Treating holes before another process

Industry

CPC
H05K2203/143

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/143Treating holes before another process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,058,818
- Issue date Aug 6, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 11,956,897
- Issue date Apr 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant pin surface mount technology pad for rework
- Patent number 11,647,591
- Issue date May 9, 2023
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device
- Patent number 11,399,429
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,811,210
- Issue date Oct 20, 2020
- Sanmina Corporation
- Shinichi Iketani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing backdrilling elimination utilizing anti-electroplate c...
- Patent number 10,798,829
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,687,419
- Issue date Jun 16, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board via hole registration and accuracy
- Patent number 10,446,356
- Issue date Oct 15, 2019
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuses with integrated metals
- Patent number 10,276,337
- Issue date Apr 30, 2019
- Littelfuse, Inc.
- Michael Doering
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implementing backdrilling elimination utilizing anti-electroplate c...
- Patent number 10,076,045
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for constructing an external circuit structure
- Patent number 10,015,889
- Issue date Jul 3, 2018
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Zhongyao Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming vias on printed circuit boards
- Patent number 9,999,137
- Issue date Jun 12, 2018
- Intrinsiq Materials, Inc.
- David Ciufo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Implementing backdrilling elimination utilizing anti-electroplate c...
- Patent number 9,872,399
- Issue date Jan 16, 2018
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission board and method for manufacturing the same
- Patent number 9,706,656
- Issue date Jul 11, 2017
- Industrial Technology Research Institute
- Chien-Min Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional organic or glass interposer
- Patent number 9,490,197
- Issue date Nov 8, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impact absorption member and display device including the same
- Patent number 9,370,112
- Issue date Jun 14, 2016
- Samsung Display Co., Ltd.
- Jae-Chun Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a multilayer substrate structure for fine line
- Patent number 9,370,110
- Issue date Jun 14, 2016
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 8,240,033
- Issue date Aug 14, 2012
- Imbera Electronics Oy
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 7,459,202
- Issue date Dec 2, 2008
- Motorola, Inc.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical circuit board and a method for making the same
- Patent number 6,838,623
- Issue date Jan 4, 2005
- Visteon Global Technologies, Inc.
- Lawrence Kneisel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 6,740,819
- Issue date May 25, 2004
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making metal core substrate printed circuit wiring board...
- Patent number 6,711,812
- Issue date Mar 30, 2004
- Unicap Electronics Industrial Corporation
- Jane Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for creating a connection within a multilayer circuit board...
- Patent number 6,612,025
- Issue date Sep 2, 2003
- Visteon Global Tech., Inc.
- Zhong-You (Joe) Shi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a printed wiring board
- Patent number 6,608,757
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Anilkumar C. Bhatt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole fill composition and method for filling holes in a substrate
- Patent number 6,589,639
- Issue date Jul 8, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, substrate for a semiconductor device, method...
- Patent number 6,586,274
- Issue date Jul 1, 2003
- Seiko Epson Corporation
- Akihiro Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240260181
- Publication date Aug 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...
- Publication number 20230121285
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Sangwon HA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...
- Publication number 20230081618
- Publication date Mar 16, 2023
- INTELLIMICRO MEDICAL CO., LTD.
- Yu-chong Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230069980
- Publication date Mar 9, 2023
- IBIDEN CO., LTD.
- Tomoyuki IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20230030601
- Publication date Feb 2, 2023
- IBIDEN CO., LTD.
- Satoru KAWAI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK
- Publication number 20220400557
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220361326
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
- Publication number 20210112669
- Publication date Apr 15, 2021
- National Taiwan University of Science and Technology
- CHIH-WEI CHIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200296827
- Publication date Sep 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY
- Publication number 20200043690
- Publication date Feb 6, 2020
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20190327840
- Publication date Oct 24, 2019
- Corning Incorporated
- Dana Craig Bookbinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE
- Publication number 20190208643
- Publication date Jul 4, 2019
- Intel Corporation
- Tin Poay CHUAH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180359853
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Ming-Ze LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE
- Publication number 20180160525
- Publication date Jun 7, 2018
- KABUSHIKI KAISHA TOSHIBA
- Yoshiaki SATAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...
- Publication number 20180098438
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...
- Publication number 20180027665
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...
- Publication number 20180027666
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER
- Publication number 20160141237
- Publication date May 19, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A MULTILAYER SUBSTRATE STRUCTURE FOR FINE LINE
- Publication number 20150282333
- Publication date Oct 1, 2015
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD AND MANUFACTURING...
- Publication number 20140299363
- Publication date Oct 9, 2014
- KUO-FU SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140029173
- Publication date Jan 30, 2014
- Jae-Chun PARK
- G02 - OPTICS
Information Patent Application
Layered ceramic electronic component and manufacturing method therefor
- Publication number 20100038120
- Publication date Feb 18, 2010
- TDK Corporation
- Tatsuya Kojima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Circuit Board And Method Of Fabricating The Same
- Publication number 20090000808
- Publication date Jan 1, 2009
- Te-Sheng Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Circuit Board Structure, and a Circuit B...
- Publication number 20080196930
- Publication date Aug 21, 2008
- IMBERA ELECTRONICS OY
- Risto Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20080003414
- Publication date Jan 3, 2008
- MOTOROLA, INC.
- Jaroslaw A. Magera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal core substrate printed wiring board enabling thermally enhanc...
- Publication number 20040163248
- Publication date Aug 26, 2004
- Unicap Electronics Industrial Corporation
- Jane Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole fill composition and method for filling holes in a substrate
- Publication number 20030216490
- Publication date Nov 20, 2003
- International Business Machines Corporation
- Donald S. Farquhar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Treating holes before another process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hermetic metallized via with improved reliability

