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Tin [Sn] as principal constituent
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H01L2224/05611
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/05611
Tin [Sn] as principal constituent
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last 30 patents
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Patent Grant
Semiconductor structure and manufacturing method thereof
Patent number
11,984,417
Issue date
May 14, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming same
Patent number
11,973,045
Issue date
Apr 30, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a connection between component parts, and comp...
Patent number
11,961,820
Issue date
Apr 16, 2024
OSRAM OLED GmbH
Simeon Katz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having pixels with the same active layer and method...
Patent number
11,942,025
Issue date
Mar 26, 2024
Samsung Display Co., Ltd.
Jin Wan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon photonic interposer with two metal redistribution layers
Patent number
11,923,327
Issue date
Mar 5, 2024
Rockley Photonics Limited
Michael Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device and method for manufacturing the same
Patent number
11,894,335
Issue date
Feb 6, 2024
Japan Display Inc.
Kazuyuki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,869,870
Issue date
Jan 9, 2024
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip and manufacturing method thereof, and electronic device
Patent number
11,862,529
Issue date
Jan 2, 2024
Huawei Technologies Co., Ltd.
Chaojun Deng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,862,589
Issue date
Jan 2, 2024
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
Patent number
11,837,562
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chang-Pin Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting panel, method manufacturing the same, and display de...
Patent number
11,817,461
Issue date
Nov 14, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Maoxia Zhu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,810,878
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display device and method for fabricating the same
Patent number
11,784,177
Issue date
Oct 10, 2023
Samsung Display Co., Ltd.
Seung Geun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,764,139
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode containing a grating and methods of making the...
Patent number
11,695,100
Issue date
Jul 4, 2023
Nanosys, Inc.
Zhen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
Patent number
11,676,938
Issue date
Jun 13, 2023
JCET Semiconductor (Shaoxing) Co., Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
11,670,618
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
Patent number
11,640,948
Issue date
May 2, 2023
Micron Technology, Inc.
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged die and RDL with bonding structures therebetween
Patent number
11,640,958
Issue date
May 2, 2023
Taiwan Semiconductor Manufacturing Company
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,557,641
Issue date
Jan 17, 2023
Samsung Display Co., Ltd.
Byeong Beom Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device bonding area including fused solder film and m...
Patent number
11,545,452
Issue date
Jan 3, 2023
Lapis Semiconductor Co., Ltd.
Masanori Shindo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding process with inhibited oxide formation
Patent number
11,488,930
Issue date
Nov 1, 2022
SiTime Corporation
Paul M. Hagelin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die package with bridge layer
Patent number
11,476,125
Issue date
Oct 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei Sen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,373,990
Issue date
Jun 28, 2022
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DRIVING SUBSTRATE, MICRO LED TRANSFER DEVICE AND MICRO LED TRANSFER...
Publication number
20240153908
Publication date
May 9, 2024
HKC Corporation Limited
YANG PU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
Publication number
20240153915
Publication date
May 9, 2024
SK HYNIX INC.
Hee Sun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING TEST PADS
Publication number
20240145317
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Joongwon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
Publication number
20240131633
Publication date
Apr 25, 2024
Sekisui Chemical Co., Ltd.
Hidefumi YASUI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240113090
Publication date
Apr 4, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Won Myoung KI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND PROCESS FOR IMPLEMENTING SILICON CARBIDE (SIC) SURFACE M...
Publication number
20240105390
Publication date
Mar 28, 2024
Wolfspeed, Inc.
Kok Meng KAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF FORMATION
Publication number
20240107780
Publication date
Mar 28, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Hybrid Substrates
Publication number
20240096807
Publication date
Mar 21, 2024
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING DISPLAY PANEL
Publication number
20240072027
Publication date
Feb 29, 2024
SAMSUNG DISPLAY CO., LTD.
Jeong Won HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063178
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING STACKED CHIPS AND METHOD OF MANUFAC...
Publication number
20240063186
Publication date
Feb 22, 2024
SAMSUNG ELECTRONICS CO,. LTD.
SEYONG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Dummy vias in WLP
Publication number
20240055374
Publication date
Feb 15, 2024
STATS ChipPAC Pte Ltd.
Peik Eng Ooi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
Publication number
20240038723
Publication date
Feb 1, 2024
International Business Machines Corporation
Jae-Woong Nah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
Publication number
20240014155
Publication date
Jan 11, 2024
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Wenjie HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL (3D) CHIPLET AND METHODS FOR FORMING THE SAME
Publication number
20230420437
Publication date
Dec 28, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chieh-Yen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming SIP Module Absent Substrate
Publication number
20230352316
Publication date
Nov 2, 2023
STATS ChipPAC Pte Ltd.
JiEun Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
Publication number
20230343668
Publication date
Oct 26, 2023
UTAC Headquarters Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
Publication number
20230343734
Publication date
Oct 26, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka UZOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED DIE AND RDL WITH BONDING STRUCTURES THEREBETWEEN
Publication number
20230253395
Publication date
Aug 10, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
Publication number
20230238346
Publication date
Jul 27, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Luguang WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230215791
Publication date
Jul 6, 2023
Samsung Electronics Co., Ltd.
Jinmo Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND DISPLAY APPARATUS
Publication number
20230197648
Publication date
Jun 22, 2023
Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Xiaobo HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STEP INTERCONNECT METALLIZATION TO ENABLE PANEL LEVEL PACKAGING
Publication number
20230178507
Publication date
Jun 8, 2023
NEXPERIA B.V.
Randolph Estal Flauta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
Publication number
20230154885
Publication date
May 18, 2023
Samsung Electronics Co., LTD
Jinyoung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
Publication number
20230154877
Publication date
May 18, 2023
Industrial Technology Research Institute
Yu-Ming Peng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230111670
Publication date
Apr 13, 2023
SAMSUNG DISPLAY CO., LTD.
Jin Wan KIM
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Application
DISPLAY DEVICE
Publication number
20230069296
Publication date
Mar 2, 2023
SAMSUNG DISPLAY CO., LTD.
Joo Woan CHO
H01 - BASIC ELECTRIC ELEMENTS