with at least one cell select transistor

Industry

CPC
H01L27/11524

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/11524with at least one cell select transistor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,688,682
- Issue date Jun 27, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,676,836
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Jae Ick Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor memory device
- Patent number 11,678,488
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Seokcheon Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory array with local line selector
- Patent number 11,672,123
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Jun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory device including shared select gate connections between m...
- Patent number 11,670,370
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Aaron Yip
- G11 - INFORMATION STORAGE
Information Patent Grant
Sense line structures in capacitive sense NAND memory
- Patent number 11,670,379
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory device
- Patent number 11,670,382
- Issue date Jun 6, 2023
- Kioxia Corporation
- Takuya Futatsuyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,672,114
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Improving surface topography by forming spacer-like components
- Patent number 11,665,897
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staircase structure in three-dimensional memory device and method f...
- Patent number 11,665,892
- Issue date May 30, 2023
- Yangtze Memory Technologies Co., Ltd.
- Zhongwang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses having strings of memory cells including a...
- Patent number 11,665,893
- Issue date May 30, 2023
- Micron Technology, Inc.
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split gate memory device and method of fabricating the same
- Patent number 11,658,224
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,658,113
- Issue date May 23, 2023
- SK hynix Inc.
- Jin Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies
- Patent number 11,658,132
- Issue date May 23, 2023
- Micron Technology, Inc.
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including staircase structures
- Patent number 11,653,499
- Issue date May 16, 2023
- Micron Technology, Inc.
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with multiple tiers, and methods
- Patent number 11,653,497
- Issue date May 16, 2023
- Micron Technology, Inc.
- Toru Tanzawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical memory devices with bending prevention layers
- Patent number 11,652,068
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Sunil Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on standard commodity FPGA IC chips
- Patent number 11,651,132
- Issue date May 16, 2023
- iCometrue Company Ltd.
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory cell pillar including source junction plug
- Patent number 11,653,494
- Issue date May 16, 2023
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming NAND cell units
- Patent number 11,646,363
- Issue date May 9, 2023
- Micron Technology, Inc.
- Yongjun Jeff Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor storage device
- Patent number 11,646,354
- Issue date May 9, 2023
- Kioxia Corporation
- Shinya Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array comprising...
- Patent number 11,641,742
- Issue date May 2, 2023
- Micron Technology, Inc.
- Cole Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays and methods used in forming a memory array
- Patent number 11,640,837
- Issue date May 2, 2023
- Micron Technology, Inc.
- Armin Saeedi Vahdat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device having composite dielectric film struct...
- Patent number 11,637,046
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,637,116
- Issue date Apr 25, 2023
- Kioxia Corporation
- Takuya Inatsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system and method for controlling nonvolatile memory
- Patent number RE49508
- Issue date Apr 25, 2023
- Kioxia Corporation
- Shinichi Kanno
Information Patent Grant
Three-dimensional (3D) semiconductor memory device
- Patent number 11,637,121
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Junhyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including isolation structures neighboring...
- Patent number 11,637,178
- Issue date Apr 25, 2023
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor devices
- Patent number 11,637,120
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Manjoong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked memory structure with insulating patterns
- Patent number 11,637,124
- Issue date Apr 25, 2023
- SK hynix Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Non-volatile Memory Cell
- Publication number 20240179900
- Publication date May 30, 2024
- AMIC Technology Corporation
- Hsiao-Hua Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240155843
- Publication date May 9, 2024
- UNITED MICROELECTRONICS CORP.
- Wang Xiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130129
- Publication date Apr 18, 2024
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...
- Publication number 20240130130
- Publication date Apr 18, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jiayi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS
- Publication number 20240130128
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Yongjun Hu
- G11 - INFORMATION STORAGE
Information Patent Application
CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION
- Publication number 20240120371
- Publication date Apr 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- James McClay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240114683
- Publication date Apr 4, 2024
- WINBOND ELECTRONICS CORP.
- Tsung-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...
- Publication number 20240107758
- Publication date Mar 28, 2024
- SANDISK TECHNOLOGIES LLC
- Hiroyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107760
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20240107761
- Publication date Mar 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- Di Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERVENING POLYSILICON MATERIALS THAT ARE THICKER AT DISTAL EDGES...
- Publication number 20240081070
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...
- Publication number 20240079057
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240081051
- Publication date Mar 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...
- Publication number 20240074200
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Bing ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED STAIRCASE VIA ROUTING FOR MEMORY
- Publication number 20240071902
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Shuangqiang Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...
- Publication number 20240071498
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yongjun Jeff Hu
- G11 - INFORMATION STORAGE
Information Patent Application
SELF-SUPPORTING SGD STADIUM
- Publication number 20240071497
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...
- Publication number 20240074170
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Takashi YUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...
- Publication number 20240074171
- Publication date Feb 29, 2024
- SANDISK TECHNOLOGIES LLC
- Masanori TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A STEPPED PILLAR REGION, AND RELATED...
- Publication number 20240074184
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Masaaki Higuchi
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240071496
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- John D. Hopkins
- G11 - INFORMATION STORAGE
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240074201
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Matthew J. King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ISOLATION DEVICE AND METHOD
- Publication number 20240064976
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Michael Andrew Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING A LAYERED SEMICONDUCTOR STRUCTURE FOR NAND...
- Publication number 20240064977
- Publication date Feb 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qian LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240057326
- Publication date Feb 15, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057332
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS, AN...
- Publication number 20240057328
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Umberto Maria Meotto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...
- Publication number 20240057331
- Publication date Feb 15, 2024
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY, FABRICATION AND CONTROL METHODS THEREOF
- Publication number 20240032291
- Publication date Jan 25, 2024
- HeFeChip Corporation Limited
- Geeng-Chuan Chern
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240029794
- Publication date Jan 25, 2024
- Micron Technology, Inc.
- Lifang Xu
- G11 - INFORMATION STORAGE

