3588757

Information

• Patent Grant
• 3588757

• References
• Source

• Patent Number

  3,588,757

• Date Filed

  Not available

• Date Issued

  Monday, June 28, 1971
  53 years ago

• CPC

  • H01P3/081 - Micro-striplines
  • H01P3/13 - specially adapted for transmission of the TE01 circular-electric mode
  • H05K1/0237 - High frequency adaptations
  • H05K1/144 - Stacked arrangements of planar printed circuit boards
  • H05K3/42 - Plated through-holes or plated via connections
  • H05K3/44 - Manufacture insulated metal core circuits or other insulated electrically conductive core circuits
  • H05K1/056 - the metal substrate being covered by an organic insulating layer
  • H05K3/427 - initial plating of through-holes in metal-clad substrates
  • H05K2201/0344 - Electroless sublayer
  • H05K2201/0347 - Overplating
  • H05K2201/037 - Hollow conductors, i.e. conductors partially or completely surrounding a void
  • H05K2201/09554 - Via connected to metal substrate
  • H05K2201/1006 - Non-printed filter

• US Classifications

  • 333 - Wave transmission lines and networks
  • 361 - Electricity: electrical systems and devices