The principal constituent being an elastomer

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H01L2224/29191

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29191The principal constituent being an elastomer

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Patents Grantslast 30 patents

Information Patent Grant
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Information Patent Grant
Stack of electrical components and method of producing the same
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Information Patent Grant
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The principal constituent being an elastomer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package, heat dissipation structure and manufacturing me...

Thermal conductive silicone composition, semiconductor device, and...

Methods and systems for attaching detectors to electronic readout s...

Compressible foamed thermal interface materials and methods of maki...

Light emitting module and method for manufacturing same

Underfill flow management in electronic assemblies

Stack of electrical components and method of producing the same

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Methods of manufacturing stacked semiconductor die assemblies with...

Compressible foamed thermal interface materials and methods of maki...

Thermosetting silicone resin composition and die attach material fo...

Semiconductor devices and methods of making the same

Photosensitive resin composition, photosensitive resin coating, pho...

Multi-die package with bridge layer

Silicone structure-containing polymer, photosensitive resin composi...

Die bonding material, light-emitting device, and method for produci...

Compressible foamed thermal interface materials and methods of maki...

Stack of electrical components and method of producing the same

Semiconductor device having a cooling body with a groove

Selectively cross-linked thermal interface materials

Dam for three-dimensional integrated circuit

Semiconductor packaging structure and process

Semiconductor devices and semiconductor devices including a redistr...

Power semiconductor module, power conversion device using same, and...

Piezoelectric vibration component and application method

Semiconductor devices and methods of making the same

Method of manufacturing light emitting device with light-transmissi...

Methods for making multi-die package with bridge layer

Conformal dummy die

Semiconductor die assemblies with heat sink and associated systems...

Patents Applicationslast 30 patents

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

Methods and Systems for Attaching Detectors to Electronic Readout S...

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

COMPOSITE COMPONENT

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

LIGHT-EMITTING DEVICE AND LIGHT-EMITTING MODULE

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

COMPOSITION, MULTILAYER BODY AND METHOD FOR PRODUCING MULTILAYER BODY

Joining and Insulating Power Electronic Semiconductor Components

LEADFRAME PACKAGE WITH METAL INTERPOSER

Circuits Including Micropatterns and Using Partial Curing to Adhere...

SEMICONDUCTOR PACKAGE INHIBITING VISCOUS MATERIAL SPREAD

COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...

THERMAL CONDUCTIVE SILICONE COMPOSITION, SEMICONDUCTOR DEVICE, AND...

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH...

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME

Methods and Systems for Attaching Detectors to Electronic Readout S...

THERMOSETTING SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL FO...

DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...

Methods for Making Multi-Die Package With Bridge Layer

STACK OF ELECTRICAL COMPONENTS AND METHOD OF PRODUCING THE SAME