Method for manufacturing printed wiring board

Semiconductor package device and method of manufacturing the same

Compliant pin surface mount technology pad for rework

Semiconductor package device

Hermetic metallized via with improved reliability

Hermetic metallized via with improved reliability

Multilayer printed circuit board via hole registration and accuracy

Implementing backdrilling elimination utilizing anti-electroplate c...

Semiconductor package device and method of manufacturing the same

Multilayer printed circuit board via hole registration and accuracy

Fuses with integrated metals

Implementing backdrilling elimination utilizing anti-electroplate c...

Fabrication of intra-structure conductive traces and interconnects...

Method for constructing an external circuit structure

Method for forming vias on printed circuit boards

Implementing backdrilling elimination utilizing anti-electroplate c...

Signal transmission board and method for manufacturing the same

Three dimensional organic or glass interposer

Impact absorption member and display device including the same

Method of manufacturing a multilayer substrate structure for fine line

Method for manufacturing a circuit board

Printed circuit board

Electrical circuit board and a method for making the same

Printed wiring board

Method of making metal core substrate printed circuit wiring board...

Method for creating a connection within a multilayer circuit board...

Method for making a printed wiring board

Hole fill composition and method for filling holes in a substrate

Semiconductor device, substrate for a semiconductor device, method...

Patents Applicationslast 30 patents

Component Carrier and Method Manufacturing the Same

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

PRINTED CIRCUIT BOARD, FABRICATION METHOD OF THE SAME AND ELECTRONI...

CONNECTION METHOD FOR CHIP AND CIRCUIT BOARD, AND CIRCUIT BOARD ASS...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

COMPLIANT PIN SURFACE MOUNT TECHNOLOGY PAD FOR REWORK

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED CIRCUIT BOARD VIA HOLE REGISTRATION AND ACCURACY

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

VERTICAL EMBEDDED COMPONENT IN A PRINTED CIRCUIT BOARD BLIND HOLE

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD DEVICE

IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...

IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...

IMPLEMENTING BACKDRILLING ELIMINATION UTILIZING ANTI-ELECTROPLATE C...

THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER

METHOD OF MANUFACTURING A MULTILAYER SUBSTRATE STRUCTURE FOR FINE LINE

STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD AND MANUFACTURING...

IMPACT ABSORPTION MEMBER AND DISPLAY DEVICE INCLUDING THE SAME

Layered ceramic electronic component and manufacturing method therefor

Flexible Printed Circuit Board And Method Of Fabricating The Same

Method for Manufacturing a Circuit Board Structure, and a Circuit B...

PRINTED CIRCUIT BOARD

Metal core substrate printed wiring board enabling thermally enhanc...

Hole fill composition and method for filling holes in a substrate