2964831

Information

• Patent Grant
• 2964831

• References
• Source

• Patent Number

  2,964,831

• Date Filed

  Not available

• Date Issued

  Tuesday, December 20, 1960
  65 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
  • H01L23/16 - Fillings or auxiliary members in containers or encapsulations
  • H01L23/3135 - Double encapsulation or coating and encapsulation
  • H01L24/45 - of an individual wire connector
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/45147 - Copper (Cu) as principal constituent
  • H01L2224/45565 - Single coating layer
  • H01L2224/45611 - Tin (Sn) as principal constituent
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • H01L2924/10253 - Silicon [Si]
  • Y10T29/49171 - with encapsulating

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 029 - Metal working
  • 257 - Active solid-state devices
  • 338 - Electrical resistors