the micromechanical device and the control or processing electronics being integrated on the same substrate

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B81B2207/015

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

Current Industry

B81B2207/015the micromechanical device and the control or processing electronics being integrated on the same substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro-mechanical-system structures and applications thereof
- Patent number 12,084,340
- Issue date Sep 10, 2024
- Mekonos, Inc.
- Mark A. Webb
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Active matrix programmable mirror
- Patent number 12,061,331
- Issue date Aug 13, 2024
- OBSIDIAN SENSORS, INC.
- John Hong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone and MEMS accelerometer on a single substrate
- Patent number 12,054,383
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for a MEMS device
- Patent number 12,017,909
- Issue date Jun 25, 2024
- Imec VZW
- Deniz Sabuncuoglu Tezcan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS humidity sensor
- Patent number 12,000,792
- Issue date Jun 4, 2024
- HANGZHOU WEIMING XINKE TECHNOLOGY CO., LTD
- Han Xiao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated digital force sensors and related methods of manufacture
- Patent number 11,946,817
- Issue date Apr 2, 2024
- DecaWave, Ltd.
- Ali Foughi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor transducer device with multilayer diaphragm and metho...
- Patent number 11,946,822
- Issue date Apr 2, 2024
- Sciosense B.V.
- Alessandro Faes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device and corresponding method
- Patent number 11,945,714
- Issue date Apr 2, 2024
- STMicroelectronics S.r.l.
- Alex Gritti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electro mechanical system and manufacturing method thereof
- Patent number 11,851,321
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,833,542
- Issue date Dec 5, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Outgassing material coated cavity for a micro-electro mechanical sy...
- Patent number 11,827,513
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,806,747
- Issue date Nov 7, 2023
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS phase shifter including a substrate with a coplanar waveguide...
- Patent number 11,742,556
- Issue date Aug 29, 2023
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Jingwen Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device package
- Patent number 11,702,335
- Issue date Jul 18, 2023
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS ultrasonic transducers and related apparatus and methods
- Patent number 11,684,949
- Issue date Jun 27, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS pressure sensor
- Patent number 11,579,033
- Issue date Feb 14, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Attachment of stress sensitive integrated circuit dies
- Patent number 11,548,781
- Issue date Jan 10, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,530,130
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated structure of mems microphone and air pressure sensor and...
- Patent number 11,516,595
- Issue date Nov 29, 2022
- Weifang Goertek Microelectronics Co., Ltd.
- Dexin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of making ohmic contact on low doped bulk silicon for optica...
- Patent number 11,485,631
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom electrode via structures for micromachined ultrasonic transd...
- Patent number 11,484,911
- Issue date Nov 1, 2022
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS microphone
- Patent number 11,388,526
- Issue date Jul 12, 2022
- WEIFANG GOERTEK MICROELECTRONICS CO., LTD.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for protecting FEOL element and BEOL element
- Patent number 11,345,591
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Chun Yeh
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20240367964
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT AND SCANNING DEVICE
- Publication number 20240343556
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Helmut Grutzeck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS
- Publication number 20240100565
- Publication date Mar 28, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240083742
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...
- Publication number 20240024917
- Publication date Jan 25, 2024
- BFLY OPERATIONS, INC.
- Lingyun Miao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFOR...
- Publication number 20240010490
- Publication date Jan 11, 2024
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH ACCURACY TEMPERATURE-COMPENSATED PIEZORESISTIVE POSITION SENSI...
- Publication number 20240004184
- Publication date Jan 4, 2024
- ASML NETHERLANDS B.V.
- Luc Roger Simonne HASPESLAGH
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR
- Publication number 20230417614
- Publication date Dec 28, 2023
- MEI Micro, Inc.
- Robert Mark Boysel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER
- Publication number 20230399226
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20230391610
- Publication date Dec 7, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON
- Publication number 20230391609
- Publication date Dec 7, 2023
- International Business Machines Corporation
- Muir Kumph
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE
- Publication number 20230382716
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD
- Publication number 20230365396
- Publication date Nov 16, 2023
- TDK Corporation
- Toyotaka KOBAYASHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...
- Publication number 20230365398
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE AND NOISE CANCELLATIO...
- Publication number 20230365401
- Publication date Nov 16, 2023
- Huawei Technologies Co., Ltd
- Ulrich HOFMANN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELEROMETER-BASED ACOUSTIC BEAMFORMER VECTOR SENSOR WITH COLLOCAT...
- Publication number 20230348261
- Publication date Nov 2, 2023
- AIVS Inc.
- James W. Waite
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH INTEGRATED CMOS CIRCUIT
- Publication number 20230312337
- Publication date Oct 5, 2023
- 3C PROJECT MANAGEMENT LIMITED
- Gregory John MCAVOY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE
- Publication number 20230303388
- Publication date Sep 28, 2023
- MMI SEMICONDUCTOR CO., LTD.
- Kazuki ITOYAMA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOSENSITIVE TRANSISTOR, METHOD FOR MANUFACTURING A PHOTOSENSITIV...
- Publication number 20230268449
- Publication date Aug 24, 2023
- Shanghai Tianma Microelectronics Co., Ltd.
- Linzhi WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...
- Publication number 20230242394
- Publication date Aug 3, 2023
- HAHN-SCHICKARD-GESELLSCHAFT FUR ANGEWANDTE FORSCHUNG E.V.
- Achim Bittner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Attachment of Stress Sensitive Integrated Circuit Dies
- Publication number 20230126598
- Publication date Apr 27, 2023
- Sciosense B.V.
- Casper Van Der Avoort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INERTIAL MEASUREMENT UNIT
- Publication number 20230125187
- Publication date Apr 27, 2023
- SEIKO EPSON CORPORATION
- Shinji Nishio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC ACOUSTIC DEVICES, MEMS MICROPHONES, AND EQUALIZATION MET...
- Publication number 20230121053
- Publication date Apr 20, 2023
- Skyworks Solutions, Inc.
- Humberto Campanella-Pineda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SIGNAL PROCESSING METHOD AND DEVICE OF MEMS MICROPHONE AND MEMS MIC...
- Publication number 20230083805
- Publication date Mar 16, 2023
- GOERTEK INC.
- Dingyun LI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENHANCED MEMS SENSOR EMBEDDED HEATER
- Publication number 20230061188
- Publication date Mar 2, 2023
- Apple Inc.
- Gregory B. ARNDT
- B81 - MICRO-STRUCTURAL TECHNOLOGY

