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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2207/00Micro-structural systems or auxiliary parts thereof

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B81B2207/096through the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronics package with vertically stacked MEMS device and co...
- Patent number 12,129,168
- Issue date Oct 29, 2024
- Qorvo US, Inc.
- Julio C. Costa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 12,122,667
- Issue date Oct 22, 2024
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing monolithic integration of piezoelectric microm...
- Patent number 12,037,239
- Issue date Jul 16, 2024
- VANGUARD INTERNATIONAL SEMICONDUCTOR SINGAPORE PTE. LTD.
- You Qian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-layer micro-ribbon MEMS light modulator
- Patent number 11,958,738
- Issue date Apr 16, 2024
- Silicon Light Machines Corporation
- Olav Solgaard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging of microfluidic devices and microfluidic integrated syste...
- Patent number 11,926,522
- Issue date Mar 12, 2024
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor devices with gas-permeable cover and associated production m...
- Patent number 11,795,053
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,784,110
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung Hao Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,691,870
- Issue date Jul 4, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 11,685,646
- Issue date Jun 27, 2023
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a microelectromechanical structure a...
- Patent number 11,667,519
- Issue date Jun 6, 2023
- STMicroelectronics S.r.l.
- Alessandro Tocchio
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal transmitting device
- Patent number 11,581,480
- Issue date Feb 14, 2023
- Fuji Electric Co., Ltd.
- Masashi Akahane
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating silicon MEMS gyroscopes with upper and lowe...
- Patent number 11,530,917
- Issue date Dec 20, 2022
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,427,466
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS transducing apparatus and method of fabricating the same
- Patent number 11,401,159
- Issue date Aug 2, 2022
- FORMOSA MATERIAL INDUSTRIAL CORP.
- Chun-Lung Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,383,970
- Issue date Jul 12, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing MEMS transducer, MEMS transducer, ultrasound p...
- Patent number 11,369,345
- Issue date Jun 28, 2022
- Konica Minolta, Inc.
- Yuta Nakayama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 11,319,207
- Issue date May 3, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Water proofing and water detection schemes for MEMS-based environme...
- Patent number 11,305,984
- Issue date Apr 19, 2022
- Apple Inc.
- Krishna Prasad Vummidi Murali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical device with signal routing through a protect...
- Patent number 11,274,036
- Issue date Mar 15, 2022
- STMicroelectronics S.r.l.
- Giorgio Allegato
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Absolute and differential pressure sensors and related methods
- Patent number 11,254,565
- Issue date Feb 22, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 11,180,365
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chih Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 11,148,937
- Issue date Oct 19, 2021
- Mitsubishi Electric Corporation
- Yasuo Yamaguchi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Full symmetric multi-throw switch using conformal pinched through via
- Patent number 11,148,935
- Issue date Oct 19, 2021
- Menlo Microsystems, Inc.
- Xu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Through silicon via (TSV) formation in integrated circuits
- Patent number 11,097,942
- Issue date Aug 24, 2021
- Analog Devices, Inc.
- Thomas Kieran Nunan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS thermal fluid flow sensing device employing a flow sensor and...
- Patent number 11,035,709
- Issue date Jun 15, 2021
- Cambridge Enterprise Limited
- Andrea De Luca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with discharge path, and method for producing...
- Patent number 11,027,968
- Issue date Jun 8, 2021
- Denso Corporation
- Megumi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...
- Publication number 20240417241
- Publication date Dec 19, 2024
- Connaught Electronics Ltd.
- Gerard Conway
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
- Publication number 20240359972
- Publication date Oct 31, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Lihui WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...
- Publication number 20240327203
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE
- Publication number 20240317577
- Publication date Sep 26, 2024
- Mitsubishi Electric Corporation
- Yusuke SHIRAYANAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME
- Publication number 20240270567
- Publication date Aug 15, 2024
- Murata Manufacturing Co., Ltd.
- Hiroshi MATSUBARA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE
- Publication number 20240199411
- Publication date Jun 20, 2024
- Qorvo US, Inc.
- Robertus Petrus Van Kampen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240132340
- Publication date Apr 25, 2024
- STMicroelectronics (Malta) Ltd.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD
- Publication number 20240076181
- Publication date Mar 7, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20240002217
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MICROPHONE PACKAGE
- Publication number 20230391610
- Publication date Dec 7, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER
- Publication number 20230345182
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE
- Publication number 20230345184
- Publication date Oct 26, 2023
- Fortemedia, Inc.
- Yen-Son Paul HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Fabrication Method of MEMS Transducer Element
- Publication number 20230146234
- Publication date May 11, 2023
- TE Connectivity Solutions GMBH
- Jean-Francois Le Neal
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...
- Publication number 20230076161
- Publication date Mar 9, 2023
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...
- Publication number 20230034707
- Publication date Feb 2, 2023
- BFLY Operations, Inc
- Jianwei Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Dual-Layer Micro-ribbon MEMS Light Modulator
- Publication number 20230022807
- Publication date Jan 26, 2023
- SILICON LIGHT MACHINES CORPORATION
- Olav Solgaard
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230002217
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Jae Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220112076
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112077
- Publication date Apr 14, 2022
- Ningbo Semiconductor International Corporation (Shanghai Branch)
- Xiaoshan QIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor and Package Assembly Thereof
- Publication number 20220002145
- Publication date Jan 6, 2022
- ROBERT BOSCH GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via
- Publication number 20210403317
- Publication date Dec 30, 2021
- Xu Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...
- Publication number 20210323812
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS TRANSDUCING APPARATUS AND METHOD OF FABRICATING THE SAME
- Publication number 20210300748
- Publication date Sep 30, 2021
- FORMOSA MATERIAL INDUSTRIAL CORP.
- Chun-Lung HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

