3634168

Information

• Patent Grant
• 3634168

• References
• Source

• Patent Number

  3,634,168

• Date Filed

  Not available

• Date Issued

  Tuesday, January 11, 1972
  53 years ago

• CPC

  • H05K3/445 - having insulated holes or insulated via connections through the metal core
  • G11C11/06085 - Multi-aperture structures or multi-magnetic closed circuits, each aperture storing a "bit", realised by rods, plates, grids, waffle-irons,(
  • H05K1/056 - the metal substrate being covered by an organic insulating layer
  • H05K3/181 - by electroless plating
  • H05K3/0023 - by exposure and development of a photosensitive insulating layer
  • H05K3/387 - for electroless plating
  • H05K3/426 - initial plating of through-holes in substrates without metal
  • H05K2201/0195 - Dielectric or adhesive layers comprising a plurality of layers
  • H05K2203/1366 - Spraying coating

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 427 - Coating processes
  • 430 - Radiation imagery chemistry: process, composition, or product thereof