Tin (Sn) as principal constituent

Industry

CPC
H01L2224/45611

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45611Tin (Sn) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire method
- Patent number 9,245,670
- Issue date Jan 26, 2016
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor device, method of manufacturing the device and...
- Patent number 9,059,003
- Issue date Jun 16, 2015
- NIPPON MICROMETAL CORPORATION
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable wire structure and method
- Patent number 8,692,118
- Issue date Apr 8, 2014
- Tessera, Inc.
- Cyprian Uzoh
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device, relay member, and mounting substrate, and method...
- Patent number 8,304,870
- Issue date Nov 6, 2012
- Renesas Electronics Corporation
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,156,643
- Issue date Apr 17, 2012
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 7,911,061
- Issue date Mar 22, 2011
- Infineon Technologies AG
- Manfred Schneegans
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Self-healing polymer compositions
- Patent number 7,108,914
- Issue date Sep 19, 2006
- Motorola, Inc.
- Andrew Skipor
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stabilized wire bonded electrical connections and method of making...
- Patent number 7,032,311
- Issue date Apr 25, 2006
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead member with multiple conductive layers and specific grain size
- Patent number 6,140,583
- Issue date Oct 31, 2000
- The Fururakawa Electric Co., Ltd.
- Satoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low phosphorus containing band-shaped and/or filamentary material
- Patent number 5,045,410
- Issue date Sep 3, 1991
- Karl Neumayer, Erzeugung und Vertrieb von Kabeln, Drahten isolierten Leitunge...
- Heinz G. Hiesbock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3443914
- Patent number 3,443,914
- Issue date May 13, 1969
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3136032
- Patent number 3,136,032
- Issue date Jun 9, 1964
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3006067
- Patent number 3,006,067
- Issue date Oct 31, 1961
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2964831
- Patent number 2,964,831
- Issue date Dec 20, 1960
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170365576
- Publication date Dec 21, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20140157592
- Publication date Jun 12, 2014
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE WIRE STRUCTURE AND METHOD
- Publication number 20120325517
- Publication date Dec 27, 2012
- Tessera, Inc.
- Cyprian Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device, relay member, and mounting substrate, and method...
- Publication number 20110221050
- Publication date Sep 15, 2011
- RENESAS ELECTRONICS CORPORATION
- YOICHIRO KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110107595
- Publication date May 12, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080315423
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Wire and Integrated Circuit Device Using the Same
- Publication number 20070235887
- Publication date Oct 11, 2007
- Shingo Kaimori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding wire and an integrated circuit device using the same
- Publication number 20050151253
- Publication date Jul 14, 2005
- Sumitomo Electric Wintec, Incorporated
- Tsuyoshi Nonaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-healing polymer compositions
- Publication number 20040007784
- Publication date Jan 15, 2004
- MOTOROLA, INC.
- Andrew Skipor
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stabilized wire bonded electrical connections and method of making...
- Publication number 20030234451
- Publication date Dec 25, 2003
- Eli Razon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Tin (Sn) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Straight wirebonding of silicon dies

Method of forming an electrical contact and method of forming a chi...

Bonding wire for semiconductor device

Chip package and method of forming a chip package with a metal cont...

Reliable wire method

Power semiconductor device, method of manufacturing the device and...

Reliable wire structure and method

Electronic device, relay member, and mounting substrate, and method...

Semiconductor device

Semiconductor device

Self-healing polymer compositions

Stabilized wire bonded electrical connections and method of making...

Lead member with multiple conductive layers and specific grain size

Low phosphorus containing band-shaped and/or filamentary material

3443914

3136032

3006067

2964831

Patents Applicationslast 30 patents

STRAIGHT WIREBONDING OF SILICON DIES

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

WIRE BONDING SYSTEMS AND RELATED METHODS

BONDING WIRE FOR SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

RELIABLE WIRE STRUCTURE AND METHOD

RELIABLE WIRE STRUCTURE AND METHOD

Electronic device, relay member, and mounting substrate, and method...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Bonding Wire and Integrated Circuit Device Using the Same

Bonding wire and an integrated circuit device using the same

Self-healing polymer compositions

Stabilized wire bonded electrical connections and method of making...