3181226

Information

• Patent Grant
• 3181226

• References
• Source

• Patent Number

  3,181,226

• Date Filed

  Not available

• Date Issued

  Tuesday, May 4, 1965
  59 years ago

• CPC

  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/24 - Alloying of impurity materials
  • H01L21/48 - Manufacture or treatment of parts
  • H01L23/02 - Containers Seals
  • H01L23/14 - characterised by the material or its electrical properties
  • H01L24/00 - Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L2924/12036 - PN diode
  • Y10S438/915 - Amphoteric doping

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices