3535775

Information

• Patent Grant
• 3535775

• References
• Source

• Patent Number

  3,535,775

• Date Filed

  Not available

• Date Issued

  Tuesday, October 27, 1970
  55 years ago

• CPC

  • H01L21/56 - Encapsulations
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/3105 - After-treatment
  • H01L23/291 - Oxides or nitrides or carbides
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S148/026 - Deposition thru hole in mask
  • Y10S148/043 - Dual dielectric
  • Y10S148/051 - Etching
  • Y10S148/106 - Masks, special
  • Y10S148/165 - Transmutation doping
  • Y10S438/942 - Masking
  • Y10T29/49105 - Switch making
  • Y10T29/49139 - by inserting component lead or terminal into base aperture
  • Y10T29/4921 - with bonding
  • Y10T29/4981 - Utilizing transitory attached element or associated separate material

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 029 - Metal working
  • 117 - Single-crystal, oriented-crystal, and epitaxy growth processes
  • 148 - Metal treatment
  • 257 - Active solid-state devices