through the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronics package with vertically stacked MEMS device and co...

Sensor devices with gas-permeable cover and associated production m...

Silicon MEMS gyroscopes with upper and lower sense plates

Method for producing monolithic integration of piezoelectric microm...

Dual-layer micro-ribbon MEMS light modulator

Packaging of microfluidic devices and microfluidic integrated syste...

Sensor devices with gas-permeable cover and associated production m...

Semiconductor package and method for manufacturing the same

Semiconductor device including a microelectromechanical structure a...

Sensor and package assembly thereof

Semiconductor device including a microelectromechanical structure a...

Semiconductive structure and manufacturing method thereof

Signal transmitting device

Methods for fabricating silicon MEMS gyroscopes with upper and lowe...

Semiconductor package structure and method for manufacturing the same

Inter-poly connection for parasitic capacitor and die size improvement

MEMS transducing apparatus and method of fabricating the same

Semiconductor devices and related methods

Method for producing MEMS transducer, MEMS transducer, ultrasound p...

Semiconductor device and method of forming MEMS package

Water proofing and water detection schemes for MEMS-based environme...

Microelectromechanical device with signal routing through a protect...

Absolute and differential pressure sensors and related methods

MEMS devices and methods of forming same

Method of manufacturing semiconductor device and semiconductor device

Full symmetric multi-throw switch using conformal pinched through via

Through silicon via (TSV) formation in integrated circuits

Semiconductor module

CMOS thermal fluid flow sensing device employing a flow sensor and...

Semiconductor device with discharge path, and method for producing...

Patents Applicationslast 30 patents

MEMS PACKAGING WITH ACTUATOR STATOR PROVIDING ELECTRICAL CONNECTION...

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MEMS DIES EMBEDDED IN GLASS CORES

METHOD FOR MANUFACTURING A MEMS TRANSDUCER DEVICE WITH THIN MEMBRAN...

MEMS ELEMENT, OPTICAL SCANNING DEVICE, AND DISTANCE MEASURING DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

ACOUSTIC DEVICE AND MODULE INCLUDING THE SAME

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

VERTICALLY STACKED MEMS DEVICES AND CONTROLLER DEVICE

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

MICRO ELECTRO-MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

MEMS MICROPHONE PACKAGE

PACKAGE WITH INTEGRATED DEVICE DIE AT LEAST DISPOSED WITHIN CARRIER

MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE PACKAGE

Fabrication Method of MEMS Transducer Element

METHODS FOR FABRICATING SILICON MEMS GYROSCOPES WITH UPPER AND LOWE...

PACKAGING STRUCTURES AND PACKAGING METHODS FOR ULTRASOUND-ON-CHIP D...

Dual-Layer Micro-ribbon MEMS Light Modulator

SEMICONDUCTOR DEVICES AND RELATED METHODS

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

MEMS PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

MEMS ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREOF

Sensor and Package Assembly Thereof

Full Symmetric Multi-Throw Switch Using Conformal Pinched Through Via

SENSOR DEVICES WITH GAS-PERMEABLE COVER AND ASSOCIATED PRODUCTION M...

MEMS TRANSDUCING APPARATUS AND METHOD OF FABRICATING THE SAME