manufacturing semiconductor de...

Packaging substrate, packaging structure, electronic device, and ma...

Process of package-then-etch three-dimensional package structure el...

Functional element housing package, and semiconductor device and LN...

Electronic module and equipment

Package and semiconductor device

Semiconductor component and method for producing same

Semiconductor module

High-performance integrated circuit packaging platform compatible w...

Semiconductor package with elastic coupler and related methods

Semiconductor device and manufacturing method thereof

Encapsulated electronic circuit

Waferscale physiological characteristic sensor package with integra...

Enclosure for an electronic component

Semiconductor package

Gas sensor module and method of manufacturing gas sensor module

Stem for semiconductor package

Case with a plurality of pair case components for a semiconductor d...

Wafer level packaging for semiconductor devices

Package structure for semiconductor device, and semiconductor device

Chip assembling on adhesion layer or dielectric layer, extending be...

Low profile integrated circuit

Semiconductor device

Package-before-etch three-dimensional package structure electricall...

Light source device

Integrated circuits protected by substrates with cavities, and meth...

Power electronics package and method of manufacturing thereof

Semiconductor panels, semiconductor packages, and methods for manuf...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MODULAR POWER TRANSISTOR COMPONENT ASSEMBLIES WITH FLIP CHIP INTERC...

PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME

STACKED MODULE ARRANGEMENT

BUS BAR, POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A BUS BAR...

SEMICONDUCTOR MODULE

Electronic Package and Electronic Device Comprising the Same

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...

EXTREMELY HIGH FREQUENCY ELECTROMAGNETIC WAVE TRANSMIT/RECEIVE DEVICE

Package Assembly Including Lid With Additional Stress Mitigating Fe...

PACKAGE AND SEMICONDUCTOR DEVICE

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...

PACKAGING SUBSTRATE, PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND MA...

PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE-...

Low Profile Integrated Circuit

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Antenna Module

PACKAGE FOR STORING FUNCTIONAL ELEMENT, SEMICONDUCTOR DEVICE AND LN...

Package Structure for Semiconductor Device, and Semiconductor Device

WAFERSCALE PHYSIOLOGICAL CHARACTERISTIC SENSOR PACKAGE WITH INTEGRA...

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SAME

ELECTRONIC MODULE AND EQUIPMENT

SEMICONDUCTOR PACKAGE

Electrically Testable Integrated Circuit Packaging

CHIP ASSEMBLING ON ADHESION LAYER OR DIELECTRIC LAYER, EXTENDING BE...