with at least one cell select transistor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device and manufacturing method of the semicon...

Semiconductor device

Three-dimensional semiconductor memory device

Three-dimensional memory array with local line selector

3D memory device including shared select gate connections between m...

Sense line structures in capacitive sense NAND memory

Memory device

Memory arrays and methods used in forming a memory array comprising...

Improving surface topography by forming spacer-like components

Staircase structure in three-dimensional memory device and method f...

Methods and apparatuses having strings of memory cells including a...

Split gate memory device and method of fabricating the same

Semiconductor memory device and manufacturing method of the semicon...

Integrated assemblies

Semiconductor devices including staircase structures

Semiconductor apparatus with multiple tiers, and methods

Vertical memory devices with bending prevention layers

Logic drive based on standard commodity FPGA IC chips

Memory cell pillar including source junction plug

Methods of forming NAND cell units

Semiconductor device and semiconductor storage device

Memory arrays and methods used in forming a memory array comprising...

Memory arrays and methods used in forming a memory array

Semiconductor memory device having composite dielectric film struct...

Semiconductor memory device

Memory system and method for controlling nonvolatile memory

Three-dimensional (3D) semiconductor memory device

Microelectronic devices including isolation structures neighboring...

Vertical semiconductor devices

Stacked memory structure with insulating patterns

Patents Applicationslast 30 patents

Non-volatile Memory Cell

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

THREE-DIMENSIONAL MEMORY DEIVCE, MANUFACTURING METHOD THEREOF, AND...

THREE-DIMENSIONAL MEMORY DEVICE, MANUFACTURING METHOD THEREOF, AND...

SINGLE CRYSTAL SILICON CORES FOR STACKED MEMORY CELLS

CIRCUITS HAVING ENHANCED ELECTRICAL ISOLATION

MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MEMORY OPENING MONITORIN...

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

INTERVENING POLYSILICON MATERIALS THAT ARE THICKER AT DISTAL EDGES...

MICROELECTRONIC DEVICES INCLUDING STAIRCASE STRUCTURES, AND RELATED...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING...

FOLDED STAIRCASE VIA ROUTING FOR MEMORY

Memory Arrays Comprising Strings Of Memory Cells And Methods Used I...

SELF-SUPPORTING SGD STADIUM

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DIPOLE-CONTAINING BLOCKIN...

BONDED ASSEMBLY CONTAINING CONDUCTIVE VIA STRUCTURES EXTENDING THRO...

ELECTRONIC DEVICES COMPRISING A STEPPED PILLAR REGION, AND RELATED...

Memory Circuitry And Method Used In Forming Memory Circuitry

Memory Circuitry And Method Used In Forming Memory Circuitry

SEMICONDUCTOR ISOLATION DEVICE AND METHOD

METHODS FOR FABRICATING A LAYERED SEMICONDUCTOR STRUCTURE FOR NAND...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

MICROELECTRONIC DEVICES, MEMORY DEVICES, AND ELECTRONIC SYSTEMS, AN...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING TRENCH BRIDGES AND METHOD...

NON-VOLATILE MEMORY, FABRICATION AND CONTROL METHODS THEREOF

Memory Circuitry And Method Used In Forming Memory Circuitry