the micromechanical device and the control or processing electronics being integrated on the same substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Reduced light reflection package

Micro-electro-mechanical-system structures and applications thereof

Active matrix programmable mirror

MEMS microphone and MEMS accelerometer on a single substrate

Method for producing monolithic integration of piezoelectric microm...

Fabrication method for a MEMS device

CMOS-MEMS humidity sensor

Integrated digital force sensors and related methods of manufacture

Semiconductor transducer device with multilayer diaphragm and metho...

Electronic device and corresponding method

Micro-electro mechanical system and manufacturing method thereof

Integrated piezoelectric microelectromechanical ultrasound transduc...

CMOS ultrasonic transducers and related apparatus and methods

Outgassing material coated cavity for a micro-electro mechanical sy...

Bottom electrode via structures for micromachined ultrasonic transd...

Reduced light reflection package

MEMS phase shifter including a substrate with a coplanar waveguide...

Low stress integrated device package

CMOS ultrasonic transducers and related apparatus and methods

Optical electronics device

MEMS pressure sensor

Microfabricated ultrasonic transducer having individual cells with...

Attachment of stress sensitive integrated circuit dies

Method of making ohmic contact on low doped bulk silicon for optica...

Integrated structure of mems microphone and air pressure sensor and...

Method of making ohmic contact on low doped bulk silicon for optica...

Bottom electrode via structures for micromachined ultrasonic transd...

MEMS microphone

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

Device for protecting FEOL element and BEOL element

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

MICROMECHANICAL COMPONENT AND SCANNING DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

CMOS ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND METHODS

MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

BOTTOM ELECTRODE VIA STRUCTURES FOR MICROMACHINED ULTRASONIC TRANSD...

REDUCED LIGHT REFLECTION PACKAGE

DETECTION STRUCTURE FOR A MEMS ACCELEROMETER HAVING IMPROVED PERFOR...

HIGH ACCURACY TEMPERATURE-COMPENSATED PIEZORESISTIVE POSITION SENSI...

MEMS PRESSURE SENSOR

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE WITH OUTGAS LAYER

MEMS MICROPHONE PACKAGE

MICROMACHINED SUPERCONDUCTING INTERCONNECT IN SILICON

MEMS MICROPHONE AND MEMS ACCELEROMETER ON A SINGLE SUBSTRATE

MEMS SENSOR PACKAGE AND ITS MANUFACTURING METHOD

OUTGASSING MATERIAL COATED CAVITY FOR A MICRO-ELECTRO MECHANICAL SY...

MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE AND NOISE CANCELLATIO...

ACCELEROMETER-BASED ACOUSTIC BEAMFORMER VECTOR SENSOR WITH COLLOCAT...

MEMS DEVICE WITH INTEGRATED CMOS CIRCUIT

MEMS MICROPHONE

PHOTOSENSITIVE TRANSISTOR, METHOD FOR MANUFACTURING A PHOTOSENSITIV...

COMPACT, EASY-TO-PRODUCE MEMS PACKAGE WITH IMPROVED PROTECTIVE PROP...

Attachment of Stress Sensitive Integrated Circuit Dies

INERTIAL MEASUREMENT UNIT

ELECTRONIC ACOUSTIC DEVICES, MEMS MICROPHONES, AND EQUALIZATION MET...

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

SIGNAL PROCESSING METHOD AND DEVICE OF MEMS MICROPHONE AND MEMS MIC...

ENHANCED MEMS SENSOR EMBEDDED HEATER