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2906647
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Information
Patent Grant
2906647
References
Source
Patent Number
2,906,647
Date Filed
Not available
Date Issued
Tuesday, September 29, 1959
65 years ago
CPC
H01L21/67138 - Apparatus for wiring semiconductor or solid state device
G01R13/20 - Cathode-ray oscilloscopes; Oscilloscopes using other screens than CRT's
G01R21/00 - Arrangements for measuring electric power or power factor
H01J25/78 - Tubes with electron stream modulated by deflection in a resonator
H01J29/78 - along a circle, spiral or rotating radial line
H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/288 - from a liquid
H01L23/36 - Selection of materials, or shaping, to facilitate cooling or heating
H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01P1/18 - Phase-shifters
H01P7/06 - Cavity resonators
H03B9/02 - using a retarding-field tube
H01L2924/01005 - Boron [B]
H01L2924/01006 - Carbon [C]
H01L2924/01013 - Aluminum [Al]
H01L2924/01014 - Silicon [Si]
H01L2924/01019 - Potassium [K]
H01L2924/0103 - Zinc [Zn]
H01L2924/01033 - Arsenic [As]
H01L2924/01042 - Molybdenum [Mo]
H01L2924/01047 - Silver [Ag]
H01L2924/01072 - Hafnium [Hf]
H01L2924/01074 - Tungsten [W]
H01L2924/01078 - Platinum [Pt]
H01L2924/01082 - Lead [Pb]
H01L2924/01084 - Polonium [Po]
H01L2924/01322 - Eutectic Alloys
H01L2924/014 - Solder alloys
Y10T428/24917 - including metal layer
US Classifications
438 - Semiconductor device manufacturing: process
257 - Active solid-state devices
428 - Stock material or miscellaneous articles
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