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3069531
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Information
Patent Grant
3069531
References
Source
Patent Number
3,069,531
Date Filed
Not available
Date Issued
Tuesday, December 18, 1962
62 years ago
CPC
H01L21/67126 - Apparatus for sealing, encapsulating, glassing, decapsulating or the like
H01J5/20 - Seals between parts of vessels
H01J5/26 - between insulating and conductive parts of vessel
H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/67121 - Apparatus for making assemblies not otherwise provided for
H01L23/041 - the container being a hollow construction having no base used as a mounting for the semiconductor body
H01L24/80 - Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
H05K13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H01J2893/0037 - Solid sealing members other than lamp bases
H01J2893/0043 - Glass-to-metal or quartz-to-metal
H01L2924/01005 - Boron [B]
H01L2924/01023 - Vanadium [V]
H01L2924/01033 - Arsenic [As]
H01L2924/01068 - Erbium [Er]
H01L2924/01074 - Tungsten [W]
H01L2924/01075 - Rhenium [Re]
H01L2924/01079 - Gold [Au]
H01L2924/01082 - Lead [Pb]
H01L2924/014 - Solder alloys
H01L2924/12043 - Photo diode
Y10T29/53483 - and magnetic work-holder or positioner
US Classifications
219 - Electric heating
029 - Metal working
257 - Active solid-state devices
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