3867759

Information

• Patent Grant
• 3867759

• References
• Source

• Patent Number

  3,867,759

• Date Filed

  Not available

• Date Issued

  Tuesday, February 25, 1975
  50 years ago

• CPC

  • H05K1/142 - Arrangements of planar printed circuit boards in the same plane
  • H05K1/0237 - High frequency adaptations
  • H05K3/4623 - the circuit boards having internal via connections between two or more circuit layers before lamination
  • H05K3/429 - Plated through-holes specially for multilayer circuits
  • H05K3/4614 - the electrical connections between the circuit boards being made during lamination
  • H05K2201/09536 - Buried plated through-holes
  • H05K2201/096 - Vertically aligned vias, holes or stacked vias
  • H05K2201/09963 - Programming circuit by using small elements
  • H05K2201/10303 - Pin-in-hole mounted pins
  • H05K2203/061 - of previously made multilayered subassemblies
  • Y10T29/49126 - Assembling bases

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 333 - Wave transmission lines and networks
  • 361 - Electricity: electrical systems and devices