with a principal constituent of the material being a non metallic, non metalloid inorganic material

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CPC
H01L2224/13686

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13686with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 11,257,775
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip method
- Patent number 10,770,425
- Issue date Sep 8, 2020
- TONGFU MICROELECTRONCS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 10,340,240
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive layer and conductive pill...
- Patent number 10,249,589
- Issue date Apr 2, 2019
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 10,153,243
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,991,221
- Issue date Jun 5, 2018
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-on-trace interconnection structure for flip-chip packages
- Patent number 9,917,035
- Issue date Mar 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Visibility event navigation method and system
- Patent number 9,916,763
- Issue date Mar 13, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. Jenkins
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,818,715
- Issue date Nov 14, 2017
- Renesas Electronics Corporation
- Jun Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and packaged...
- Patent number 9,646,923
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having solder joint and method of forming the...
- Patent number 9,646,945
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Soon-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming post-passivation interconnect structure
- Patent number 9,620,469
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to prevent solder extrusion
- Patent number 9,613,921
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having substrate with embedded metal trace overlapped by la...
- Patent number 9,536,850
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS
- Publication number 20240120305
- Publication date Apr 11, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...
- Publication number 20230044737
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Ren Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS
- Publication number 20220328448
- Publication date Oct 13, 2022
- InnoLux Corporation
- Ming-Chang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20200273354
- Publication date Aug 27, 2020
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G05 - CONTROLLING REGULATING
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20190236964
- Publication date Aug 1, 2019
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
- Publication number 20180268724
- Publication date Sep 20, 2018
- PRIMAL SPACE SYSTEMS, INC.
- Barry L. JENKINS
- G08 - SIGNALLING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20180047696
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Jun YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20170084563
- Publication date Mar 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure and Method of Forming Same
- Publication number 20150357301
- Publication date Dec 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES
- Publication number 20140264854
- Publication date Sep 18, 2014
- Oracle International Corporation
- Hiren D. Thacker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package Having Substrate with Embedded Metal Trace Overlapped by La...
- Publication number 20140252598
- Publication date Sep 11, 2014
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...
- Publication number 20140167253
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connector Design for Packaging Integrated Circuits
- Publication number 20140131864
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES IN SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATIN...
- Publication number 20140124922
- Publication date May 8, 2014
- SK HYNIX INC.
- Taek Joong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-ON-TRACE INTERCONNECTION STRUCTURE FOR FLIP-CHIP PACKAGES
- Publication number 20140110847
- Publication date Apr 24, 2014
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ladder Bump Structures and Methods of Making Same
- Publication number 20140077359
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection Structure and Method of Forming Same
- Publication number 20140077360
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Structure and Method of Forming Same
- Publication number 20140077358
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Bump and Method of Manufacturing Same
- Publication number 20140077365
- Publication date Mar 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140061920
- Publication date Mar 6, 2014
- PANASONIC CORPORATION
- Hiroshige HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures and Methods with a Metal Pillar
- Publication number 20140038405
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

with a principal constituent of the material being a non metallic, non metalloid inorganic material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and manufacturing method thereof

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Solderless interconnection structure and method of forming same

Multilayer substrate

Structures and methods for low temperature bonding using nanoparticles

Mechanisms for forming post-passivation interconnect structure

Solderless interconnection structure and method of forming same

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Flip-chip method

Structures and methods for low temperature bonding using nanoparticles

Mechanisms for forming post-passivation interconnect structure

Solderless interconnection structure and method of forming same

Bonding electrode structure of flip-chip led chip and fabrication m...

Semiconductor device including conductive layer and conductive pill...

Cu pillar bump with L-shaped non-metal sidewall protection structure

Semiconductor devices, methods of manufacture thereof, and packaged...

Structures having a tapering curved profile and methods of making same

Semiconductor integrated circuit device

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Bump-on-trace interconnection structure for flip-chip packages

Visibility event navigation method and system

Semiconductor integrated circuit device

Semiconductor devices, methods of manufacture thereof, and packaged...

Semiconductor device having solder joint and method of forming the...

Mechanisms for forming post-passivation interconnect structure

Structure to prevent solder extrusion

Package having substrate with embedded metal trace overlapped by la...

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

PACKAGE ARCHITECTURE WITH INTERCONNECT MIGRATION BARRIERS

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...

MANUFACTURING METHOD OF AN ELECTRONIC APPARATUS

Solderless Interconnection Structure and Method of Forming Same

Structures And Methods For Low Temperature Bonding Using Nanoparticles

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

Structures And Methods For Low Temperature Bonding Using Nanoparticles

FLIP-CHIP METHOD

Solderless Interconnection Structure and Method of Forming Same

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE

Bump Structure and Method of Forming Same

MULTI-CHIP MODULE WITH SELF-POPULATING POSITIVE FEATURES

Package Having Substrate with Embedded Metal Trace Overlapped by La...

Semiconductor Devices, Methods of Manufacture Thereof, and Packaged...

Connector Design for Packaging Integrated Circuits

BUMP STRUCTURES IN SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATIN...

BUMP-ON-TRACE INTERCONNECTION STRUCTURE FOR FLIP-CHIP PACKAGES

Ladder Bump Structures and Methods of Making Same

Interconnection Structure and Method of Forming Same

Bump Structure and Method of Forming Same

Metal Bump and Method of Manufacturing Same

SEMICONDUCTOR DEVICE

Packaging Structures and Methods with a Metal Pillar