3125906

Information

• Patent Grant
• 3125906

• References
• Source

• Patent Number

  3,125,906

• Date Filed

  Not available

• Date Issued

  Tuesday, March 24, 1964
  60 years ago

• CPC

  • H01L24/85 - using a wire connector
  • B23K20/007 - Ball bonding
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L2224/45015 - being circular
  • H01L2224/45144 - Gold (Au) as principal constituent
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/78301 - Capillary
  • H01L2224/85 - using a wire connector
  • H01L2224/85203 - Thermocompression bonding
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • Y10S228/902 - using flame
  • Y10S228/904 - Wire bonding
  • Y10T74/20012 - Multiple controlled elements

• US Classifications

  • 228 - Metal fusion bonding
  • 074 - Machine element or mechanism
  • 242 - Winding, tensioning, or guiding